类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 应用 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 负电源电压 | 长度 | 宽度 | ||||||||||||||
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![]() | TDK5110 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INFINEON TECHNOLOGIES AG | TSSOP | TSSOP, TSSOP16,.25 | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 16 | 有 | e3 | 有 | TIN | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 16 | R-PDSO-G16 | 不合格 | AUTOMOTIVE | 0.019 mA | 1.2 mm | 电信电路 | 5 mm | 4.4 mm | ||||||||
![]() | T-7288-EL-TR | Legerity | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | 7289-9710-30 | Yazaki Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | MAX3873EGP | Maxim Integrated Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.90 MM HEIGHT, EXPOSED PAD, QFN-20 | 1 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | VQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | 3.3 V | 20 | 无 | e0 | 无 | EAR99 | 锡铅 | SDH; SONET | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | not_compliant | 20 | S-CQCC-N20 | 不合格 | INDUSTRIAL | 1 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 4 mm | 4 mm | ||||||||
![]() | BCM5464S | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | BROADCOM CORP | BGA | BGA, | 1 | PLASTIC/EPOXY | BGA | UNSPECIFIED | 网格排列 | 354 | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 354 | X-PBGA-B354 | 不合格 | 以太网收发器 | ||||||||||||||||||||||
![]() | S3092CB | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | SM8224CM-G-E2 | Seiko NPC Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | STA8088 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | STMICROELECTRONICS | 7 X 7 MM, 0.85 MM HEIGHT, 0.40 PITCH, ROHS COMPLIANT, VFQFPN-56 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | 56 | 活跃 | QUAD | 无铅 | 1 | 0.4 mm | compliant | S-XQCC-N56 | INDUSTRIAL | 0.9 mm | AEC-Q100 | 电信电路 | 7 mm | 7 mm | |||||||||||||||||||
![]() | 2053-256-A-0 | Alpha Grainger Mfg Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | BCM7041 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | BROADCOM CORP | BGA | BGA, | PLASTIC/EPOXY | BGA | UNSPECIFIED | 网格排列 | 1.8 V | 256 | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 256 | X-PBGA-B256 | 不合格 | 电信电路 | ||||||||||||||||||||||
![]() | LM96530SQE | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TEXAS INSTRUMENTS INC | QFN | VQCCN, | 70 °C | UNSPECIFIED | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | 5 V | 60 | Obsolete | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 60 | S-XQCC-N60 | COMMERCIAL | 0.8 mm | 电信电路 | -5 V | 9 mm | 9 mm | |||||||||||||||||
![]() | RFAC3612TR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | RF MICRO DEVICES INC | BCC, | 85 °C | -40 °C | PLASTIC/EPOXY | BCC | RECTANGULAR | CHIP CARRIER | 2.85 V | 10 | Obsolete | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.5 mm | unknown | R-PBCC-B10 | INDUSTRIAL | 1.195 mm | 电信电路 | 2.5 mm | 2 mm | |||||||||||||||||||
![]() | RFAC3612TR7 | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | QORVO INC | 2 X 2.50 MM, GREEN, PACKAGE-10 | 85 °C | -40 °C | PLASTIC/EPOXY | BCC | RECTANGULAR | CHIP CARRIER | 2.85 V | 10 | Obsolete | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.5 mm | compliant | R-PBCC-B10 | INDUSTRIAL | 1.195 mm | 电信电路 | 2.5 mm | 2 mm | |||||||||||||||||||
![]() | TGA8652-SL | TriQuint Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TRIQUINT SEMICONDUCTOR INC | LGA | LGA, | PLASTIC/EPOXY | LGA | SQUARE | 网格排列 | 12 | Obsolete | e4 | 镍上闪金 | 8542.39.00.01 | BOTTOM | 无铅 | 1 | unknown | 12 | S-PBGA-N12 | 不合格 | 2.1336 mm | 电信电路 | |||||||||||||||||||||
![]() | BCM43143KMLGT | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | LXT9781BC | Cortina Systems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | CORTINA SYSTEMS INC | BGA | BGA, | 70 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.3 V | 272 | Transferred | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | compliant | 272 | S-PBGA-B272 | 不合格 | COMMERCIAL | 2.32 mm | 以太网收发器 | 27 mm | 27 mm | |||||||||||||||||
![]() | LXT9781BC | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | INTEL CORP | BGA | BGA, BGA272,20X20,50 | 70 °C | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | 网格排列 | 3.3 V | 272 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 272 | S-PBGA-B272 | 不合格 | COMMERCIAL | 1.1 mA | 100000 Mbps | 2.32 mm | 以太网收发器 | 8 | 27 mm | 27 mm | ||||||||||
![]() | PMB2200SV2.1 | Siemens | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | UPD98412N7-H6 | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NEC ELECTRONICS CORP | BGA | LBGA, | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.3 V | 576 | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | compliant | 576 | S-PBGA-B576 | 不合格 | INDUSTRIAL | 1.7 mm | ATM/SONET/SDH SWITCHING CIRCUIT | 40 mm | 40 mm | |||||||||||||
![]() | UPD98412N7-H6 | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RENESAS ELECTRONICS CORP | BGA, BGA576,30X30,50 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA576,30X30,50 | SQUARE | 网格排列 | 3.3 V | 576 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B576 | 不合格 | INDUSTRIAL | 1300 mA | ||||||||||||||||||
![]() | ATA5702F1000M-WDQW-V04 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | RF6519 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | RF MICRO DEVICES INC | QCCN, LCC28,.2X.24,25 | UNSPECIFIED | QCCN | LCC28,.2X.24,25 | SQUARE | CHIP CARRIER | 4.2 V | 20 | 有 | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 1 | 0.635 mm | unknown | S-XQCC-N20 | 不合格 | 电信电路 | |||||||||||||||||||||
![]() | RF6519 | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | QORVO INC | QCCN, LCC28,.2X.24,25 | UNSPECIFIED | QCCN | LCC28,.2X.24,25 | SQUARE | CHIP CARRIER | 4.2 V | 20 | 有 | 8542.39.00.01 | QUAD | 无铅 | 未说明 | 1 | 0.635 mm | compliant | 未说明 | S-XQCC-N20 | 不合格 | 电信电路 | ||||||||||||||||||||
![]() | PEB4266 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 接触制造商 | INTEL CORP | SOP, | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3.3 V | 20 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G20 | 不合格 | COMMERCIAL | 3.7 mm | SLIC | 15.9 mm | 11 mm | ||||||||||||||||
![]() | SK70742QE | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEL CORP | QFP | QFP, QFP64,.66SQ,32 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | 3.3 V | 64 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | compliant | 64 | S-PQFP-G64 | 不合格 | INDUSTRIAL | 65 mA | 3 mm | FRAMER | 14 mm | 14 mm |