类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 功率(瓦特) | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 电路数量 | 最小电源电压 | 工作电源电流 | 端口的数量 | 电源电流 | 最大电源电流 | 电流源 | 逻辑功能 | 数据率 | 通信IC类型 | 收发器数量 | 最大电源电压（DC） | 最小电源电压(DC) | 输出低电流-最大值 | 发射器数量 | 电池供电 | PSRR-Min | 混合动力车 | ISDN接入速率 | 参考点 | 输出高电压-最小 | 输出低电压-最大值 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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 | CYP15G0401DXB-BGXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2003 | HOTlink II™ | e1 | yes | 活跃 | 3 (168 Hours) | 256 | 5A991.B.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 30 | CY*15G04 | 收发器 | 3.3V | LVTTL | 4 | 1.1A | 1.1A | 830mA | 1500000 Mbps | 4 | 970μm | 27mm | 27mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | CYG2217 | IXYS Integrated Circuits Division | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 通孔 | 通孔 | 18-DIP Module (0.850, 21.59mm), 9 Leads | 9 | 18-DIP | 0°C~70°C | Tube | 2001 | Cybergate™ | 活跃 | 1 (Unlimited) | 70°C | 0°C | 5V | Data Access Arrangement (DAA) | 1kV | 1 | 5mA | 5mA | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8492YJD-13 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT8980DP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 2.386605g | -40°C~85°C | Tube | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | 哑光锡 | 2W | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | Switch | 5V | 5V | 1 | 6mA | 8 | 6mA | 4.57mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
.png) | LE9662WQC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 56-VFQFN Exposed Pad | YES | Industrial grade | -40°C~85°C | Tray | miSLIC™ | 活跃 | 3 (168 Hours) | 56 | 3.135V~3.465V | QUAD | 无铅 | 3.3V | 0.5mm | unknown | S-XQCC-N56 | Subscriber Line Interface Concept (SLIC) | 3.3V | 4-Wire | 2 | 25mA | 3.135V | 1mm | 8mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | SI32171-C-FM1 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 42-WFQFN Exposed Pad | 0°C~70°C | Tray | 2013 | ProSLIC® | 活跃 | 3 (168 Hours) | 42 | BOTTOM | BUTT | 未说明 | 3.3V | 0.5mm | 未说明 | R-XBCC-B42 | Subscriber Line Interface Concept (SLIC), CODEC | 3.3V | GCI, PCM, SPI | 1 | 电信电路 | 0.9mm | 7mm | 5mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8479YHQ-01 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 195-BFBGA, FCBGA | YES | Industrial grade | -5°C~90°C | Tray | 活跃 | 4 (72 Hours) | 1.8V | BOTTOM | BALL | 1.8V | 收发器 | I2C, SPI | 1 | 11.3 Gbps | 16 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM84754A1KFSBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 最后一次购买 | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9622RQCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | -40°C | YES | 85°C | Tape & Reel (TR) | 活跃 | 53 | QUAD | 无铅 | 1 | 3.3V | 0.4mm | S-XQCC-N53 | INDUSTRIAL | SLIC | 1mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL88602LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 64 | 3.135V~3.465V | QUAD | 3.3V | 0.5mm | S-XQCC-N64 | Telecom Circuit | 3.3V | PCM | 1 | 3.465V | 3.135V | 2-4 CONVERSION | 9mm | 9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | LE9651PQCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 48-VFQFN Exposed Pad | YES | Industrial grade | -40°C~85°C | Tape & Reel (TR) | miSLIC™ | 活跃 | 3 (168 Hours) | 48 | 3.135V~3.465V | QUAD | 无铅 | 3.3V | 0.5mm | S-XQCC-N48 | Subscriber Line Interface Concept (SLIC) | 4-Wire | 1 | 25mA | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI32392-B-FM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 0°C~70°C | Tray | 2000 | ProSLIC® | 不用于新设计 | 3 (168 Hours) | 48 | 3.15V~3.45V | QUAD | 无铅 | 未说明 | 3.3V | 0.5mm | 未说明 | SI32392 | S-XQCC-N48 | Subscriber Line Interface Concept (SLIC) | 1 | 电信电路 | 0.9mm | 7mm | 7mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3201-KS | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) Exposed Pad | 16-SOIC | 189.431514mg | 0°C~70°C | Tube | 1998 | ProSLIC® | Obsolete | 1 (Unlimited) | 70°C | 0°C | 800mW | 800mW | 3.13V~5.25V | SI3201 | Subscriber Line Interface Concept (SLIC), CODEC | PCM, Serial, SPI | 1 | 3.13V | 88mA | 88mA | 88mA | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYP15G0201DXB-BBXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 196-LBGA | 196 | -40°C~65°C | Tray | 2003 | HOTlink II™ | e1 | yes | 活跃 | 5 (48 Hours) | 196 | 5A991.B.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | 20 | CY*15G02 | 收发器 | 3.3V | LVTTL | 2 | 710mA | 570mA | 1500000 Mbps | 2 | 1.5mm | 15mm | 15mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | MT8880CN1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 24-SSOP (0.209, 5.30mm Width) | 24 | 220.105698mg | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 24 | 哑光锡 | 1W | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 3.58MHz | 30 | DTMF 收发器 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 2mm | 8.2mm | 5.3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | LMC567CMX | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | -25°C~100°C | Tape & Reel (TR) | LMCMOS™ | e0 | no | Obsolete | 1 (Unlimited) | 8 | Tin/Lead (Sn/Pb) | 500mW | 2V~9V | DUAL | 鸥翼 | 235 | 5V | LMC567 | 音频解码器 | 1 | Decoder | 4.9mm | 3.9mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | SI32919-A-FS | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | 16 | 0°C~70°C | Tube | 2000 | ProSLIC® | 活跃 | 3 (168 Hours) | 3.13V~3.47V | 3.3V | SI3291* | Subscriber Line Interface Concept (SLIC), CODEC | 3.3V | 1 | 25mA | 电信电路 | 9.9mm | 3.9mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3215-C-FMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 38-VFQFN Exposed Pad | 38 | 0°C~70°C | Tape & Reel (TR) | 1998 | ProSLIC® | yes | 不用于新设计 | 3 (168 Hours) | 38 | 700mW | 3.13V~5.25V | QUAD | 260 | 3.3V | 0.5mm | 40 | SI3215 | Subscriber Line Interface Concept (SLIC), CODEC | GCI, PCM, SPI | 1 | 88mA | 0.95mm | 7mm | 5mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
 | SI3210-FT | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 38-TFSOP (0.173, 4.40mm Width) | 38 | 140.160042mg | 0°C~70°C | Tube | 1998 | ProSLIC® | e3 | yes | 不用于新设计 | 3 (168 Hours) | 38 | Matte Tin (Sn) | 700mW | 3.3V 5V | DUAL | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SI3210 | Subscriber Line Interface Concept (SLIC), CODEC | 5V | PCM, SPI | 1 | 88mA | CONSTANT CURRENT | 40 dB | 9.7mm | 4.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | M34116B1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 24-DIP (0.600, 15.24mm) | 24 | 0°C~70°C | Tube | e0 | no | Obsolete | 1 (Unlimited) | 24 | 锡铅 | 500mW | 4.75V~5.25V | DUAL | 5V | 2.54mm | M34116 | PCM Conference / Tone Generation Circuit | 5V | 5V | PCM | 1 | 50mA | 会议电路 | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MT8880CP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | LIMITED TIME BUY (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 1.182714g | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 28 | 哑光锡 | 1W | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 3.58MHz | 30 | DTMF 收发器 | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 4.57mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | VSC8488YJU-15 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago) | 表面贴装 | 196-LBGA, FCBGA | 196-FCBGA (15x15) | Tray | 2016 | 不用于新设计 | 3 (168 Hours) | 1W | 1.2V~3.3V | 收发器 | Serial | 1 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BU8788KN-E2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Tin | 表面贴装 | 表面贴装 | 36-VFQFN | 36 | -40°C~85°C | Tape & Reel (TR) | 2008 | yes | 不用于新设计 | 3 (168 Hours) | 36 | EAR99 | 450mW | 2.2V~3.6V | QUAD | 无铅 | 0.5mm | BU8788 | 声音发生器 | 不合格 | 3V | ADPCM | 1 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9173ANR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | SSOP | 24-SSOP | -40°C~85°C | Tape & Reel (TR) | e3 | 活跃 | 1 (Unlimited) | 24 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 30 | R-PDSO-G24 | Subscriber Line Interface Concept (SLIC) | 5V | 5V | 1 | 10mA | 160 kbps | 数码单反 | 0.005A | BASIC | S | 2.4V | 0.4V | 2mm | 8.2mm | 5.3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
| MT9171APR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 28-PLCC | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 4.75V~5.25V | Subscriber Line Interface Concept (SLIC) | 1 | 10mA | ROHS3 Compliant |