类别是'IC、晶体管插座 - 适配器'
IC、晶体管插座 - 适配器 (370)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 房屋材料 | 质量 | 触点材料 - 配套 | 触点材料 - 柱子 | 板材 | 操作温度 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | ECCN 代码 | 定位的数量 | 最高工作温度 | 最小工作温度 | 行数 | 性别 | 附加功能 | 额定电流 | 螺距 | 额定电流 | 间距 - 配套 | 螺纹距离 | 接头数量 | 触点表面处理 - 柱子 | 引线长度 | 行间距 | 设备插座类型 | 端子柱长度 | 间距--柱子 | 转换自(适配器端) | 转换（适配器端） | 特征 | 高度 | 长度 | 触点表面处理厚度 - 配套 | 触点表面处理厚度 - 柱子 | 材料可燃性等级 | RoHS状态 | 可燃性等级 | 无铅 | ||
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 | 28-650000-11-RC-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Gold | 通孔 | 通孔 | 28 | Brass | FR4 Epoxy Glass | Gold | 2009 | Correct-A-Chip® 650000 | 活跃 | 1 (Unlimited) | Solder | 0.050 1.27mm | Gold | 3.175mm | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.6 (15.24mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| 32-652000-10-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 1A | 通孔 | 通孔 | PLCC | 32 | Brass | FR4 Epoxy Glass | 2012 | Correct-A-Chip® 652000 | 活跃 | 1 (Unlimited) | Solder | 1A | 0.050 1.27mm | Tin-Lead | 3.175mm | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.6 (15.24mm) Row Spacing | 200.0μin 5.08μm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||
 | PA-SOD6SM18-40 | Logical Systems Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 通孔 | 40 | 活跃 | 不适用 | Solder | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.6 (15.24mm) Row Spacing | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| 28-652000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 28 | Brass | FR4 Epoxy Glass | 2012 | Correct-A-Chip® 652000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | UL 94V-0 | 1A | 0.050 1.27mm | 28 | Gold | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.6 (15.24mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||
 | 24-35W000-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | SOIC | 24 | Brass | FR4 Epoxy Glass | 2003 | Correct-A-Chip® 35W000 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 0.050 1.27mm | 24 | Tin-Lead | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | 1.58mm | 30.5mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||
 | PA-SOD6SM18-44 | Logical Systems Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 通孔 | 44 | 活跃 | 不适用 | Solder | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | 64-304121-00 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 64 | Brass | FR4 Epoxy Glass | 2006 | e0 | Obsolete | 不适用 | Solder | EAR99 | 插座适配器 | 0.031 0.80mm | 64 | Tin-Lead | IC SOCKET | 0.090 2.29mm | 0.031 0.80mm | TQFP | QFP | 200.0μin 5.08μm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||
| 97-68340-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 144 | Copper | Brass | FR4 Epoxy Glass | Tin | 105°C | 2008 | Correct-A-Chip® 68340 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.026 0.65mm | 144 | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | QFP | PGA | 200.0μin 5.08μm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||
 | 248-1282-29-0602J | 3M | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Copper | 1A | Gold | 通孔 | 通孔 | 48 | Polysulfone (PSU), Glass Filled | 453.59237g | 铍铜 | 铍铜 | Gold | -55°C~125°C | 2011 | Textool™ | 活跃 | 1 (Unlimited) | Solder | 48 | 150°C | -55°C | Female | 2.54mm | 1A | 0.100 2.54mm | 48 | Gold | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 封闭框架 | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||
 | 32-450001-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 通孔 | SOIC | 32 | FR4 Epoxy Glass | Brass | 2006 | Correct-A-Chip® 450001 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 105°C | -55°C | 2 | 插座适配器 | 0.050 1.27mm | 32 | 10.16 mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOJ | DIP, 0.4 (10.16mm) Row Spacing | 1.58mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
| 800-19-6-1 | TE Connectivity Deutsch Connectors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 活跃 | 1 (Unlimited) | |||||||||||||||||||||||||||||||||||||||||||||||||
| 08-350000-10-HT | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | 8 | POLYAMIDE | Brass | Polyimide (PI) | Tin | 2006 | Correct-A-Chip® 350000 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 2 | 0.050 1.27mm | 2.54mm | 8 | Tin-Lead | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | 200.0μin 5.08μm | Non-RoHS Compliant | ||||||||||||||||||||||||||
| 28-350002-11-RC-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | SOIC | 28 | Brass | FR4 Epoxy Glass | 2013 | Correct-A-Chip® 350000 | 活跃 | 1 (Unlimited) | Solder | 0.050 1.27mm | Gold | 3.175mm | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| 16-307349-11-RC-P (170 UP) | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 16 | Brass | FR4 Epoxy Glass | Gold | Correct-A-Chip® 307349 | 活跃 | 1 (Unlimited) | Solder | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.3 (7.62mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| 14-35W000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | SOIC | 14 | Brass | FR4 Epoxy Glass | 2012 | Correct-A-Chip® 35W000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.050 1.27mm | 14 | Gold | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | |||||||||||||||||||||||||
| 14-354000-21-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 14 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 2009 | Correct-A-Chip® 354000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 14 | 2.286mm | IC SOCKET | 0.089 2.28mm | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | |||||||||||||||||||||
| 68-505-110-RC-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | PLCC | 68 | Brass | FR4 Epoxy Glass | 2013 | Correct-A-Chip® 505 | 活跃 | 1 (Unlimited) | Solder | 0.050 1.27mm | Tin-Lead | 3.81mm | 0.150 3.81mm | 0.050 1.27mm | PLCC | PGA | 200.0μin 5.08μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| 84-505-110-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 84 | Brass | FR4 Epoxy Glass | 2013 | Correct-A-Chip® 505 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 0.050 1.27mm | 84 | Tin-Lead | 3.81mm | IC SOCKET | 0.150 3.81mm | 0.050 1.27mm | PLCC | PGA | 200.0μin 5.08μm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| 16-35W000-11-RC-P (220 UP) | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 16 | Brass | FR4 Epoxy Glass | Correct-A-Chip® 35W000 | 活跃 | 1 (Unlimited) | Solder | 0.050 1.27mm | Gold | 0.125 3.18mm | 0.100 2.54mm | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
| 24-650000-10-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | SOIC | 24 | Brass | FR4 Epoxy Glass | 2010 | Correct-A-Chip® 650000 | 活跃 | 1 (Unlimited) | Solder | 0.050 1.27mm | Tin-Lead | 3.175mm | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.6 (15.24mm) Row Spacing | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| 95-132I25-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 132 | Copper | Brass | FR4 Epoxy Glass | Tin | 2009 | Correct-A-Chip® 95-132I25 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.025 0.64mm | 132 | Tin-Lead | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | QFP | PGA | 200.0μin 5.08μm | Non-RoHS Compliant | |||||||||||||||||||||||||
| 68-505-110-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | PLCC | 68 | Brass | FR4 Epoxy Glass | 2013 | Correct-A-Chip® 505 | 活跃 | 1 (Unlimited) | Solder | 0.050 1.27mm | Tin-Lead | 3.81mm | 0.150 3.81mm | 0.050 1.27mm | PLCC | PGA | 200.0μin 5.08μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | 26-665000-00 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | SOIC | 26 | Brass | FR4 Epoxy Glass | 2006 | Correct-A-Chip® 665000 | 活跃 | 1 (Unlimited) | Solder | 26 | 0.050 1.27mm | Tin-Lead | 787.4μm | 0.031 0.80mm | 0.050 1.27mm | SOIC-W | SOIC | 200.0μin 5.08μm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| 7131-108-18 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | 通孔 | 8 | Brass | FR4 Epoxy Glass | 2013 | 活跃 | 1 (Unlimited) | Solder | Tin-Lead | 3.175mm | 0.125 3.18mm | HB2E Relay | DIP, 0.3 (7.62mm) Row Spacing | 200.0μin 5.08μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| 32-650000-10-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | SOIC | 32 | Brass | FR4 Epoxy Glass | 2013 | Correct-A-Chip® 650000 | 活跃 | 1 (Unlimited) | Solder | 0.050 1.27mm | Tin-Lead | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.6 (15.24mm) Row Spacing | Non-RoHS Compliant |