N/A

-

N

SMD/SMT

80 MHz

-

-

64 kB

6000 LE

204 I/O

0 C

+ 85 C

有

-

60

SmartFusion

1.5000 V

1.425 V

500000

1.575 V

Tray

A2F500

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

A2F500

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

N/A

-

N

SMD/SMT

80 MHz

-

-

64 kB

6000 LE

117 I/O

0 C

+ 85 C

有

-

90

SmartFusion

1.5000 V

1.425 V

500000

1.575 V

Tray

A2F500

活跃

FPBGA-256

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

A2F500

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

N/A

-

Production (Last Updated: 2 months ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

60

267

Tray

M2S025

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

85 °C

有

M2S025TS-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

23 mm

23 mm

N/A

-

100 MHz

-

-

64 kB

2000 LE

有

-

176

SmartFusion

MCU - 31, FPGA - 78

Tray

A2F200

活跃

TFBGA, BGA288,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA288,21X21,20

1.5 V

未说明

1.425 V

85 °C

无

A2F200M3F-1CS288

100 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

微芯片技术

N

0°C ~ 85°C (TJ)

Tray

A2F200

e0

锡铅银

8542.39.00.01

CMOS

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

现场可编程门阵列

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

11 mm

11 mm

N/A

-

Details

100 MHz

-

-

64 kB

6000 LE

有

-

176

SmartFusion

MCU - 31, FPGA - 78

Tray

A2F500

活跃

288-TFBGA, CSPBGA

288-CSP (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

A2F500

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

90

2.5, 3.3 V

1.14 V

1.26 V

195

Tray

M2S010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

有

M2S010T-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

1.2000 V

267

Tray

M2S090

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

N/A

-

N

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

117 I/O

0 C

+ 85 C

有

-

90

SmartFusion

1.5000 V

1.425 V

1.575 V

Tray

A2F500

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

30

1.425 V

85 °C

无

A2F500M3G-1FG256

100 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

A2F500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

66

不合格

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

11520 CLBS, 500000 GATES

1.7 mm

现场可编程门阵列

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

无

M2S060-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

N/A

-

N

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

113 I/O

- 40 C

+ 100 C

有

-

24

SmartFusion

0.183425 oz

Tray

A2F500M3G

Obsolete

208-BFQFP

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

A2F500

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

60

267

Tray

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

1.14 V

有

M2S050T-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

40

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

377 I/O

0 C

+ 85 C

有

4695 LAB

27

1.2000 V

Tray

M2S050

活跃

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

85 °C

有

M2S050T-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

2.31

FPBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

209 I/O

0 C

+ 85 C

191 kbit

有

505 LAB

60

1.2000 V

Tray

M2S005

活跃

,

40

有

M2S005S-1FGG484T2

活跃

MICROSEMI CORP

5.81

BGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e1

有

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

1

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

60

1.2000 V

267

Tray

M2S025

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

90

195

Tray

M2S010

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

85 °C

有

M2S010-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

90

207

Tray

M2S050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

有

M2S050-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

17 mm

17 mm

N/A

-

N

80 MHz

-

-

64 kB

6000 LE

有

-

176

SmartFusion

MCU - 31, FPGA - 78

Tray

A2F500

活跃

288-TFBGA, CSPBGA

288-CSP (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

A2F500

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

171 I/O

0 C

+ 85 C

191 kbit

有

505 LAB

90

0.652216 oz

1.2000 V

Tray

M2S005

活跃

BGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Production (Last Updated: 1 month ago)

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

119

138

Tray

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

无

M2S010TS-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

有

M2S060T-1FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.82

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

N/A

-

SMD/SMT

100 MHz

-

-

64 kB

2000 LE

161 I/O

- 40 C

+ 100 C

有

-

60

SmartFusion

Tray

A2F200

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

N

-40°C ~ 100°C (TJ)

Tray

A2F200

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

1 Core

256KB

N/A

-

N

100 MHz

-

-

64 kB

6000 LE

有

-

176

SmartFusion

MCU - 31, FPGA - 78

Tray

A2F500

活跃

TFBGA, BGA288,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA288,21X21,20

1.5 V

未说明

1.425 V

85 °C

无

A2F500M3G-1CS288

100 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

A2F500

e0

锡铅银

8542.39.00.01

CMOS

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

11520 CLBS, 500000 GATES

1.05 mm

现场可编程门阵列

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

11 mm

11 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

90

1.2000 V

1.14 V

1.26 V

207

Tray

M2S025

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S025-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

27

377

Tray

M2S050

活跃

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

85 °C

有

M2S050-1FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.26

FPBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

676-BGA

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB