类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 过滤器 | 压缩法 | 负电源电压 | 晶振频率 | 长度 | 宽度 | ||||||||||||||
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.png) | SDC-SSD30AG | Laird, A DuPont Business | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | LAIRD TECHNOLOGIES INC | , | 有 | 未说明 | unknown | 未说明 | 电信电路 | ||||||||||||||||||||||||||||||||||||||||
| UM82C550 | United Microelectronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | UNITED MICROELECTRONICS CORP | , | 接触制造商 | unknown | ||||||||||||||||||||||||||||||||||||||||||||
| UM82C550 | Unicorn Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | UNICORN MICROELECTRONICS CORP | , | Obsolete | unknown | ||||||||||||||||||||||||||||||||||||||||||||
| QSC-6085-0-424CSP-TR-09 | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | S3018A/H1 | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | APPLIED MICRO CIRCUITS CORP | QFP | QFP, | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 5 V | 52 | Obsolete | ATM;SDH;SONET | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | 52 | S-PQFP-G52 | 不合格 | INDUSTRIAL | 260 mA | ATM/SONET/SDH RECEIVER | 10 mm | 10 mm | ||||||||||||||||||||
| PBL3781/02 | Ericsson | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | TJA1055T/3 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NXP SEMICONDUCTORS | SOIC | SOP, SOP14,.25 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | 小概要 | 5 V | 14 | 有 | EAR99 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 14 | R-PDSO-G14 | 不合格 | 0.021 mA | 1.75 mm | 电路接口 | 1 | 8.65 mm | 3.9 mm | |||||||||||||||||||
| TEF6657HN/V101 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | NXP SEMICONDUCTORS | 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-32 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCN | SQUARE | CHIP CARRIER | 3.3 V | 32 | 活跃 | 8542.39.00.01 | QUAD | 无铅 | 1 | unknown | S-PQCC-N32 | INDUSTRIAL | AEC-Q100 | 电信电路 | |||||||||||||||||||||||||||
| CX23754-31Z | Synaptics Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SYNAPTICS INC | , | Obsolete | 8542.39.00.01 | compliant | PCM 编解码器 | ||||||||||||||||||||||||||||||||||||||||||
| CX23754-31Z | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 康讯系统 | , | Transferred | compliant | PCM 编解码器 | |||||||||||||||||||||||||||||||||||||||||||
 | BCM5682 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | BROADCOM CORP | BGA | BGA, | 1 | PLASTIC/EPOXY | BGA | 网格排列 | 2.5 V | 400 | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 400 | X-PBGA-B400 | 不合格 | 电信电路 | |||||||||||||||||||||||||||
 | PCF5079HK/C/1 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NXP SEMICONDUCTORS | SON | 3 X 3 X 0.90 MM, PLASTIC, HVSON-10 | 85 °C | -40 °C | PLASTIC/EPOXY | SON | SOLCC10,.11,20 | SQUARE | 小概要 | 3.6 V | 10 | 无 | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.5 mm | unknown | 10 | S-PDSO-N10 | 不合格 | INDUSTRIAL | 0.01 mA | 电信电路 | |||||||||||||||||||||
| TMS38054FNLR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | TEXAS INSTRUMENTS INC | LCC | PLASTIC, LCC-44 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 5 V | 44 | 无 | 无 | 8542.39.00.01 | QUAD | J BEND | 未说明 | 1 | 1.27 mm | not_compliant | 未说明 | 44 | S-PQCC-J44 | 不合格 | COMMERCIAL | 0.2 mA | 16000 Mbps | 4.57 mm | 令牌环收发器 | 1 | 16.5862 mm | 16.5862 mm | ||||||||||||||
| LAN88730AM-C | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | MICROCHIP TECHNOLOGY INC | HVQCCN, | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | 32 | 有 | e3 | EAR99 | 哑光锡 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-PQCC-N32 | INDUSTRIAL | 0.9 mm | TS 16949 | 以太网收发器 | 5 mm | 5 mm | |||||||||||||||||||
 | SK70707PH | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEL CORP | LCC | QCCJ, LDCC68,1.0SQ | 85 °C | -5 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | RECTANGULAR | CHIP CARRIER | 5 V | 68 | 无 | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | compliant | 68 | R-PQCC-J68 | 不合格 | OTHER | 175 mA | 1168 Mbps | 4.57 mm | 数码单反 | 24.2316 mm | 24.2316 mm | ||||||||||||||
| SDA5640 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | 5 V | 14 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T14 | 不合格 | COMMERCIAL | 曼彻斯特解码器 | |||||||||||||||||||||||||
 | TC35302P | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | TOSHIBA CORP | DIP | DIP, | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | 18 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | 18 | R-PDIP-T18 | 不合格 | 7 mA | DTMF信号电路 | ||||||||||||||||||||||||
| TCM129C16DWR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TEXAS INSTRUMENTS INC | SOP, | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 16 | Obsolete | FULL DUPLEX | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G16 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 13 mA | 2.65 mm | PCM 编解码器 | YES | MU-LAW | -5 V | 10.3 mm | 7.5 mm | |||||||||||||||||
| GD16589-EF | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | INTEL CORP | BGA | BGA, | 70 °C | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | 网格排列 | 132 | Obsolete | SONET;SDH | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | 132 | S-CBGA-B132 | 不合格 | COMMERCIAL | 2.1 mm | ATM/SONET/SDH MUX/DEMUX | -5.2 V | 13 mm | 13 mm | |||||||||||||||||||||
| S2559F | onsemi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
| RF2498 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RF MICRO DEVICES INC | QFN | QCCN, | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCN | SQUARE | CHIP CARRIER | 2.75 V | 32 | 无 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 32 | S-PQCC-N32 | 不合格 | INDUSTRIAL | 0.9 mm | 射频和基带电路 | 5 mm | 5 mm | |||||||||||||||||||
| S2559F | AMI Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | AMI SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 16 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | COMMERCIAL | 16 mA | 3.58 MHz | |||||||||||||||||||||||||
 | RF2945 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RF MICRO DEVICES INC | QFP | LFQFP, QFP32,.28SQ,20 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | QFP32,.28SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.6 V | 32 | 无 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | unknown | 32 | S-PQFP-G32 | 不合格 | INDUSTRIAL | 1.6 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||||
| PEB3265F | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
| HPMX-5002 | Agilent Technologies Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | AGILENT TECHNOLOGIES INC | QFP, QFP48,.35SQ,20 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3 V | 48 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | unknown | S-PQFP-G48 | 不合格 | 27 mA | 1.6 mm | 无绳电话基带电路 | 7 mm | 7 mm |