类别是'IC、晶体管插座 - 适配器'
IC、晶体管插座 - 适配器 (370)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 房屋材料 | 质量 | 触点材料 - 配套 | 触点材料 - 柱子 | 板材 | 操作温度 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | ECCN 代码 | 定位的数量 | 最高工作温度 | 最小工作温度 | 行数 | 附加功能 | 额定电流 | 螺距 | 额定电流 | 间距 - 配套 | 接头数量 | 触点表面处理 - 柱子 | 引线长度 | 行间距 | 设备插座类型 | 核心架构 | 端子柱长度 | 间距--柱子 | 转换自(适配器端) | 转换（适配器端） | 特征 | 高度 | 长度 | 触点表面处理厚度 - 配套 | 触点表面处理厚度 - 柱子 | 材料可燃性等级 | 达到SVHC | RoHS状态 | 可燃性等级 | 无铅 | ||
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 | 84-652000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 84 | Brass | FR4 Epoxy Glass | 2012 | Correct-A-Chip® 652000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | UL 94V-0 | 1A | 0.050 1.27mm | 84 | Gold | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.6 (15.24mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | |||||||||||||||||||||||||
| 18-354000-21-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 3A | Gold | 表面贴装 | 表面贴装 | 18 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 2009 | Correct-A-Chip® 354000 | 活跃 | 1 (Unlimited) | Solder | 3A | 0.100 2.54mm | Gold | 2.286mm | 0.089 2.28mm | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||||||||||||||||||||||||
| 08-354000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 8 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 2009 | Correct-A-Chip® 354000 | e4 | 活跃 | 1 (Unlimited) | Solder | EAR99 | SOCKET ADAPTER, UL 94V-0 | 3A | 0.100 2.54mm | 8 | 762μm | IC SOCKET | 0.030 0.76mm | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||||||||||||||||||||||
| 20-354W00-20 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 20 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 105°C | 2005 | Correct-A-Chip® 354W00 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 20 | Tin-Lead | IC SOCKET | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | 200.0μin 5.08μm | UL94 V-0 | ROHS3 Compliant | ||||||||||||||||||||||||
| 08-354000-21-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 8 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 2009 | Correct-A-Chip® 354000 | e4 | 活跃 | 1 (Unlimited) | Solder | EAR99 | SOCKET ADAPTER, UL 94V-0 | 3A | 0.100 2.54mm | 8 | 2.286mm | IC SOCKET | 0.089 2.28mm | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||||||||||||||||||||||
| 24-354000-21-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 24 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 2009 | Correct-A-Chip® 354000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 24 | 2.286mm | IC SOCKET | 0.089 2.28mm | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | |||||||||||||||||||||
| 16-307349-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 16 | Brass | FR4 Epoxy Glass | Gold | 2009 | Correct-A-Chip® 307349 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 0.050 1.27mm | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.3 (7.62mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| 24-354W00-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 24 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 105°C | 2005 | Correct-A-Chip® 354W00 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 24 | Tin-Lead | IC SOCKET | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 1.58mm | 30.5mm | 10.0μin 0.25μm | 200.0μin 5.08μm | UL94 V-0 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||
| 20-354000-21-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 20 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 2009 | Correct-A-Chip® 354000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 20 | 2.286mm | IC SOCKET | 0.089 2.28mm | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | |||||||||||||||||||||
| 24-354000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 24 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 2007 | Correct-A-Chip® 354000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 24 | 762μm | IC SOCKET | 0.030 0.76mm | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | |||||||||||||||||||||
| 44-652000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 44 | Brass | FR4 Epoxy Glass | 2012 | Correct-A-Chip® 652000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | UL 94V-0 | 1A | 0.050 1.27mm | 44 | Gold | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.6 (15.24mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | |||||||||||||||||||||||||
| 68-653000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 68 | Brass | FR4 Epoxy Glass | 2012 | Correct-A-Chip® 653000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | UL 94V-0 | 1A | 0.050 1.27mm | 68 | Gold | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.6 (15.24mm) Row Spacing | 包括插座 | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | ||||||||||||||||||||||
 | LCQT-QFP0.5-80 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | QFP | 80 | Polyester | Brass | FR4 Epoxy Glass | -55°C~125°C | Correct-A-Chip® | 活跃 | 1 (Unlimited) | Solder | 125°C | -55°C | 0.020 0.50mm | Gold | 5.9944mm | 0.236 6.00mm | 0.100 2.54mm | 多种包装 | QFP | Flash | UL94 V-0 | 无SVHC | Non-RoHS Compliant | UL94 V-0 | 无铅 | ||||||||||||||||||||||||
 | 68-304538-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 68 | Brass | FR4 Epoxy Glass | 2006 | Correct-A-Chip® 304538 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.050 1.27mm | 68 | Tin-Lead | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | PGA | 200.0μin 5.08μm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||
 | 20-555000-00 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 20 | Brass | FR4 Epoxy Glass | 105°C | 2009 | Correct-A-Chip® 555000 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.026 0.65mm | 20 | Tin-Lead | IC SOCKET | 0.050 1.27mm | SSOP | SOWIC | 200.0μin 5.08μm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||
 | 32-354000-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A | Gold | 表面贴装 | 表面贴装 | 32 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 2006 | Correct-A-Chip® 354000 | 活跃 | 1 (Unlimited) | Solder | 32 | 3A | Gold | 0.100 2.54mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 | |||||||||||||||||||||||||||
 | 28-354000-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 28 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 105°C | 2012 | Correct-A-Chip® 354000 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 2 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 28 | 7.62 mm | IC SOCKET | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | Non-RoHS Compliant | UL94 V-0 | |||||||||||||||||||||
| 20-354000-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 20 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 105°C | Correct-A-Chip® 354000 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 2 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 20 | 7.62 mm | IC SOCKET | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | Non-RoHS Compliant | UL94 V-0 | ||||||||||||||||||||||
 | 18-35W000-10-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | SOIC | 18 | Brass | FR4 Epoxy Glass | 2006 | Correct-A-Chip® 35W000 | 活跃 | 1 (Unlimited) | Solder | 18 | 0.050 1.27mm | Tin-Lead | 3.175mm | 0.125 3.18mm | 0.100 2.54mm | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| 97-56001-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 169 | Brass | FR4 Epoxy Glass | Gold | 2010 | Correct-A-Chip® 97-56001 | e3 | 活跃 | 1 (Unlimited) | Solder | 插座适配器 | 0.025 0.64mm | 132 | Tin-Lead | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | QFP | PGA | 200.0μin 5.08μm | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | MIKROE-230 | MikroElektronika | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Socket | 40 | 活跃 | 1 (Unlimited) | AVR | AT90PWM1 | DIP | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
| 160-306045-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2018 | 活跃 | 1 (Unlimited) | EAR99 | 160 | 160 | IC SOCKET | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | 48-655000-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Silver | 通孔 | 通孔 | TSOP | 48 | Copper | Brass | FR4 Epoxy Glass | Silver | 2006 | Correct-A-Chip® 655000 | Obsolete | 1 (Unlimited) | Solder | 48 | 0.020 0.50mm | Tin-Lead | 3.175mm | 0.125 3.18mm | 0.100 2.54mm | TSOP | DIP, 0.6 (15.24mm) Row Spacing | 200.0μin 5.08μm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | 24-665000-00 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 24 | Brass | FR4 Epoxy Glass | 2006 | Correct-A-Chip® 665000 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 0.050 1.27mm | 24 | Tin-Lead | 787.4μm | IC SOCKET | 0.031 0.80mm | 0.050 1.27mm | SOIC-W | SOIC | 200.0μin 5.08μm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | 242-1281-19-0602J | 3M | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Copper | 1A | Gold | Wire | 通孔 | 42 | Polysulfone (PSU), Glass Filled | 453.59237g | 铍铜 | 铍铜 | Gold | -55°C~125°C | 2011 | Textool™ | Obsolete | 1 (Unlimited) | Wire Wrap | 42 | 150°C | -55°C | 2.54mm | 1A | 0.100 2.54mm | 42 | Gold | 0.620 15.75mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 封闭框架 | 6.9mm | 68.1mm | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | 符合RoHS标准 | UL94 V-0 | 无铅 |