类别是'存储器 - 模块'
存储器 - 模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | Clock Frequency (fc) | Connector pinout layout | Contacts pitch | Date Of Intro | Electrical mounting | Kind of connector | Row pitch | Spatial orientation | Type of connector | 操作温度 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 个人资料 | 长度 | 宽度 | |||||||||||||||||||||
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W25X40CVUXBG | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | WINBOND ELECTRONICS CORP | HVSON, | 80 MHz | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | socket | 8 | 2x28 | 2.54mm | THT | female | 2.54mm | straight | 有 | pin strips | EAR99 | 8542.32.00.51 | DUAL | 无铅 | 未说明 | 1 | 0.5 mm | compliant | 未说明 | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.6 V | SYNCHRONOUS | 512KX8 | 3-STATE | 0.6 mm | 8 | 4194304 bit | AEC-Q100 | SERIAL | FLASH | 3 V | beryllium copper | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||||
S25FL064K0SMFI013 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | SOIC | 0.208 INCH, LEAD FREE, PLASTIC, SOP-8 | 80 MHz | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | 小概要 | 3 V | socket | 8 | 2x17 | 2.54mm | THT | female | 2.54mm | straight | 有 | pin strips | 3A991.B.1.A | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | unknown | 未说明 | 8 | S-PDSO-G8 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 8MX8 | 2.159 mm | 8 | 0.000005 A | 67108864 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | beryllium copper | 5.283 mm | 5.283 mm | ||||||||||||||||||||||||||||
M25P16-VMP6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | STMICROELECTRONICS | DFP | SON, SOLCC8,.25 | 50 MHz | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SON | SOLCC8,.25 | RECTANGULAR | 小概要 | 3 V | socket | 8 | 2x40 | 2.54mm | THT | female | 2.54mm | straight | 无 | pin strips | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | DUAL | 无铅 | 1 | 1.27 mm | not_compliant | 8 | R-PDSO-N8 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.015 mA | 2MX8 | 1 mm | 8 | 0.00001 A | 16777216 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | beryllium copper | 6 mm | 5 mm | ||||||||||||||||||||||||||||
NAND02GR3B2DZA6E | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Transferred | STMICROELECTRONICS | FBGA, BGA63,10X12,32 | 20 ns | 268435456 words | 256000000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 63 | 2x27 | 2.54mm | THT | female | 2.54mm | straight | socket | pin strips | EAR99 | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B63 | 不合格 | INDUSTRIAL | 0.02 mA | 256MX8 | 8 | 0.00005 A | 2147483648 bit | PARALLEL | FLASH | NO | NO | YES | 2K | 128K | 2K words | YES | bronze | ||||||||||||||||||||||||||||||||||||||
CSNP1GCR01-BOW | Creat Storage World | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 50MHz | true | -30℃~+85℃ | 2.7V~3.6V | 1Gbit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
W25Q16CVTCIP | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | WINBOND ELECTRONICS CORP | BGA | 8 X 6 MM, GREEN, TFBGA-24 | 80 MHz | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | 24 | 有 | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | unknown | 24 | R-PBGA-B24 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 2MX8 | 3-STATE | 1.2 mm | 8 | 0.000005 A | 16777216 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 8 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||
GLS85LS1002A-M-I-FZJE | Greenliant Systems Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | GREENLIANT SYSTEMS LTD | , | 接触制造商 | EAR99 | MLC NAND TYPE | 8542.32.00.51 | compliant | FLASH | 3.3 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS25WP064A-QBLA3 | Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | INTEGRATED SILICON SOLUTION INC | SOP, | 133 MHz | 8388608 words | 8000000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SQUARE | 小概要 | 1.8 V | 8 | 活跃 | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 250 | 1 | 1.27 mm | unknown | 30 | S-PDSO-G8 | 1.95 V | AUTOMOTIVE | 1.65 V | SYNCHRONOUS | 8MX8 | 3-STATE | 2.16 mm | 8 | 67108864 bit | AEC-Q100 | SERIAL | FLASH | 1.8 V | QSPI | 20 | HARDWARE/SOFTWARE | 5.28 mm | 5.28 mm | |||||||||||||||||||||||||||||||||||||||||||
THGBMJG6C1LBAB7 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TOSHIBA CORP | VFBGA-153 | 52 MHz | 8589934592 words | 8000000000 | 105 °C | -40 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3.3 V | 153 | 2019-04-18 | Transferred | EAR99 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.5 mm | unknown | R-PBGA-B153 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 8GX8 | 1 mm | 8 | 68719476736 bit | AEC-Q100 | PARALLEL | FLASH MODULE | 3.3 V | 13 mm | 11.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
H9HCNNNBKUMLXR-NEE | SK HYNIX | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | true | 16Gbit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
P25T22H-SSH-IT | PUYAï¼ | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | true | Tube-packed | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EN25T16A-75QIP | Elite Semiconductor Memory Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | DIP, | 75 MHz | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 3 V | 8 | 接触制造商 | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 2MX8 | 5.334 mm | 8 | 16777216 bit | SERIAL | FLASH | 2.7 V | 9.271 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
SST39VF1601-70-4I-B3KE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | SILICON STORAGE TECHNOLOGY INC | BGA | 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 70 ns | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 48 | 有 | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 1MX16 | 1.2 mm | 16 | 0.00002 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 512 | 2K | BOTTOM | YES | 8 mm | 6 mm | |||||||||||||||||||||||||||||||||||
SST39VF6401B-70-4I-B1KE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SILICON STORAGE TECHNOLOGY INC | BGA | 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210, TFBGA-48 | 70 ns | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 48 | 有 | e1 | EAR99 | NOR型号 | 锡银铜 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 10 | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 4MX16 | 1.2 mm | 16 | 0.00002 A | 67108864 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 2K | 2K | BOTTOM | YES | 10 mm | 8 mm | ||||||||||||||||||||||||||||||||
S29GL256P10FFI013 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | ADVANCED MICRO DEVICES INC | 100 ns | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | 网格排列 | 64 | 有 | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | unknown | S-PBGA-B64 | 不合格 | INDUSTRIAL | ASYNCHRONOUS | 0.08 mA | 16MX16 | 3-STATE | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | |||||||||||||||||||||||||||||||||||||||||||
S29GL256P10FFI013 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | SPANSION INC | BGA | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | 100 ns | 3 | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3 V | 64 | 有 | e1 | 有 | 3A991.B.1.A | NOR型号 | 锡银铜 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | unknown | 40 | 64 | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.11 mA | 16MX16 | 3-STATE | 1.4 mm | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | 13 mm | 11 mm | |||||||||||||||||||||||||||
M29W160ET70N6 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | NUMONYX | TSOP | 12 X 20 MM, PLASTIC, TSOP-48 | 70 ns | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 48 | 无 | EAR99 | NOR型号 | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 1MX16 | 1.2 mm | 16 | 0.0001 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | YES | TOP | YES | 18.4 mm | 12 mm | |||||||||||||||||||||||||||||||||
PM49FL004T-33JCE | BHC Components / KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PM49FL004T-33JCE | Programmable Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | PROGRAMMABLE MICROELECTRONICS CORP | 120 ns | 524288 words | 512000 | 85 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 3.3 V | 32 | 有 | EAR99 | NOR型号 | 8542.32.00.51 | QUAD | J BEND | 1.27 mm | unknown | R-PQCC-J32 | 不合格 | OTHER | 0.02 mA | 512KX8 | 8 | 0.0005 A | 4194304 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 4K | TOP | |||||||||||||||||||||||||||||||||||||||||||||||||
RC28F128J3F75 | Alliance Memory Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | ALLIANCE MEMORY INC | FBGA-64 | 75 ns | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | 64 | 活跃 | NOR型号 | BOTTOM | BALL | 1 | 1 mm | unknown | R-PBGA-B64 | 3.6 V | 2.7 V | ASYNCHRONOUS | 0.07 mA | 128MX1 | OPEN-DRAIN | 1.2 mm | 1 | 0.002 A | 134217728 bit | PARALLEL | FLASH | 3 V | 100000 Write/Erase Cycles | 0.000075 ms | YES | NO | NO | 128 | 64K | YES | YES | 13 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||
RC28F128J3F75 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | BGA | BGA-64 | 75 ns | 1 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | 64 | 无 | e0 | 无 | EAR99 | NOR型号 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.32.00.51 | BOTTOM | BALL | 235 | 1 | 1 mm | unknown | 30 | 64 | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.054 mA | 8MX16 | 1.2 mm | 16 | 0.00012 A | 134217728 bit | PARALLEL | FLASH | 2.7 V | 8 | NO | NO | YES | 128 | 128K | 4/8 words | YES | YES | 13 mm | 10 mm | ||||||||||||||||||||||||||||
S34ML04G100TFI00 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
W25Q256JVFIN | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS25LP064D-QBLA3-TR | Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MZ7L3480HCHQ-00A07 | Samsung Electronics Co. Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 |