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制造商是'Intel'

  • Intel 嵌入式 - 片上系统（SoC）

    (1712)

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

触点镀层

底架

安装类型

包装/外壳

越来越多的功能

外壳材料

供应商器件包装

房屋材料

插入材料

后壳材料，电镀

第一种连接器安装类型

第二个连接器安装类型

厂商

操作温度

包装

系列

尺寸/尺寸

容差

终止次数

终端

温度系数

连接器类型

电阻

定位的数量

最高工作温度

最小工作温度

组成

颜色

应用

性别

功率(瓦特)

电容量

紧固类型

子类别

额定电流

电压 - 供电

方向

屏蔽/屏蔽

入口保护

深度

样式

外壳完成

外壳尺寸-插入

功能

接头数量

失败率

引线间距

配置

镀层

速度

内存大小

外壳尺寸，MIL

引线样式

核心处理器

周边设备

连接方式

电缆开口

建筑学

测试电流

产品类别

第一个连接器

第二个连接器

主要属性

齐纳电流

闪光大小

抽头/步数

独立延误次数

第一拍延迟

可用总延误

特征

触点增量

产品类别

高度

座位高度(最大)

长度

宽度

厚度（最大）

触点表面处理厚度 - 配套

材料可燃性等级

辐射硬化

评级结果
AGFD019R25A2E4F AGFD019R25A2E4F

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

110267

活跃

480

-

-

Molex

Bulk

0°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGID023R18A2E3V AGID023R18A2E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Advanced Energy

Advanced Energy

480

Tray

活跃

Non-Isolated DC/DC Converters

-

-

Intel

1

0°C ~ 100°C (TJ)

Agilex I

DC-DC Converter

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

Non-Isolated DC-DC Converters

AGFB027R24C3I3V AGFB027R24C3I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

100 Ohms

50 uA

200 mW

+ 150 C

0.000176 oz

- 55 C

3000

SMD/SMT

Panjit

Panjit

2.4 V

Details

744

Tray

活跃

齐纳二极管

SOT-23-3

-

Intel

50 uA

-40°C ~ 100°C (TJ)

Reel

ZSM-02TA

Diodes & Rectifiers

Single

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

5 mA

FPGA - 2.7M Logic Elements

50 uA

-

齐纳二极管

1 mm

2.2 mm

1.35 mm

AGID019R18A2E3E AGID019R18A2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

480

Tray

活跃

-

-

Intel

Non-Compliant

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGIB027R29A1E2VR3 AGIB027R29A1E2VR3

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

720

Tray

活跃

1

Intel

Intel

-

-

Metal

Intel

Non-Compliant

0°C ~ 100°C (TJ)

Tray

Agilex I

Straight

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

Intel

AGIB019R18A2E3V AGIB019R18A2E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

480

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFB006R24C3E3V AGFB006R24C3E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Gold

576

Tray

活跃

Bulkhead, Front Side Nut, Jam Nut, Panel

-

-

Intel

Compliant

0°C ~ 100°C (TJ)

Bulk

Agilex F

Crimp

Crimp, Receptacle

66

175 °C

-65 °C

Female

Threaded

Straight

46.02 mm

66

Cadmium

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

31.57 mm

无

抗环境干扰

AGFA027R25A3E3E AGFA027R25A3E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

624

Tray

活跃

-

-

Intel

Non-Compliant

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFB006R24C2I3E AGFB006R24C2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

576

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

AGFA012R24C3E3V AGFA012R24C3E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

744

Tray

活跃

-

-

Intel

Non-Compliant

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

AGFA023R25A3I3E AGFA023R25A3I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

120122

活跃

480

-

-

Molex

Bulk

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGFA019R25A2E3E AGFA019R25A2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

440VAC

480

通孔

Radial, Disc

-

Vishay Beyschlag/Draloric/BC Components

Bulk

-40°C ~ 125°C

WYO

0.256 Dia (6.50mm)

±20%

Y5U (E)

Safety

1000 pF

-

0.197 (5.00mm)

1.4GHz

256KB

Straight

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

-

0.374 (9.50mm)

-

X1, Y2

AGFA027R31C3E3E AGFA027R31C3E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

RN732B

Obsolete

720

1206 (3216 Metric)

1206

KOA Speer Electronics, Inc.

Tape & Reel (TR)

-55°C ~ 155°C

RN73

0.126 L x 0.063 W (3.20mm x 1.60mm)

±1%

2

±50ppm/°C

111 Ohms

Thin Film

0.125W, 1/8W

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

Moisture Resistant

0.028 (0.70mm)

AGFB027R31C2E1V AGFB027R31C2E1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

DL66G12

活跃

720

-

-

TE Connectivity Deutsch 连接器

Bag

0°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFA008R16A2I2V AGFA008R16A2I2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

173114

活跃

384

-

-

Molex

Bulk

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

AGFA023R25A1I1V AGFA023R25A1I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

DS1100

Obsolete

480

表面贴装

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

8-uMAX/uSOP

Analog Devices Inc./Maxim Integrated

Tube

-40°C ~ 85°C

-

4.75V ~ 5.25V

Nonprogrammable

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

5

1

100ns

500ns

100 ns

AGFC019R25A2I3E AGFC019R25A2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

RN73H1E

活跃

480

0402 (1005 Metric)

0402

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RN73H

0.039 L x 0.020 W (1.00mm x 0.50mm)

±0.5%

2

±50ppm/°C

10.1 Ohms

Metal Film

0.063W, 1/16W

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.016 (0.40mm)

AEC-Q200

AGFB008R16A2E3E AGFB008R16A2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

RS73G2A

活跃

384

0805 (2012 Metric)

0805

KOA Speer Electronics, Inc.

Tape & Reel (TR)

-55°C ~ 155°C

RS73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±1%

2

±50ppm/°C

4.22 MOhms

厚膜

0.25W, 1/4W

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.024 (0.60mm)

AEC-Q200

AGFB012R24B2E3V AGFB012R24B2E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Bulk

Metal

D38999/25HE

活跃

镍铁合金

Gold

768

Panel Mount, Through Hole

-

-

不锈钢

-

氟硅弹性体

-

TE Connectivity Deutsch 连接器

600VAC, 850VDC

-65°C ~ 200°C

MIL-DTL-38999 Series III, DTS

Solder

Receptacle, Female Sockets

23

Silver

Aviation, Communication Systems, Industrial

Threaded

-

D

Shielded

抗环境干扰

化学镍

17-99

1.4GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MPU, FPGA

FPGA - 1.2M Logic Elements

-

密封

-

-

AGFB027R31C2I3V AGFB027R31C2I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Bulk

50 Ohms

UFL-2HF

-

活跃

Female

6 GHz

-

1.13mm OD Coaxial Cable

720

-

-

Free Hanging (In-Line)

Free Hanging (In-Line)

Hirose Electric Co Ltd

Female

-40°C ~ 90°C

U.FL

Gray

-

U.FL (UMCC) to U.FL (UMCC)

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

U.FL (UMCC) Plug, Right Angle

U.FL (UMCC) Plug, Right Angle

FPGA - 2.7M Logic Elements

-

-

2.756 (70.00mm)

AGIB022R31B2E3E AGIB022R31B2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

720

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

AGFB014R24C2I2V AGFB014R24C2I2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

744

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

1SX040HH3F35E3XG 1SX040HH3F35E3XG

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1152-BBGA, FCBGA

1152-FBGA (35x35)

Intel

374

0°C ~ 100°C (TJ)

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 400K Logic Elements

-

AGFA019R25A2I3E AGFA019R25A2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

480

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFA012R24B1I1V AGFA012R24B1I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

768

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-