N/A

-

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

FCVG-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

N/A

-

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

FCSG-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

84 I/O

0 C

+ 85 C

400 kbit

1007 LAB

60

1.2000 V

Tray

M2S010

活跃

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

56520 LE

267 I/O

- 55 C

+ 125 C

1314 kbit

4710 LAB

60

SmartFusion2

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-55 °C

1.2 V

40

1.14 V

125 °C

有

M2S060T-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

BGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e1

有

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

1 Core

256KB

23 mm

23 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

56520 LE

267 I/O

- 55 C

+ 125 C

1314 kbit

4710 LAB

60

SmartFusion2

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-55 °C

1.2 V

40

1.14 V

125 °C

有

M2S060TS-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

BGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e1

有

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

1 Core

256KB

23 mm

23 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

377 I/O

0 C

+ 85 C

1.314 Mbit

64 kB

有

4695 LAB

27

Tray

M2S050

Obsolete

BGA-896

896-FBGA (31x31)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 50K Logic Modules

1 Core

256KB

N/A

-

Details

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

90

RISC

1.2, 1.5, 1.8, 2.5, 3.3 V

1

有

293

Tray

M2S150

活跃

Industrial grade

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

536

1.2 V

CAN/Ethernet/Serial

166MHz

64 KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

32 Bit

Industrial

FPGA - 150K Logic Modules

1 Core

512KB

ARM Cortex-M3

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

40

425

Tray

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

40

1.14 V

85 °C

有

M2S090-1FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

BGA-676

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

60

1.2000 V

1.14 V

1.26 V

267

Tray

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S050T-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

48672

1 Core

256KB

23 mm

23 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

60

233

Tray

M2S010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

无

M2S010-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

176

SMARTFUSION2

100C

Industrial

FCBGA

-40C to 100C

180

86316

65nm

1.26(V)

1.2(V)

无

1.14(V)

-40C

有

86316

表面贴装

180

Tray

M2S090

活跃

FCBGA-325

325-FCBGA (11x13.5)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

325

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

1.2000 V

267

Tray

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

有

M2S090T-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

27

1.2000 V

377

Tray

M2S050

活跃

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

有

M2S050T-FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

FPBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

N/A

-

Details

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

176

180

Tray

M2S090

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

85 °C

有

M2S090T-FCSG325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.78

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

40

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

N/A

-

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

84

273

Tray

M2S150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

无

M2S150TS-FCV484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

无

Tin/Lead (Sn/Pb)

LG-MIN,WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

1 Core

512KB

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

27

377

Tray

M2S050

活跃

FPBGA-896

896-FBGA (31x31)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

N/A

-

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

0.377729 oz

6,060

FPBGA

1.2000 V

1.14 V

209

1.26 V

表面贴装

209

Tray

M2S005

活跃

Industrial grade

FPBGA-484

484-FPBGA (23x23)

微芯片技术

Details

-40 to 100 °C

Tray

SmartFusion2

484

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

Industrial

STD

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Production (Last Updated: 1 month ago)

Details

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

60

233

FLASH

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

85 °C

有

M2S010TS-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.82

64 kB

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

0 °C

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

166 MHz

S-PBGA-B484

233

不合格

1.2 V

OTHER

3.6 V

1.4 V

166MHz

256 kB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

FPGA - 10K Logic Modules

85 °C

12084

1 Core

256KB

2.44 mm

23 mm

23 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

84 I/O

- 40 C

+ 100 C

191 kbit

有

505 LAB

60

0.046530 oz

Tray

M2S005

活跃

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

40

425

Tray

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

40

1.14 V

85 °C

有

M2S090TS-1FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

BGA-676

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

N/A

-

N

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

119

161

Tray

M2S005

活跃

256-LFBGA

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

24

574

Tray

M2S150

活跃

FCBGA-1152

1152-FCBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

N/A

-

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

无

M2S060TS-FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

138

Tray

M2S025

活跃

LFBGA, BGA256,16X16,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

有

M2S025TS-1VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

VFPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

14 mm

14 mm