制造商是'Everspin Technologies'
Everspin Technologies 存储器
(203)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 子类别 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间（最大） | 字长 | 内存IC类型 | 混合内存类型 | 产品类别 | 组织的记忆 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||||
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 | MR25H256MDC | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Automotive grade | 表面贴装 | 表面贴装 | 8-TDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tray | 2013 | Automotive, AEC-Q100 | 不用于新设计 | 3 (168 Hours) | 8 | EAR99 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | 8 | 不合格 | 3.3V | 3.6V | 3V | SPI, Serial | 256Kb 32K x 8 | 27mA | SYNCHRONOUS | 40MHz | 10 ns | RAM | SPI | 8 | 256 kb | 0.00001A | 8b | 1.05mm | 6mm | 5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MR4A08BYS35 | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Non-Volatile | 0°C~70°C TA | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | 8542.32.00.71 | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 44 | 不合格 | 3.3V | 3.6V | 3V | 16Mb 2M x 8 | 100mA | 180mA | ASYNCHRONOUS | RAM | Parallel | 8b | 2MX8 | 8 | 35ns | 16 Mb | 0.014A | 35 ns | 8b | 1.2mm | 18.41mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | MR10Q010CSC | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR10Q010 | 有 | + 85 C | 3.6 V | 0.144929 oz | - 40 C | 480 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | SOP, SOP16,.4 | 小概要 | 128000 | PLASTIC/EPOXY | SOP16,.4 | -40 °C | 未说明 | 85 °C | 有 | MR10Q010CSC | 131072 words | 3.3 V | SOP | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 5.29 | SOIC | MRAM | 表面贴装 | 16-SOIC (0.295", 7.50mm Width) | YES | 16-SOIC | 16 | Everspin Technologies Inc. | Tray | 0°C ~ 70°C (TA) | Tray | - | EAR99 | 8542.32.00.71 | Memory & Data Storage | 3V ~ 3.6V | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | compliant | 16 | R-PDSO-G16 | 不合格 | 3.6 V | 1.8,3.3 V | INDUSTRIAL | 3 V | 1Mbit | 100 mA | SYNCHRONOUS | 40 MHz | 0.22 mA | 7 ns | RAM | SPI - Quad I/O, QPI | 8 bit | 128 k x 8 | 2.64 mm | 8 | - | 0.005 A | 1048576 bit | 存储器电路 | N/A | MRAM | 128K x 8 | 10.34 mm | 7.52 mm | ||||||||||||||||||||||||||||||||
 | MR2A08AMA35 | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 48-LFBGA | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2012 | 活跃 | 3 (168 Hours) | 48 | EAR99 | 8542.32.00.71 | 3V~3.6V | BOTTOM | 未说明 | 1 | 3.3V | 0.75mm | 未说明 | 48 | 不合格 | 3.3V | 3.6V | 3V | 4Mb 512K x 8 | 50mA | 135mA | ASYNCHRONOUS | RAM | Parallel | 8b | 256KX8 | 8 | 35ns | 4 Mb | 0.02A | 35 ns | 8b | 1.35mm | 8mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR0A08BMA35 | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 48-LFBGA | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2011 | 活跃 | 3 (168 Hours) | 48 | EAR99 | 8542.32.00.71 | 3V~3.6V | BOTTOM | 未说明 | 1 | 3.3V | 0.75mm | 未说明 | 48 | 不合格 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 55mA | 65mA | ASYNCHRONOUS | RAM | Parallel | 8b | 128KX8 | 8 | 35ns | 1 Mb | 0.007A | 35 ns | 8b | 1.35mm | 8mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR2A16AYS35R | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2012 | 活跃 | 3 (168 Hours) | 44 | EAR99 | 8542.32.00.71 | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 44 | 不合格 | 3.3V | 3.6V | 3V | 4Mb 256K x 16 | 155mA | ASYNCHRONOUS | RAM | Parallel | 16b | 256KX16 | 16 | 35ns | 4 Mb | 0.028A | 35 ns | 16b | 1.2mm | 18.41mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR2A08AYS35R | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2012 | 活跃 | 3 (168 Hours) | 44 | EAR99 | 8542.32.00.71 | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 44 | 不合格 | 3.3V | 3.6V | 3V | 4Mb 512K x 8 | 135mA | ASYNCHRONOUS | RAM | Parallel | 8b | 256KX8 | 8 | 35ns | 4 Mb | 0.02A | 35 ns | 8b | 1.2mm | 18.41mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR0A16AVMA35 | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-LFBGA | 48 | Non-Volatile | -40°C~105°C TA | Tray | 2012 | 活跃 | 3 (168 Hours) | 48 | EAR99 | 8542.32.00.71 | 3V~3.6V | BOTTOM | 1 | 3.3V | 0.75mm | 48 | 3.3V | 3.6V | 3V | 1Mb 64K x 16 | 105mA | 155mA | RAM | Parallel | 16b | 64KX16 | 16 | 35ns | 1 Mb | 0.012A | 35 ns | 16b | 1.35mm | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR25H10MDC | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Automotive grade | 表面贴装 | 表面贴装 | 8-TDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tray | 2013 | Automotive, AEC-Q100 | 不用于新设计 | 3 (168 Hours) | 8 | EAR99 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 8 | 3.3V | 3V | SPI, Serial | 1Mb 128K x 8 | 27mA | 40MHz | 10 ns | RAM | SPI | 8 | 1 Mb | 0.000115A | 8b | 1mm | 6mm | 5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MR4A16BYS35 | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | 54 | Non-Volatile | 0°C~70°C TA | Tray | 2015 | 活跃 | 3 (168 Hours) | 54 | EAR99 | 3V~3.6V | DUAL | 1 | 3.3V | 0.8mm | 54 | 3.3V | 3.6V | 3V | 16Mb 1M x 16 | 110mA | 180mA | RAM | Parallel | 16b | 1MX16 | 16 | 35ns | 16 Mb | 0.014A | 35 ns | 16b | 1.2mm | 22.22mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR2A08AMYS35 | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | YES | 44 | Non-Volatile | -40°C~125°C TA | Tray | 2008 | Automotive, AEC-Q100 | 活跃 | 3 (168 Hours) | 44 | EAR99 | 8542.32.00.71 | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 44 | 不合格 | 3.6V | 3.3V | 3V | 4Mb 512K x 8 | 50mA | ASYNCHRONOUS | RAM | Parallel | 8b | 256KX8 | 8 | 35ns | 0.02A | 2097152 bit | 35 ns | 1.2mm | 18.41mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR0A16AVYS35 | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Non-Volatile | -40°C~105°C TA | Tray | 2013 | 活跃 | 1 (Unlimited) | 44 | EAR99 | 8542.32.00.71 | 3V~3.6V | DUAL | 1 | 3.3V | 0.8mm | 44 | 3.3V | 3.6V | 3V | 1Mb 64K x 16 | 105mA | 165mA | RAM | Parallel | 16b | 64KX16 | 16 | 35ns | 1 Mb | 0.028A | 35 ns | 16b | 1.2mm | 18.41mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MR25H256AMDF | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Automotive grade | 表面贴装 | 8-VDFN Exposed Pad | YES | Non-Volatile | -40°C~125°C TA | Tray | Automotive, AEC-Q100 | 活跃 | 3 (168 Hours) | 8 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | R-PDSO-N8 | 3.6V | 3V | 256Kb 32K x 8 | SYNCHRONOUS | 40MHz | RAM | SPI | 32KX8 | 8 | 262144 bit | 0.9mm | 6mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR2A16AVMA35 | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-LFBGA | 48 | Non-Volatile | -40°C~105°C TA | Tray | 2012 | 活跃 | 3 (168 Hours) | 48 | EAR99 | 8542.32.00.71 | 3V~3.6V | BOTTOM | 1 | 3.3V | 0.75mm | 48 | 3.3V | 3.6V | 3V | 4Mb 256K x 16 | 105mA | 165mA | RAM | Parallel | 16b | 256KX16 | 16 | 35ns | 4 Mb | 0.028A | 35 ns | 16b | 1.35mm | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR25H256CDCR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 表面贴装 | 表面贴装 | 8-TDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 不用于新设计 | 3 (168 Hours) | 8 | EAR99 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | 8 | 不合格 | 3.3V | 3.6V | 2.7V | SPI, Serial | 256Kb 32K x 8 | 27mA | SYNCHRONOUS | 40MHz | 10 ns | RAM | SPI | 8 | 256 kb | 0.00001A | 8b | 1.05mm | 6mm | 5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR4A16BCMA35R | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 48-LFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2014 | 活跃 | 5 (48 Hours) | 48 | EAR99 | 8542.32.00.71 | 3V~3.6V | BOTTOM | 未说明 | 1 | 3.3V | 0.75mm | 未说明 | 48 | 不合格 | 3.3V | 3.6V | 3V | 16Mb 1M x 16 | 180mA | ASYNCHRONOUS | RAM | Parallel | 16b | 1MX16 | 16 | 35ns | 16 Mb | 0.014A | 35 ns | 16b | 1.35mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR4A16BCYS35R | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | 54 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | e3 | 活跃 | 3 (168 Hours) | 54 | EAR99 | Tin (Sn) | 3V~3.6V | DUAL | 1 | 3.3V | 0.8mm | 54 | 3.3V | 3.6V | 3V | 16Mb 1M x 16 | 180mA | RAM | Parallel | 16b | 1MX16 | 16 | 35ns | 16 Mb | 0.014A | 35 ns | 16b | 1.2mm | 22.22mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR0A16AVYS35R | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | 44-TSOP2 | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | 2013 | 活跃 | 3 (168 Hours) | 105°C | -40°C | 3V~3.6V | 3.3V | Parallel | 3.6V | 3V | 1Mb 64K x 16 | 165mA | 35ns | RAM | Parallel | 16b | 35ns | 1 Mb | 16b | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR25H256AMDFR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR25H256 | + 125 C | 3.6 V | - 40 C | 4000 | 3 V | SMD/SMT | Everspin Technologies | Everspin Technologies | Details | HVSON, | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | 32000 | PLASTIC/EPOXY | -40 °C | 未说明 | 125 °C | 有 | MR25H256AMDFR | 32768 words | 3.3 V | HVSON | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 5.6 | Automotive grade | MRAM | 表面贴装 | 8-VDFN Exposed Pad | YES | 8-DFN-EP, Small Flag (5x6) | 8 | Everspin Technologies Inc. | Tape & Reel (TR) | -40°C ~ 125°C (TA) | Reel | - | Memory & Data Storage | 2.7V ~ 3.6V | DUAL | 无铅 | 未说明 | 1 | 1.27 mm | compliant | R-PDSO-N8 | 3.6 V | AUTOMOTIVE | 3 V | 256Kbit | SYNCHRONOUS | 40 MHz | 9 ns | RAM | SPI | 8 bit | 32 k x 8 | 0.9 mm | 8 | - | 262144 bit | AEC-Q100 | SPI BUS SERIAL EEPROM | MRAM | 32K x 8 | 6 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||
| MR4A08BUYS45R | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR4A08 | 有 | 0.6 W | + 125 C | 3.6 V | - 40 C | 1500 | 3 V | SMD/SMT | Parallel | Everspin Technologies | Everspin Technologies | Details | MRAM | 表面贴装 | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP2 | Everspin Technologies Inc. | Tape & Reel (TR) | -40°C ~ 125°C (TA) | Reel | - | Memory & Data Storage | 3V ~ 3.6V | 16Mbit | 180 mA | 45 ns | RAM | Parallel | 8 bit | 2 M x 8 | 45ns | MRAM | 2M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR10Q010VSC | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR10Q010 | 有 | + 105 C | 3.6 V | - 40 C | 480 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | MRAM | 表面贴装 | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC | Everspin Technologies Inc. | Tray | -40°C ~ 105°C (TA) | Tray | - | Memory & Data Storage | 3V ~ 3.6V | 1Mbit | 100 mA | 40 MHz | 7 ns | RAM | SPI - Quad I/O, QPI | 8 bit | 128 k x 8 | - | MRAM | 128K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR10Q010MBR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR10Q010 | + 70 C | 3.6 V | 0 C | 1000 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | MRAM | 表面贴装 | 24-LBGA | 24-BGA (6x8) | Everspin Technologies Inc. | Tape & Reel (TR) | 0°C ~ 70°C (TA) | Reel | - | Memory & Data Storage | 3V ~ 3.6V | 1Mbit | 100 mA | 40 MHz | 7 ns | RAM | SPI - Quad I/O, QPI | 8 bit | 128 k x 8 | - | MRAM | 128K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR10Q010VSCR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR10Q010 | 有 | + 105 C | 3.6 V | - 40 C | 1000 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | MRAM | 表面贴装 | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC | Everspin Technologies Inc. | Tape & Reel (TR) | -40°C ~ 105°C (TA) | Reel | - | Memory & Data Storage | 3V ~ 3.6V | 1Mbit | 100 mA | 40 MHz | 7 ns | RAM | SPI - Quad I/O, QPI | 8 bit | 128 k x 8 | - | MRAM | 128K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR10Q010MB | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR10Q010 | + 70 C | 3.6 V | 0 C | 480 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | LBGA, | GRID ARRAY, LOW PROFILE | 128000 | PLASTIC/EPOXY | 70 °C | MR10Q010MB | 131072 words | 3.3 V | LBGA | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 5.6 | MRAM | 表面贴装 | 24-LBGA | YES | 24-BGA (6x8) | 24 | Everspin Technologies Inc. | Tray | 0°C ~ 70°C (TA) | Tray | - | EAR99 | 8542.32.00.71 | Memory & Data Storage | 3V ~ 3.6V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B24 | 3.6 V | COMMERCIAL | 3 V | 1Mbit | 100 mA | SYNCHRONOUS | 40 MHz | 7 ns | RAM | SPI - Quad I/O, QPI | 8 bit | 128 k x 8 | 1.35 mm | 8 | - | 1048576 bit | 存储器电路 | MRAM | 128K x 8 | 8 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| MR25H40VDF | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR25H40 | 有 | 0.6 W | + 105 C | 3.6 V | - 40 C | 570 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | DFN-8 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | 512000 | PLASTIC/EPOXY | SOLCC8,.25 | -40 °C | 40 | 105 °C | 有 | MR25H40VDF | 524288 words | 3.3 V | HVSON | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 2.15 | MRAM | 表面贴装 | 8-VDFN Exposed Pad | YES | 8-DFN-EP, Small Flag (5x6) | 8 | Everspin Technologies Inc. | Tray | -40°C ~ 105°C (TA) | Tray | Automotive, AEC-Q100 | EAR99 | Memory & Data Storage | 3V ~ 3.6V | DUAL | 无铅 | 260 | 1 | 1.27 mm | compliant | R-PDSO-N8 | 不合格 | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | 4Mbit | 46.5 mA | SYNCHRONOUS | 40 MHz | 0.0465 mA | 9 ns | RAM | SPI | 8 bit | 512 k x 8 | 0.9 mm | 8 | - | 0.00018 A | 4194304 bit | 存储器电路 | N/A | MRAM | 512K x 8 | 6 mm | 5 mm |