类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 模拟 IC - 其他类型 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 供应电流-最大值(Isup) | 通信IC类型 | 负电源电压 | 电池供电 | PSRR-Min | 混合动力车 | 电池供电 | 马克斯噪音 | 长度 | 宽度 | ||||||||||||||||
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BCM2121 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | BROADCOM CORP | BGA | BGA, | 1 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.8 V | YES | 200 | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 200 | S-PBGA-B200 | 不合格 | 电信电路 | ||||||||||||||||||||||||||||||||
SI3019-F-KTR | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | SILICON LABORATORIES INC | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | YES | 20 | 无 | 8542.39.00.01 | DUAL | 鸥翼 | 0.635 mm | unknown | R-PDSO-G20 | 不合格 | COMMERCIAL | 10 mA | |||||||||||||||||||||||||||||||||
FX-500-LAC-GNJ-A3-B4 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | MICROSEMI CORP | PACKAGE-6 | 1 | 70 °C | PLASTIC/EPOXY | SOJ | RECTANGULAR | 小概要 | 3.3 V | YES | 6 | 有 | e4 | 镍金 | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | |||||||||||||||||||||||||
FX-500-LAC-GNJ-A3-B4 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | MICROCHIP TECHNOLOGY INC | PACKAGE-6 | 70 °C | CERAMIC, METAL-SEALED COFIRED | SOJ | SOJ8(UNSPEC) | RECTANGULAR | 小概要 | 3.3 V | YES | 8 | 有 | 8542.39.00.01 | DUAL | J BEND | 1 | 2.54 mm | compliant | R-CDSO-J6 | 3.6 V | 3 V | 锁相环频率合成器 | 4.69 mm | 40 mA | 13.97 mm | 8.89 mm | |||||||||||||||||||||||||||
FX-500-LAC-GNJ-A3-B4 | Vectron International | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | VECTRON INTERNATIONAL | PACKAGE-6 | 1 | 70 °C | PLASTIC/EPOXY | SOJ | RECTANGULAR | 小概要 | 3.3 V | YES | 6 | 有 | e4 | 有 | 镍金 | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | ||||||||||||||||||||||||
PBL3762/2J | Ericsson | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 爱立信电源模块 | DIP | DIP, DIP22,.4 | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP22,.4 | RECTANGULAR | IN-LINE | 5 V | -24 TO -58 V | NO | 22 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 22 | R-GDIP-T22 | 不合格 | INDUSTRIAL | 5.5 mA | 5.08 mm | SLIC | -5 V | 48 dB | 2-4 CONVERSION | RESISTIVE | 8.9 dBrnC | 27.84 mm | 10.16 mm | ||||||||||||||||
BG95-M5 | Quectel Wireless Solutions Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | QUECTEL WIRELESS SOLUTIONS CO LTD | XMA, | 75 °C | -35 °C | UNSPECIFIED | XMA | RECTANGULAR | 微电子组件 | 3.8 V | YES | 102 | 接触制造商 | SEATED HGT-NOM; Data Rate(kbps) :For LTE Cat M1-588(DL), Cat NB2-127(DL), 158.5(UL) | 8542.39.00.01 | UNSPECIFIED | 无铅 | 1 | unknown | R-XXMA-N102 | 商业扩展 | 1119 Mbps | 2.2 mm | 电信电路 | 23.6 mm | 19.9 mm | |||||||||||||||||||||||||||||
CG31-80 SB | Micro Dimensional Products Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
SC11309CN | Sierra Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | SIERRA SEMICONDUCTOR | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | PLASTIC/EPOXY | 70 °C | NO | 24 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | 12 mA | 线路均衡器 | ||||||||||||||||||||||||||||||
RF6569SB | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RF MICRO DEVICES INC | HLGA, | 85 °C | -40 °C | UNSPECIFIED | HLGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 3.6 V | YES | 28 | Transferred | 5A991.G | 8517.70.00.00 | BOTTOM | BUTT | 1 | unknown | S-XBGA-B28 | INDUSTRIAL | 1.25 mm | 电信电路 | 5.5 mm | 5 mm | ||||||||||||||||||||||||||||||
RF6569SB | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | QORVO INC | HLGA, | 85 °C | -40 °C | UNSPECIFIED | HLGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 3.6 V | YES | 28 | Obsolete | 5A991.G | 8517.70.00.00 | BOTTOM | BUTT | 1 | compliant | S-XBGA-B28 | INDUSTRIAL | 1.25 mm | 电信电路 | 5.5 mm | 5 mm | ||||||||||||||||||||||||||||||
TR8001 | Murata Connectivity | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RF MONOLITHICS INC | QFN | QCCN, | 85 °C | -40 °C | UNSPECIFIED | QCCN | RECTANGULAR | CHIP CARRIER | 3 V | YES | 20 | Transferred | 8542.39.00.01 | QUAD | 无铅 | 1 | 1 mm | unknown | 20 | R-XQCC-N20 | 不合格 | INDUSTRIAL | 2 mm | 电信电路 | 10.7 mm | 6.8 mm | |||||||||||||||||||||||||||
NCV7343D21R2G | onsemi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 751A-03 | 2 | 活跃 | e3 | 有 | Matte Tin (Sn) - annealed | 电路接口 | ||||||||||||||||||||||||||||||||||||||||||||||
NCV7356D | onsemi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | ON SEMICONDUCTOR | SOIC | SOIC-14 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 16 V | YES | 14 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 14 | R-PDSO-G14 | 不合格 | AUTOMOTIVE | 1.75 mm | 电路接口 | 8.65 mm | 3.9 mm | ||||||||||||||||||||||||
S2042B-10 | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | APPLIED MICRO CIRCUITS CORP | QFP | QFP, | 70 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 3.3 V | YES | 52 | Obsolete | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | 52 | S-PQFP-G52 | 不合格 | COMMERCIAL | 160 mA | 2.45 mm | 电信电路 | 10 mm | 10 mm | ||||||||||||||||||||||||||||
PEB2035N | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
QM75001YTR13 | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
BCM89811B1AWMLGT | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
BCM20736A0KML2G | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | CYPRESS SEMICONDUCTOR CORP | QFN-32 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | YES | 32 | 有 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-XQCC-N32 | OTHER | 1 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||||||||||||||||
MSM61078GS-VK | OKI Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC34014FN | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
SIW3500GIG1 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | RF MICRO DEVICES INC | BGA | VFBGA, | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | YES | 96 | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.5 mm | compliant | 96 | S-PBGA-B96 | 不合格 | INDUSTRIAL | 1 mm | 电信电路 | 6 mm | 6 mm | ||||||||||||||||||||||||
TXC-06112AICB | Transwitch Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TRANSWITCH CORP | BGA | BGA, BGA474,19X25,50 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA474,19X25,50 | RECTANGULAR | 网格排列 | 3.3 V | YES | 474 | Obsolete | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 474 | R-CBGA-B474 | 不合格 | INDUSTRIAL | 1110 mA | 5.9 mm | ATM/SONET/SDH TERMINATOR | 32.5 mm | 25 mm | |||||||||||||||||||||||||
BCM89883B1BFBGT | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
FX806ALS | CML Microcircuits Plc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | CML MICROCIRCUITS LTD | LCC | QCCJ, | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5 V | YES | 24 | 有 | e2 | 有 | 锡银 | 8542.39.00.01 | QUAD | J BEND | 260 | 1 | 1.27 mm | compliant | 40 | 24 | S-PQCC-J24 | 不合格 | INDUSTRIAL | 3.7 mm | 电信电路 | 10.16 mm | 10.16 mm |