制造商是'Microchip'
Microchip 晶体管 - FET,MOSFET - 阵列
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图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 晶体管元件材料 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 温度系数 | 类型 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 功率(瓦特) | 附加功能 | 子类别 | 最大功率耗散 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | 参考标准 | JESD-30代码 | 资历状况 | 失败率 | 配置 | 通道数量 | 电压 | 元素配置 | 电流 | 操作模式 | 功率耗散 | 箱体转运 | 接通延迟时间 | 功率 - 最大 | 场效应管类型 | 晶体管应用 | Rds On(Max)@Id,Vgs | 不同 Id 时 Vgs(th)(最大值) | 输入电容(Ciss)(Max)@Vds | 门极电荷(Qg)(最大)@Vgs | 上升时间 | 漏源电压 (Vdss) | 极性/通道类型 | 下降时间(典型值) | 产品类别 | 连续放电电流(ID) | 阈值电压 | 栅极至源极电压(Vgs) | 最大漏极电流 (Abs) (ID) | 漏极-源极导通最大电阻 | 筛选水平 | 漏源击穿电压 | 脉冲漏极电流-最大值(IDM) | 输入电容 | DS 击穿电压-最小值 | 雪崩能量等级(Eas) | 场效应管技术 | 最大耗散功率(Abs) | 场效应管特性 | 最大rds | 产品 | 特征 | Vf-正向电压 | 产品类别 | 产品长度(mm) | 高度 | 座位高度(最大) | 长度 | 宽度 | 产品高度(mm) | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||||||||
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![]() | TC6320TG-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 20 ns | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 84.99187mg | SILICON | 2 | -55°C~150°C TJ | Tape & Reel (TR) | 2010 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | DUAL | 鸥翼 | 260 | 40 | TC6320 | 2 | 增强型MOSFET | 10 ns | N and P-Channel | SWITCHING | 7 Ω @ 1A, 10V | 2V @ 1mA | 110pF @ 25V | 15ns | N-CHANNEL AND P-CHANNEL | 15 ns | -2A | 2V | 7Ohm | 200V | METAL-OXIDE SEMICONDUCTOR | Standard | 1.65mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC6320K6-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 20 ns | Tin | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | 37.393021mg | SILICON | 2 | -55°C~150°C TJ | Tape & Reel (TR) | 2013 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | DUAL | 260 | 40 | TC6320 | 2 | 增强型MOSFET | 10 ns | N and P-Channel | SWITCHING | 7 Ω @ 1A, 10V | 2V @ 1mA | 110pF @ 25V | 15ns | N-CHANNEL AND P-CHANNEL | 15 ns | 5.2A | 7Ohm | 200V | METAL-OXIDE SEMICONDUCTOR | Standard | 1.37mm | 4.89mm | 3.91mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC8020K6-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 20 ns | Tin | 表面贴装 | 表面贴装 | 56-VFQFN Exposed Pad | 56 | 191.387631mg | SILICON | 6 | -55°C~150°C TJ | Tray | 2012 | e4 | 活跃 | 3 (168 Hours) | 56 | EAR99 | 镍钯金 | QUAD | 260 | 40 | COMPLEX | 12 | 增强型MOSFET | 10 ns | 6 N and 6 P-Channel | SWITCHING | 8 Ω @ 1A, 10V | 2.4V @ 1mA | 50pF @ 25V | 15ns | 200V | N-CHANNEL AND P-CHANNEL | 15 ns | 8Ohm | -200V | METAL-OXIDE SEMICONDUCTOR | Standard | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DN2625DK6-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 10 ns | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 37.393021mg | SILICON | 1 | -55°C~150°C TJ | Tray | 2013 | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 3.5Ohm | 哑光锡 | 低阈值 | 无铅 | 260 | 40 | R-PDSO-N8 | 不合格 | 2 | 250V | Dual | 11A | DRAIN | 10 ns | 2 N-Channel (Dual) | SWITCHING | 3.5 Ω @ 1A, 0V | 1000pF @ 25V | 7.04nC @ 1.5V | 20ns | 20 ns | 1.1A | 20V | METAL-OXIDE SEMICONDUCTOR | 耗尽模式 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC8220K6-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 表面贴装 | 12-VFDFN Exposed Pad | 12 | SILICON | 4 | -55°C~150°C TJ | Tape & Reel (TR) | 2013 | e4 | 活跃 | 2 (1 Year) | 12 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | LOGIC LEVEL COMPATIBLE, LOW THRESHOLD | DUAL | 无铅 | 260 | 40 | 不合格 | SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR | 增强型MOSFET | 2 N and 2 P-Channel | SWITCHING | 6 Ω @ 1A, 10V | 2.4V @ 1mA | 56pF @ 25V | 200V | N-CHANNEL AND P-CHANNEL | 7Ohm | 200V | METAL-OXIDE SEMICONDUCTOR | Standard | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TD9944TG-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 20 ns | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 84.99187mg | SILICON | 2 | -55°C~150°C TJ | Tape & Reel (TR) | 2013 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 低阈值 | 鸥翼 | 260 | 40 | 不合格 | SINGLE WITH BUILT-IN DIODE | 2 | 增强型MOSFET | 10 ns | 2 N-Channel (Dual) | SWITCHING | 6 Ω @ 500mA, 10V | 2V @ 1mA | 125pF @ 25V | 10ns | 10 ns | 1A | 20V | 6Ohm | 240V | METAL-OXIDE SEMICONDUCTOR | Standard | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC7920K6-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 20 ns | Tin | 表面贴装 | 表面贴装 | 12-VFDFN Exposed Pad | 12 | SILICON | 4 | -55°C~150°C TJ | Tape & Reel (TR) | 2004 | e4 | 活跃 | 1 (Unlimited) | 12 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | LOGIC LEVEL COMPATIBLE, LOW THRESHOLD | DUAL | 无铅 | 260 | 40 | 不合格 | SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR | 增强型MOSFET | 10 ns | 2 N and 2 P-Channel | SWITCHING | 10 Ω @ 1A, 10V | 2.4V @ 1mA | 52pF @ 25V | 15ns | 200V | N-CHANNEL AND P-CHANNEL | 15 ns | 7Ohm | 200V | METAL-OXIDE SEMICONDUCTOR | Standard | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC2320TG-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 20 ns | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 84.99187mg | SILICON | 2 | -55°C~150°C TJ | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 低阈值 | DUAL | 鸥翼 | 260 | 40 | 2 | 增强型MOSFET | 10 ns | N and P-Channel | SWITCHING | 7 Ω @ 1A, 10V | 2V @ 1mA | 110pF @ 25V | 15ns | N-CHANNEL AND P-CHANNEL | 15 ns | 2A | 20V | 7Ohm | 200V | METAL-OXIDE SEMICONDUCTOR | Standard | 1.65mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC6215TG-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 17.2 ns | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 84.99187mg | SILICON | 2 | -55°C~150°C TJ | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 鸥翼 | 260 | 40 | TC621 | 不合格 | 2 | Dual | 增强型MOSFET | 2.5 ns | N and P-Channel | SWITCHING | 4 Ω @ 2A, 10V | 2V @ 1mA | 120pF @ 25V | 2.3ns | 150V | N-CHANNEL AND P-CHANNEL | 11.3 ns | 36A | 20V | 5Ohm | -150V | METAL-OXIDE SEMICONDUCTOR | Standard | 1.65mm | 4.9mm | 3.8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC1550TG-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 15 ns | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 84.99187mg | SILICON | 2 | -55°C~150°C TJ | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 快速开关 | 鸥翼 | 260 | 40 | 不合格 | 2 | Dual | 增强型MOSFET | 10 ns | N and P-Channel | AMPLIFIER | 60 Ω @ 50mA, 10V | 4V @ 1mA | 55pF @ 25V | 10ns | N-CHANNEL AND P-CHANNEL | 10 ns | 16A | 20V | 350A | 500V | METAL-OXIDE SEMICONDUCTOR | Standard | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC6321T-V/9U | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 2A Ta | 表面贴装 | 8-VDFN Exposed Pad | YES | SILICON | 2 | -55°C~175°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 8 | DUAL | 无铅 | TS 16949 | R-PDSO-N8 | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR | 增强型MOSFET | DRAIN | N and P-Channel | SWITCHING | 7 Ω @ 1A, 10V, 8 Ω @ 1A, 10V | 2V @ 1mA, 2.4V @ 1mA | 110pF @ 25V 200pF @ 25V | 200V | N-CHANNEL AND P-CHANNEL | 7Ohm | 200V | METAL-OXIDE SEMICONDUCTOR | 逻辑电平门 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC8020K6-G-M937 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 20 ns | 表面贴装 | 表面贴装 | 56-VFQFN Exposed Pad | 191.387631mg | SILICON | 6 | -55°C~150°C TJ | Tape & Reel (TR) | 2012 | yes | 活跃 | 3 (168 Hours) | 56 | QUAD | 无铅 | COMPLEX | 12 | 增强型MOSFET | 10 ns | 6 N and 6 P-Channel | SWITCHING | 8 Ω @ 1A, 10V | 2.4V @ 1mA | 50pF @ 25V | 15ns | 200V | N-CHANNEL AND P-CHANNEL | 15 ns | 3.2A | 8Ohm | 200V | METAL-OXIDE SEMICONDUCTOR | Standard | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSCSM70VM10C4AG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 238A (Tc) | MSCSM70 | 700 V | 700 V | 40 ns | 1.9 V | 674 W | N-Channel | + 125 C | - 10 V, 25 V | - 40 C | 1 | 螺钉安装 | Microchip | Microchip Technology / Atmel | 9.5 mOhms | Details | 50 ns | 238 A | Discrete Semiconductor Modules | 底座安装 | Module | SP4 | 微芯片技术 | Tube | -40°C ~ 175°C (TJ) | Bulk | - | Phase Leg | Discrete Semiconductor Modules | SiC | 674W (Tc) | 2 N Channel (Phase Leg) | 9.5mOhm @ 80A, 20V | 2.4V @ 8mA | 9000pF @ 700V | 430nC @ 20V | 35 ns | 700V | Silicon Carbide (SiC) | 功率MOSFET模块 | 1.5 V at 100 A | Discrete Semiconductor Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSCSM70AM025CD3AG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 538A (Tc) | MSCSM70 | 700 V | 700 V | N-Channel | + 125 C | - 10 V, + 25 V | - 40 C | 1 | 螺钉安装 | Microchip | Microchip Technology / Atmel | 2.5 mOhms | Details | 538 A | Discrete Semiconductor Modules | 底座安装 | Module | D3 | 微芯片技术 | Box | - | Bulk | - | Phase Leg | Discrete Semiconductor Modules | SiC | - | - | - | - | - | - | 700V | - | 功率MOSFET模块 | 1.5 V | Discrete Semiconductor Modules | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSCSM120AM50CT1AG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 55A (Tc) | MSCSM120 | 1200 V | 1200 V | 30 ns | 1.8 V | 245 W | N-Channel | + 125 C | - 10 V, + 25 V | - 40 C | 1 | 螺钉安装 | Microchip | Microchip Technology / Atmel | 50 mOhms | Details | 50 ns | 55 A | Discrete Semiconductor Modules | 底座安装 | Module | SP1F | 微芯片技术 | Tube | -40°C ~ 175°C (TJ) | Bulk | - | Phase Leg | Discrete Semiconductor Modules | SiC | 245W (Tc) | 2 N Channel (Phase Leg) | 50mOhm @ 40A, 20V | 2.7V @ 1mA | 1990pF @ 1000V | 137nC @ 20V | 30 ns | 1200V (1.2kV) | Silicon Carbide (SiC) | 功率MOSFET模块 | 1.5 V at 15 A | Discrete Semiconductor Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSCSM70AM10CT3AG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 241A (Tc) | MSCSM70 | 700 V | 700 V | 40 ns | 1.9 V | 690 W | N-Channel | + 125 C | - 10 V, 25 V | - 40 C | 1 | 螺钉安装 | Microchip | Microchip Technology / Atmel | 9.5 mOhms | Details | 50 ns | 241 A | Discrete Semiconductor Modules | 底座安装 | Module | SP3F | 微芯片技术 | Tube | -40°C ~ 175°C (TJ) | Bulk | - | Phase Leg | Discrete Semiconductor Modules | SiC | 690W (Tc) | 2 N Channel (Phase Leg) | 9.5mOhm @ 80A, 20V | 2.4V @ 8mA | 9000pF @ 700V | 430nC @ 20V | 35 ns | 700V | Silicon Carbide (SiC) | 功率MOSFET模块 | 1.5 V at 100 A | Discrete Semiconductor Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSCC60AM23C4AG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MSCC60 | 81A (Tc) | 活跃 | 600 V | 1 | 螺钉安装 | Microchip | Microchip Technology / Atmel | Details | Discrete Semiconductor Modules | 底座安装 | Module | SP4 | 微芯片技术 | Tube | - | Tube | - | Rectifier Diode Module | Discrete Semiconductor Modules | Si | - | 2 N-Channel | - | - | - | - | 600V | Standard | 功率MOSFET模块 | Discrete Semiconductor Modules | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSCSM70VM19C3AG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 124A (Tc) | MSCSM70 | 700 V | 700 V | 40 ns | 1.9 V | 365 W | N-Channel | + 125 C | - 10 V, + 25 V | - 40 C | 1 | 螺钉安装 | Microchip | 微芯片技术 | 19 mOhms | Details | 50 ns | 124 A | Discrete Semiconductor Modules | 底座安装 | Module | SP3F | 微芯片技术 | Tube | -40°C ~ 175°C (TJ) | Bulk | - | Phase Leg | Discrete Semiconductor Modules | SiC | 365W (Tc) | 2 N Channel (Phase Leg) | 19mOhm @ 40A, 20V | 2.4V @ 4mA | 4500pF @ 700V | 215nC @ 20V | 35 ns | 700V | Silicon Carbide (SiC) | 功率MOSFET模块 | 1.5 V at 50 A | Discrete Semiconductor Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSCM20XM10T3XG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 108A (Tc) | MSCM20 | 200 V | + 125 C | - 40 C | 1 | Microchip | Microchip Technology / Atmel | 10 mOhms | Details | Discrete Semiconductor Modules | 底座安装 | Module | SP3X | 微芯片技术 | Bulk | -40°C ~ 125°C (Tc) | Tube | - | 三相 | Discrete Semiconductor Modules | Si | 3-Phase Bridge | 341W (Tc) | 6 N-Channel (3-Phase Bridge) | 9.7mOhm @ 81A, 10V | 5V @ 250μA | 10700pF @ 50V | 161nC @ 10V | 200V | Standard | 功率MOSFET模块 | Discrete Semiconductor Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSCSM120AM16CT1AG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 173A (Tc) | MSCSM120 | 173 | 1200 V | 1200 V | 30 ns | 1.8 V | 745 W | N-Channel | + 125 C | - 10 V, + 25 V | - 40 C | 1 | 螺钉安装 | Microchip | Microchip Technology / Atmel | 16 mOhms | Details | 50 ns | 173 A | Discrete Semiconductor Modules | 底座安装 | Module | SP1F | 微芯片技术 | Tube | -40°C ~ 175°C (TJ) | Bulk | - | Phase Leg | Discrete Semiconductor Modules | SiC | 745 | 745W (Tc) | 2 N Channel (Phase Leg) | 16mOhm @ 80A, 20V | 2.8V @ 2mA | 6040pF @ 1000V | 464nC @ 20V | 30 ns | 1200V (1.2kV) | Silicon Carbide (SiC) | 功率MOSFET模块 | 1.5 V at 60 A | Discrete Semiconductor Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APTC90DSK12T1G | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40C to 85C | 无 | 2 | Compliant | 400 ns | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.84 | 30 A | APTC90DSK12T1G | 有 | 150 °C | 未说明 | UNSPECIFIED | FLANGE MOUNT | FLANGE MOUNT, R-XUFM-X10 | Industrial grade | Chassis Mount, Screw | CSON | NO | 1 | 10 | SILICON | 5(mm) | EAR99 | 150 °C | -40 °C | AVALANCHE RATED, ULTRA-LOW RESISTANCE | FET 通用电源 | 250 W | UPPER | UNSPECIFIED | 未说明 | compliant | 12 | R-XUFM-X10 | 不合格 | COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR | 增强型MOSFET | 250 W | ISOLATED | 70 ns | SWITCHING | 20 ns | 900 V | N-CHANNEL | 30 A | 20 V | 30 A | 0.12 Ω | INDUSTRIALC | 75 A | 6.8 nF | 900 V | 1940 mJ | METAL-OXIDE SEMICONDUCTOR | 250 W | 120 mΩ | 7(mm) | 1.4(mm) | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APTC80DSK29T3G | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLANGE MOUNT | 1 | UNSPECIFIED | 未说明 | 150 °C | 有 | APTC80DSK29T3G | RECTANGULAR | Microsemi Corporation | 2 | Obsolete | MICROSEMI CORP | 5.62 | 15 A | Axial | NO | Axial | 25 | SILICON | FLANGE MOUNT, R-XUFM-X25 | -65°C ~ 175°C | Tape & Reel (TR) | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | e1 | 活跃 | 2 | ±25ppm/°C | 180 kOhms | 锡银铜 | Metal Film | 0.125W, 1/8W | 雪崩 额定 | UPPER | UNSPECIFIED | 未说明 | unknown | 25 | R-XUFM-X25 | 不合格 | S (0.001%) | COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR | 增强型MOSFET | ISOLATED | SWITCHING | N-CHANNEL | 0.29 Ω | 60 A | 800 V | 670 mJ | METAL-OXIDE SEMICONDUCTOR | Military, Moisture Resistant, Weldable | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APTC80DDA29T3G | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLANGE MOUNT | 1 | UNSPECIFIED | 未说明 | 150 °C | 有 | APTC80DDA29T3G | RECTANGULAR | Microsemi Corporation | 2 | Obsolete | MICROSEMI CORP | 5.62 | 15 A | Axial | NO | Axial | 25 | SILICON | FLANGE MOUNT, R-XUFM-X25 | -65°C ~ 175°C | Bulk | Military, MIL-R-10509/7, RN55 | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±1% | e1 | 活跃 | 2 | ±100ppm/°C | 3.09 Ohms | 锡银铜 | Metal Film | 0.125W, 1/8W | 雪崩 额定 | FET 通用电源 | UPPER | UNSPECIFIED | 未说明 | unknown | 25 | R-XUFM-X25 | 不合格 | -- | COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR | 增强型MOSFET | ISOLATED | SWITCHING | N-CHANNEL | 15 A | 0.29 Ω | 60 A | 800 V | 670 mJ | METAL-OXIDE SEMICONDUCTOR | 156 W | Flame Retardant Coating, Military, Moisture Resistant, Safety | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APTM50DUM17G | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLANGE MOUNT | 1 | UNSPECIFIED | 未说明 | 150 °C | 有 | APTM50DUM17G | RECTANGULAR | Microsemi Corporation | 2 | Obsolete | MICROSEMI CORP | 5.59 | 180 A | NO | 7 | SILICON | FLANGE MOUNT, R-XUFM-X7 | * | e1 | 有 | 活跃 | EAR99 | 锡银铜 | 雪崩 额定 | UPPER | UNSPECIFIED | 未说明 | compliant | 7 | R-XUFM-X7 | 不合格 | COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE | 增强型MOSFET | ISOLATED | SWITCHING | N-CHANNEL | 0.02 Ω | 720 A | 500 V | 3000 mJ | METAL-OXIDE SEMICONDUCTOR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APTC60AM83BC1G | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | O-Z Gedney | 3 | Compliant | 100 ns | 150 °C | 有 | Obsolete | MICROSEMI CORP | 5.84 | Chassis Mount, Screw | 1 | CGA75625 | EAR99 | 150 °C | -40 °C | 其他晶体管 | 250 W | compliant | 250 W | 21 ns | 30 ns | 600 V | 36 A | 20 V | 49 A | 7.2 nF | METAL-OXIDE SEMICONDUCTOR | 250 W | 83 mΩ | 无 |