制造商是'Microchip'
Microchip 嵌入式 - FPGA(现场可编程门阵列)
(5152)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | A40MX02-1PQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 57 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 160 MHz | 有 | 66 | Actel | 0.062040 oz | Tray | A40MX02 | 活跃 | 5.5 V | ROHS COMPLIANT, PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A40MX02-1PQG100I | 92 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tray | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 295 CLBS, 3000 GATES | 3.4 mm | 现场可编程门阵列 | 3000 | 2.3 ns | 295 | 3000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-1FGG676I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | Details | 418 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 763 MHz | 有 | 40 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | -40 °C | 1.5 V | 40 | 85 °C | 有 | AX1000-1FGG676I | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 85°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B676 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763 MHz | 18144 | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||||
![]() | A54SX72A-FFG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 360 I/O | 2.25 V | 0 C | + 70 C | SMD/SMT | 156 MHz | 有 | 40 | Actel | 0.014110 oz | 2.75 V | Tray | A54SX72 | 活跃 | BGA, BGA484,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,26X26,40 | 2.5 V | 30 | 70 °C | 无 | A54SX72A-FFG484 | 156 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 表面贴装 | FBGA | YES | 484-FPBGA (27X27) | 484 | 微芯片技术 | N | 0°C ~ 70°C (TA) | Tray | A54SX72A | e0 | 锡铅 | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 360 | 不合格 | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 360 | 6036 CLBS, 108000 GATES | 2.44 mm | 现场可编程门阵列 | 108000 | 6036 | 2 ns | 6036 | 6036 | 108000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-2PLG84 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 72 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 269 MHz | 有 | 16 | Actel | 0.239083 oz | 5.25 V | Tray | A42MX09 | 活跃 | ROHS COMPLIANT, PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX09-2PLG84 | 146 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tube | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 684 CLBS, 14000 GATES | 4.572 mm | 现场可编程门阵列 | 14000 | 1.8 ns | 684 | 14000 | 3.68 mm | 29.31 mm | 29.31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-2PLG44I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 34 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 175 MHz | 有 | 27 | Actel | 0.084185 oz | 5.5 V | Tray | A40MX04 | 活跃 | ROHS COMPLIANT, PLASTIC, LCC-44 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A40MX04-2PLG44I | 101 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | PLCC-44 | YES | 44-PLCC (16.59x16.59) | 44 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J44 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 2 ns | 547 | 6000 | 3.68 mm | 16.59 mm | 16.59 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1TQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 81 I/O | 2.25 V | - 40 C | + 85 C | SMD/SMT | 278 MHz | 有 | 90 | Actel | 0.023175 oz | Tray | A54SX32 | 活跃 | 2.75 V | LFQFP, QFP100,.63SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP100,.63SQ,20 | -40 °C | 2.5 V | 40 | 85 °C | 有 | A54SX32A-1TQG100I | 278 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 表面贴装 | TQFP-100 | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tray | A54SX32A | e3 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 81 | 不合格 | 2.5 V | 2.5,2.5/5 V | INDUSTRIAL | 81 | 2880 CLBS, 48000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-1PLG84 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 69 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 160 MHz | 有 | 16 | Actel | 0.239083 oz | 5.25 V | Tray | A40MX04 | 活跃 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A40MX04-1PLG84 | 48 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 2.3 ns | 547 | 6000 | 3.68 mm | 29.31 mm | 29.31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-3TQG176I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | 140 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 237 MHz | 有 | 40 | Actel | 5.5 V | Tray | A42MX16 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX16-3TQG176I | 129 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | 表面贴装 | TQFP-176 | YES | 176 | 176-TQFP (24x24) | 176 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 608 | 24000 | 237 MHz | 608 | 3 | 928 | 1.9 ns | 1232 | 24000 | 1.4 mm | 24 mm | 24 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1BGG329M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 249 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 278 MHz | 有 | 27 | Actel | 2.75 V | Tray | A54SX32 | 活跃 | 表面贴装 | BGA-329 | 329-PBGA (31x31) | 微芯片技术 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TC) | Tray | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | 1.8 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-1VQG80 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 69 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 160 MHz | 有 | 90 | Actel | Tray | A40MX04 | 活跃 | 5.25 V | TQFP, | FLATPACK, THIN PROFILE | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A40MX04-1VQG80 | 48 MHz | TQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | VQFP | YES | 80-VQFP (14x14) | 80 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.65 mm | compliant | S-PQFP-G80 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 547 CLBS, 6000 GATES | 1.2 mm | 现场可编程门阵列 | 6000 | 2.3 ns | 547 | 6000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-2PLG84I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 72 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 269 MHz | 有 | 16 | Actel | 0.239083 oz | 5.5 V | Tray | A42MX09 | 活跃 | ROHS COMPLIANT, PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX09-2PLG84I | 146 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tube | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 684 CLBS, 14000 GATES | 4.572 mm | 现场可编程门阵列 | 14000 | 1.8 ns | 684 | 14000 | 3.68 mm | 29.31 mm | 29.31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-FPLG68 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 295 LE | 57 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 83 MHz | 有 | - | 19 | Actel | 0.171777 oz | 3.3, 5 V | 3 V | 5.25 V | 40MX | 70C | Commercial | PLCC | 3000 | 0C to 70C | 57 | 3000 | 295 | 0.45UM | 5.25(V) | 3.3/5(V) | 无 | 3(V) | 0C | 有 | 295 | 147 | 表面贴装 | 5.25 V | Tray | A40MX02 | 活跃 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 未说明 | 70 °C | 有 | A40MX02-FPLG68 | 48 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 1.37 | 表面贴装 | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | Details | 0 to 70 °C | Tube | A40MX02 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 未说明 | 1.27 mm | compliant | 50/83(MHz) | 68 | S-PQCC-J68 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | F | 3.7 ns | 295 | 3000 | 3.68 mm | 24.23 mm | 24.23 mm | |||||||||||||||||||||||||||||||||
![]() | APA150-FGG256A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 186 I/O | 2.375 V | - 40 C | + 125 C | SMD/SMT | 180 MHz | 有 | 90 | Actel | 0.014110 oz | 2.625 V | Tray | APA150 | 活跃 | 表面贴装 | FBGA | 256-FPBGA (17x17) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 125°C (TJ) | Tray | APA150 | 2.375V ~ 2.625V | 2.5 V | 36864 | 150000 | STD | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-TQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1800 LE | 81 I/O | 2.25 V | - 40 C | + 85 C | SMD/SMT | 有 | 2880 LAB | 90 | Actel | 0.023175 oz | 2.5000 V | 2.25 V | 2.75 V | SX-A | 85C | Industrial | TQFP | 48000 | -40C to 85C | 81 | 32000 | 2880 | 0.25um | 2.75(V) | 2.5(V) | 无 | 2.25(V) | -40C | 有 | 1800 | 1980 | 表面贴装 | 5.25 V | Tray | A54SX32 | 活跃 | 表面贴装 | TQFP-100 | 100-TQFP (14x14) | 微芯片技术 | Details | -40 to 85 °C | Tray | A54SX32A | 2.25V ~ 5.25V | 238(MHz) | 100 | 2.25 V to 5.25 V | - | 48000 | 2880 | STD | - | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-3PQG208I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | 140 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 237 MHz | 有 | 24 | Actel | Tray | A42MX16 | 活跃 | 5.5 V | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX16-3PQG208I | 129 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | 表面贴装 | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 608 | 24000 | 237 MHz | 608 | 3 | 928 | 1.9 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-1PLG84I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 69 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 160 MHz | 有 | 16 | Actel | 0.239083 oz | 5.5 V | Tray | A40MX04 | 活跃 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A40MX04-1PLG84I | 48 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 2.3 ns | 547 | 6000 | 3.68 mm | 29.31 mm | 29.31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA1000-FGG896A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 1 month ago) | Details | 642 I/O | 2.375 V | - 40 C | + 125 C | SMD/SMT | 180 MHz | 有 | 27 | Actel | 0.014110 oz | 2.625 V | Tray | APA1000 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 有 | APA1000-FGG896A | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.61 | 表面贴装 | 表面贴装 | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 125°C (TJ) | Tray | APA1000 | 125 °C | -40 °C | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B896 | 642 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | 2.625 V | 2.375 V | 24.8 kB | 642 | 现场可编程门阵列 | 202752 | 1000000 | 180 MHz | 56320 | 56320 | 1.73 mm | 31 mm | 31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-3PQG160 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 101 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 296 MHz | 有 | 24 | Actel | 0.196363 oz | 5.25 V | Tray | A42MX09 | 活跃 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX09-3PQG160 | 161 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | PQFP-160 | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | 1.6 ns | 684 | 14000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-TQG176 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 140 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 有 | 40 | Actel | 0.672424 oz | 42MX | 70C | COMMERCIALC | TQFP | 24000 | 0C to 70C | 140 | 24000 | 608 | 0.45UM | 5.25(V) | 3.3/5(V) | 无 | 3(V) | 0C | 有 | 608 | 928 | 表面贴装 | 5.25 V | Tray | A42MX16 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-TQG176 | 94 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.55 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 103/172(MHz) | 176 | S-PQFP-G176 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 24000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||
![]() | A3PE1500-FG676I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | N | 444 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 231 MHz | 有 | 40 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/85 | 1.575 V | Tray | A3PE1500 | 活跃 | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | -40 °C | 1.5 V | 30 | 85 °C | 无 | A3PE1500-FG676I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | Lead, Tin | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40 to 85 °C | Tray | A3PE1500 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B676 | 444 | 不合格 | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | 无 | ||||||||||||||||||||||||||||||||||
![]() | A42MX16-1PQG160M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 125 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 198 MHz | 有 | 24 | Actel | 0.196363 oz | 5.5 V | Tray | A42MX16 | 活跃 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | 125 °C | 有 | A42MX16-1PQG160M | 108 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | PQFP-160 | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TC) | Tray | A42MX16 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | 3.3 V, 5 V | MILITARY | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA600-FGG484A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | Details | 370 I/O | 2.375 V | - 40 C | + 125 C | SMD/SMT | 180 MHz | 有 | 60 | Actel | 0.014110 oz | 2.625 V | Tray | APA600 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 有 | APA600-FGG484A | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.61 | 表面贴装 | 表面贴装 | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 125°C (TJ) | Tray | APA600 | 125 °C | -40 °C | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 370 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | 2.625 V | 2.375 V | 15.8 kB | 370 | 现场可编程门阵列 | 129024 | 600000 | 180 MHz | STD | 21504 | 21504 | 1.73 mm | 23 mm | 23 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-TQG100M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 81 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 238 MHz | 有 | 90 | Actel | 0.023175 oz | Tray | A54SX32 | 活跃 | 2.75 V | 表面贴装 | TQFP-100 | 100-TQFP (14x14) | 微芯片技术 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TC) | Tray | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-3TQG176I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 104 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 296 MHz | 有 | 40 | Actel | Tray | A42MX09 | 活跃 | 5.5 V | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX09-3TQG176I | 161 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 684 CLBS, 14000 GATES | 1.6 mm | 现场可编程门阵列 | 14000 | 1.6 ns | 684 | 14000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-PQG160A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 101 I/O | 4.75 V | - 40 C | + 125 C | SMD/SMT | 192 MHz | 有 | 24 | Actel | 0.196363 oz | Tray | A42MX09 | 活跃 | 5.25 V | QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 40 | 125 °C | 有 | A42MX09-PQG160A | 174 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.6 | 表面贴装 | PQFP-160 | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | Details | -40°C ~ 125°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5.0V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | 5 V | AUTOMOTIVE | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | STD | 2 ns | 684 | 14000 | 3.4 mm | 28 mm | 28 mm |