N/A

-

A3P1000

Tray

177

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

40

1.14 V

85 °C

有

A3P1000L-FGG256I

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.38

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

活跃

-40°C ~ 100°C (TJ)

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

1.14 V

1.26 V

620

Tray

A3PE3000

活跃

Compliant

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

70 °C

无

A3PE3000L-FG896

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

1.2000 V

0 to 70 °C

ProASIC3L

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.2 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

34

Compliant

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

4.5 V

85 °C

有

A1020B-PLG44I

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.79

表面贴装

YES

44

44

8542390000/8542390000/8542390000/8542390000/8542390000

e3

Tin (Sn)

85 °C

-40 °C

MAX 34 I/OS

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

compliant

48 MHz

S-PQCC-J44

不合格

5 V

INDUSTRIAL

5.5 V

4.5 V

4.5 ns

547 CLBS, 2000 GATES

4.445 mm

现场可编程门阵列

547

2000

547

273

4.5 ns

547

2000

16.51 mm

16.51 mm

无

N/A

-

N/A

-

UL

Cutler Hammer, Div of Eaton Corp

Panel

154

Tray

M1A3P1000

Obsolete

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

FDC3175L

-55°C ~ 125°C (TJ)

ProASIC3

1.425V ~ 1.575V

175 A

147456

1000000

N/A

-

Tray

A54SX16A

Obsolete

表面贴装

100-LQFP

100-TQFP (14x14)

微芯片技术

81

-40°C ~ 125°C (TA)

SX-A

2.25V ~ 5.25V

24000

1452

N/A

-

113

Tray

A54SX08A

Obsolete

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

2.5 V

30

2.25 V

85 °C

无

A54SX08A-1TQ144I

278 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.25

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

Non-Compliant

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

INDUSTRIAL

113

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.1 ns

768

768

12000

20 mm

20 mm

N/A

-

72

Compliant

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

5 V

40

4.75 V

70 °C

有

A1280A-PLG84C

50 MHz

QCCJ

SQUARE

Obsolete

MICROSEMI CORP

5.25 V

5.8

表面贴装

YES

84

84

Miscellaneous

e3

Tin (Sn)

70 °C

0 °C

MAX 72 I/OS

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

unknown

75 MHz

S-PQCC-J84

不合格

5 V

COMMERCIAL

5.25 V

4.75 V

5 ns

1232 CLBS, 8000 GATES

4.45 mm

现场可编程门阵列

1232

8000

1232

998

5 ns

1232

8000

29.21 mm

29.21 mm

无

N/A

-

Miscellaneous

34

Tray

A3PN030

活跃

HQCCN,

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

-40 °C

1.5 V

30

1.425 V

85 °C

有

HQCCN

SQUARE

不推荐

MICROSEMI CORP

1.575 V

7.07

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

微芯片技术

SW-05V

-40°C ~ 100°C (TJ)

ProASIC3 nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

现场可编程门阵列

30000

STD

768

30000

6 mm

6 mm

N/A

-

BT15S54551

Dwyer Instruments

5 Inches

N/A

-

Danaher Controls

HS351024G134D

N/A

-

Pepperl Fuchs

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

512 I/O

+ 100 C

1.08 V

9.210472 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF300

活跃

FPGA - Field Programmable Gate Array

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

240789-100003

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

300000

21094400

16 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

Cooper

78101197456

N/A

-

Reliance Electric

300

Tray

活跃

表面贴装

536-LFBGA

536-BGA (16x16)

微芯片技术

P56H319

-55°C ~ 125°C (TJ)

PolarFire™

0.97V ~ 1.08V

300000

21600666

N/A

-

RK73G2B

活跃

84

表面贴装

1206 (3216 Metric)

1206

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RK73G-RT

0.126 L x 0.063 W (3.20mm x 1.60mm)

±0.25%

2

±50ppm/°C

634 kOhms

厚膜

0.25W, 1/4W

1.14V ~ 2.625V

-

12084

933888

Anti-Sulfur, Automotive AEC-Q200

0.028 (0.70mm)

AEC-Q200

N/A

-

活跃

1.2, 1.5 V

1.14 V

1.575 V

120

AGLP030

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA289,17X17,32

-40 °C

1.5 V

未说明

1.425 V

85 °C

有

AGLP030V2-CSG289I

160 MHz

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

表面贴装

4-SMD, No Lead

YES

289-CSP (14x14)

289

Suntsu Electronics, Inc.

Bulk

-30°C ~ 85°C

SXT224

0.098 L x 0.079 W (2.50mm x 2.00mm)

兆赫晶体

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

compliant

12 MHz

±20ppm

S-PBGA-B289

120

不合格

120 Ohms

1.2/1.5 V

INDUSTRIAL

12pF

Fundamental

±15ppm

120

792 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

792

30000

STD

792

792

30000

0.026 (0.65mm)

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

Bulk

Metal

CA310

活跃

Gold

267

有

27696 LE

+ 85 C

1.26 V

0 C

60

1.14 V

SMD/SMT

Microchip

Microchip Technology / Atmel

IGLOO2

Details

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL025-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

138 kB

FPGA - Field Programmable Gate Array

Free Hanging (In-Line)

484-BGA

YES

-

484

铝合金

484-FPBGA (23x23)

484

ITT Cannon, LLC

50V

-55°C ~ 125°C

Tray

MIL-DTL-5015, CA-B

焊杯

Plug, Male Pins

14

85 °C

0 °C

橄榄色

8542.39.00.01

反向卡口锁

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

N (Normal)

BALL

-

260

IP67 - Dust Tight, Waterproof

1 mm

compliant

22A

橄榄色镉

22-19

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

256 kB

-

667 Mb/s

267

2.44 mm

现场可编程门阵列

27696

1130496

400 MHz

34

STD

4 Transceiver

27696

-

FPGA - Field Programmable Gate Array

23 mm

23 mm

19.7µin (0.50µm)

N/A

-

41

Tray

EX64

Obsolete

TQFP-64

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

30

2.3 V

70 °C

无

EX64-FTQ64

178 MHz

LFQFP

SQUARE

Obsolete

MICROSEMI CORP

2.7 V

5.61

表面贴装

64-LQFP

YES

64-TQFP (10x10)

64

微芯片技术

Miscellaneous

0°C ~ 70°C (TA)

EX

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G64

COMMERCIAL

3000 GATES

1.6 mm

现场可编程门阵列

128

3000

1.4 ns

3000

10 mm

10 mm

N/A

-

ABB

115

Tray

AX500

Obsolete

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

ACH580-BCR-361A-4+B056+K465

-40°C ~ 85°C (TA)

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

N/A

-

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

-55 °C

1.2 V

30

1.14 V

125 °C

有

M2GL150T-1FCG1152M

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.26

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

574

-55°C ~ 125°C (TJ)

IGLOO2

3A001.A.2.C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

MILITARY

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

Compliant

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

70 °C

有

M1AGLE3000V2-FGG896

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

表面贴装

YES

896

400.011771 mg

896

620

e1

锡银铜

70 °C

0 °C

8542.39.00.01

CMOS

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.14 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

3e+06

892.86 MHz

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-1VF400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

207

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

70 °C

有

M7AFS600-1PQG208

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.8

YES

208

FQFP,

e3

哑光锡

8542.39.00.01

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

600000 GATES

4.1 mm

现场可编程门阵列

600000

28 mm

28 mm

N/A

-

FLATPACK

3

PLASTIC/EPOXY

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

QFF

M1AFS250-PQG208

有

85 °C

1.425 V

40

1.5 V

YES

208

QFF,

e3

哑光锡

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

57

Tray

A40MX04

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX04-2PL68I

101 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

LCC

表面贴装

68-LCC (J-Lead)

YES

68-PLCC (24.23x24.23)

68

微芯片技术

Non-Compliant

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

68

S-PQCC-J68

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

24.2316 mm

24.2316 mm