类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 过滤器 | 压缩法 | 负电源电压 | 增益公差-最大 | 线性编码 | 运输载体类型 | 电池供电 | PSRR-Min | 电池供电 | 马克斯噪音 | 突破比率 | 长度 | 宽度 | |||||||||||||||
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![]() | ADN2865ACP-RL | Analog Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ANALOG DEVICES INC | QFN | 8 X 8 MM, MO-220-VLLD-2, LFCSP-56 | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 56 | 无 | SDH; SONET | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | compliant | 56 | S-XQCC-N56 | 不合格 | INDUSTRIAL | 350 mA | 1 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 8 mm | 8 mm | |||||||||||||||||||||||
![]() | UE910-NAR | Telit | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | TELIT COMMUNICATIONS PLC | LGA, | UNSPECIFIED | LGA | SQUARE | 网格排列 | 3.8 V | 有 | 8542.39.00.01 | BOTTOM | BUTT | 未说明 | 1 | unknown | 未说明 | S-XBGA-B | 2.2 mm | 电信电路 | 28.2 mm | 28.2 mm | |||||||||||||||||||||||||||||||||
![]() | BCM1115 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | BROADCOM CORP | BGA | BGA, | 1 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.8 V | 256 | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 256 | S-PBGA-B256 | 不合格 | 电信电路 | |||||||||||||||||||||||||||||||||
![]() | AK4671EG | Asahi Kasei Microsystems Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | ASAHI KASEI MICRODEVICES CORP | BGA | VFBGA, | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3.3 V | 57 | Obsolete | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.5 mm | unknown | 57 | S-PBGA-B57 | 不合格 | OTHER | SYNCHRONOUS | 1 mm | ADPCM 编解码器 | YES | A/MU-LAW | 5 mm | 5 mm | |||||||||||||||||||||||
![]() | BU8325K | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | ROHM CO LTD | QFP | LQFP, | 60 °C | -10 °C | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | 3 V | 32 | Obsolete | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | 32 | S-PQFP-G32 | 不合格 | COMMERCIAL | 1.6 mm | 电话拨号电路 | 1.1:1 | 7 mm | 7 mm | |||||||||||||||||||||||||||
![]() | SM9103M | Nippon Precision Circuits Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | NIPPON PRECISION CIRCUITS INC | SSOP, SOP36,.4,32 | 70 °C | PLASTIC/EPOXY | SSOP | SOP36,.4,32 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 5 V | 36 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.8 mm | unknown | R-PDSO-G36 | 不合格 | COMMERCIAL | 30 mA | ||||||||||||||||||||||||||||||
![]() | RM024-S50-C | Laird, A DuPont Business | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S3098CB12 | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | APPLIED MICRO CIRCUITS CORP | BGA | BGA, BGA148,14X14,40 | 85 °C | UNSPECIFIED | BGA | BGA148,14X14,40 | SQUARE | 网格排列 | 2.5 V | 148 | Obsolete | ATM; SDH; SONET | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | unknown | 148 | S-XBGA-B148 | 不合格 | OTHER | 3.1 mm | ATM/SONET/SDH RECEIVER | -5.2 V | 15 mm | 15 mm | ||||||||||||||||||||||||||
![]() | T-7121-EL2-TR | Legerity | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TP3204N | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | NATIONAL SEMICONDUCTOR CORP | PLASTIC, DIP-20 | 70 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | -48 V | 20 | 无 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T20 | 不合格 | COMMERCIAL | 4.7 mA | 5.08 mm | SLIC | -5 V | 38 dB | CONSTANT CURRENT | 10 dBrnC | 26.075 mm | 7.62 mm | ||||||||||||||||||||||
![]() | TP3204N | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, DIP20,.3 | 70 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | -48 V | 20 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T20 | 不合格 | COMMERCIAL | 4.7 mA | 5.08 mm | SLIC | -5 V | 38 dB | CONSTANT CURRENT | 10 dBrnC | 26.075 mm | 7.62 mm | |||||||||||||||||||||
![]() | KGL4186KD | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | LAPIS SEMICONDUCTOR CO LTD | QFN | QCCN, | UNSPECIFIED | QCCN | SQUARE | CHIP CARRIER | 3.3 V | 14 | 有 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 14 | S-XQCC-N14 | 不合格 | 1.65 mm | 电信电路 | 4 mm | 4 mm | ||||||||||||||||||||||||||||||
![]() | UM91214B | United Microelectronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | UNITED MICROELECTRONICS CORP | , | 70 °C | -20 °C | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | 3.5 V | 18 | Obsolete | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T18 | 不合格 | COMMERCIAL | 2 mA | 电话拨号电路 | 1:2 | |||||||||||||||||||||||||||||||||
![]() | UM91214B | Unicorn Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | UNICORN MICROELECTRONICS CORP | , | Obsolete | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF5765 | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | QORVO INC | HVQCCN, LCC16,.12SQ,20 | 70 °C | -10 °C | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 16 | 有 | 5A991.G | 8542.39.00.01 | QUAD | 无铅 | 未说明 | 1 | 0.5 mm | compliant | 未说明 | S-XQCC-N16 | 不合格 | COMMERCIAL | 0.29 mA | 0.58 mm | 射频和基带电路 | 3 mm | 3 mm | ||||||||||||||||||||||||
![]() | RF5765 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | RF MICRO DEVICES INC | QFN | HVQCCN, LCC16,.12SQ,20 | 2 | 70 °C | -10 °C | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 16 | 有 | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 16 | S-XQCC-N16 | 不合格 | COMMERCIAL | 0.29 mA | 0.58 mm | 射频和基带电路 | 3 mm | 3 mm | |||||||||||||||||||||||
![]() | PEF22554HT | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 接触制造商 | INTEL CORP | GREEN, PLASTIC, LBGA-160 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 1.8 V | 160 | 有 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 未说明 | S-PBGA-B160 | 不合格 | INDUSTRIAL | 230 mA | 1.6 mm | FRAMER | 15 mm | 15 mm | ||||||||||||||||||||||||||
![]() | PEF22554HT | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | INFINEON TECHNOLOGIES AG | BGA | LBGA, QFP144,.87SQ,20 | T-1(DS1) | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | QFP144,.87SQ,20 | SQUARE | GRID ARRAY, LOW PROFILE | 1.8 V | 160 | Transferred | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | 160 | S-PBGA-B160 | 不合格 | INDUSTRIAL | 1.6 mm | FRAMER | CEPT PCM-30/E-1 | 15 mm | 15 mm | |||||||||||||||||||||||
![]() | TCM2917J | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | TEXAS INSTRUMENTS INC | DIP, DIP16,.3 | 70 °C | CERAMIC, GLASS-SEALED | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 16 | 无 | FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | not_compliant | 未说明 | R-GDIP-T16 | 不合格 | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 19 mA | 5.08 mm | PCM 编解码器 | YES | A-LAW | -5 V | 0.18 dB | 不提供 | 19.56 mm | 7.62 mm | |||||||||||||||||||
![]() | MSM7543RS | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | LAPIS SEMICONDUCTOR CO LTD | DIP, DIP20,.3 | 85 °C | -30 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | 20 | Obsolete | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T20 | 不合格 | OTHER | 6 mA | PCM 编解码器 | YES | MU-LAW | 1.2 dB | 不提供 | |||||||||||||||||||||||||||
![]() | PHYCFR100JT-52-6K8 | YAGEO Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCP2562T-E/SNVAO | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MICROCHIP TECHNOLOGY INC | SOIC-8 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | 8 | 不推荐 | e3 | EAR99 | 哑光锡 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G8 | AUTOMOTIVE | 70 mA | 1000 Mbps | 1.75 mm | AEC-Q100; TS 16949 | 可收发器 | 1 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||
![]() | TP3054NCB | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF6505TR13 | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | QORVO INC | HVQCCN, | 2 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.6 V | 20 | 有 | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-XQCC-N20 | 不合格 | INDUSTRIAL | 0.6 mm | 电信电路 | 3.5 mm | 3.5 mm | |||||||||||||||||||||||||||
![]() | STLC5460FN | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | STMICROELECTRONICS | , | Obsolete | unknown |