类别是'嵌入式 - 微控制器 - 应用特定'
嵌入式 - 微控制器 - 应用特定 (5239)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 端口的数量 | uPs/uCs/外围ICs类型 | 比特数 | 电源电流-最大值 | 位元大小 | 座位高度-最大 | 地址总线宽度 | 处理器系列 | 主时钟/晶体频率-名 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 输出时钟频率-最大值 | 内存(字) | 串行I/O数 | 定时器数量 | 总线兼容性 | 片上数据 RAM 宽度 | 最大数据传输率 | 通信协议 | 信息访问方法 | 数据编码/解码方式 | 主机数据传输速率-最大 | 驱动接口标准 | 主机接口标准 | 显示配置 | 库存数量 | 组织的记忆 | 长度 | 宽度 | ||||||||||||||||||
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MD82C85 | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | HARRIS SEMICONDUCTOR | , | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | 24 | Obsolete | EAR99 | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-GDIP-T24 | 不合格 | MILITARY | CLOCK GENERATOR, PROCESSOR SPECIFIC | 50 mA | 25 MHz | 25 MHz | ||||||||||||||||||||||||||||||||||||||||||
MD82C85 | Harris Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | HARRIS SEMICONDUCTOR | , | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | 24 | Obsolete | EAR99 | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-GDIP-T24 | 不合格 | MILITARY | CLOCK GENERATOR, PROCESSOR SPECIFIC | 50 mA | 25 MHz | 25 MHz | ||||||||||||||||||||||||||||||||||||||||||
RS5C313-E2 | Ricoh Electronic Devices Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RICOH ELECTRONIC DEVICES CO LTD | SOIC | LSSOP, | 0.032 MHz | 1 | 80 °C | -30 °C | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 6 V | 2.7 V | 3 V | 8 | 无 | EAR99 | 8542.39.00.01 | DUAL | 鸥翼 | 0.65 mm | unknown | 8 | R-PDSO-G8 | 不合格 | 商业扩展 | TIMER, REAL TIME CLOCK | 1.45 mm | SERIAL, FIXED PROTOCOL | 4.4 mm | 3.5 mm | |||||||||||||||||||||||||||||||||||
ASM3P2812A-08SR | Alliance Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | ALLIANCE SEMICONDUCTOR CORP | , | 无 | EAR99 | 8542.39.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC68230LC10 | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | MOTOROLA INC | DIP | DIP, | 10 MHz | 24 | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | 48 | 无 | e0 | EAR99 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 48 | R-CDIP-T48 | 不合格 | COMMERCIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 4.31 mm | 8 | 60.96 mm | 15.24 mm | |||||||||||||||||||||||||||||||||
CL-GD5446-3QC-A | Cirrus Logic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | CIRRUS LOGIC INC | QFP | FQFP, QFP208,1.2SQ,20 | 70 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 3.3 V | 208 | 无 | e0 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | 208 | S-PQFP-G208 | 不合格 | COMMERCIAL | DISPLAY CONTROLLER, CRT GRAPHICS DISPLAY | 64 | 4.07 mm | 32 | 32 | PCI | 1280 X 1024 PIXELS | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||
TMP8155P | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 活跃 | TOSHIBA CORP | 22 | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | DIP, DIP40,.6 | 40 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | 不合格 | COMMERCIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 14 | 180 mA | 4.8 mm | 8085 | 8 | 1 | 256X8 | 50.7 mm | 15.24 mm | ||||||||||||||||||||||||||||||
MD2202-D96-X | M-Systems Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | M-SYSTEMS CORP | DIP, DIP32,.6 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | 5 V | 32 | 无 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 240 | 2.54 mm | unknown | R-PDIP-T32 | 不合格 | INDUSTRIAL | 60 mA | ||||||||||||||||||||||||||||||||||||||||||||
NHI-1561RT | National Hybrid Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | NATIONAL HYBRID INC | PGA | PGA-69 | 10 MHz | 85 °C | -25 °C | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | 网格排列 | 5.5 V | 4.5 V | 5 V | 69 | Transferred | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 69 | S-CPGA-P69 | 不合格 | OTHER | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 | 675 mA | 3.81 mm | 12 | NO | NO | 16 | 4096 | 2 | 8 | 0.125 MBps | MIL-STD-1553B; MIL-STD-1760A | BIPH-LEVEL(MANCHESTER) | 27.94 mm | 27.94 mm | ||||||||||||||||||||||||||||
MPC8272CVRMIB | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | NXP SEMICONDUCTORS | BGA, BGA516,26X26,40 | PLASTIC/EPOXY | BGA | BGA516,26X26,40 | SQUARE | 网格排列 | 516 | 有 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B516 | 不合格 | ||||||||||||||||||||||||||||||||||||||||||||||||||
L6570A | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | STMICROELECTRONICS | , | Obsolete | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STP2200BGA-100 | Sun Microsystems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | SUN MICROSYSTEMS INC | BGA | BGA, | 100 MHz | 70 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 5.25 V | 3.15 V | 5 V | 225 | Obsolete | 8542.31.00.01 | BOTTOM | BALL | 1.5 mm | unknown | 225 | S-PBGA-B225 | 不合格 | COMMERCIAL | MEMORY CONTROLLER, DRAM | 758 mA | 2.48 mm | 35 | YES | NO | SPARCII; SPARCI | 4 | 256M X 8 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||
BCM5632 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | BROADCOM CORP | BGA | BGA, | 1 | PLASTIC/EPOXY | BGA | UNSPECIFIED | 网格排列 | 785 | 无 | 8542.31.00.01 | BOTTOM | BALL | compliant | 785 | X-PBGA-B785 | 不合格 | 微处理器电路 | ||||||||||||||||||||||||||||||||||||||||||||||||
XQ7Z030-2RF900I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | XILINX INC | 31 X 31 MM, 1 MM PITCH, BGA-900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 900 | 无 | e0 | 锡铅 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | S-PBGA-B900 | 不合格 | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||
XQ7Z030-2RF900I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | 31 X 31 MM, 1 MM PITCH, BGA-900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 900 | 无 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | 不合格 | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||
XCZU7CG-2LFFVF1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-1517 | 4 | 110 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.85 V | 1517 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||
UPD7262D | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
UPD7262D | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | RENESAS ELECTRONICS CORP | 70 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5 V | 40 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||||||||||||||||||||||
NAS8702U1 | Heartland Precision Fasteners Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SST85LD1001K-60-4C-LBTE | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | MICROCHIP TECHNOLOGY INC | BGA | 12 X 24 MM, ROHS COMPLIANT, MO-210, LBGA-91 | 70 °C | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3.3 V | 91 | 有 | 有 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 40 | 91 | R-PBGA-B91 | 不合格 | COMMERCIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 1.4 mm | 16 | 13 MBps | IDE | ATA | 24 mm | 12 mm | ||||||||||||||||||||||||||||||||||
SST85LD1001K-60-4C-LBTE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | SILICON STORAGE TECHNOLOGY INC | BGA | LBGA, | 70 °C | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3.3 V | 91 | 有 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1 mm | unknown | 40 | 91 | R-PBGA-B91 | 不合格 | COMMERCIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 1.4 mm | 16 | 13 MBps | IDE | ATA | 24 mm | 12 mm | |||||||||||||||||||||||||||||||||||
XQ7Z030-1RF900I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | XILINX INC | 31 X 31 MM, 1 MM PITCH, BGA-900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 900 | 无 | e0 | 锡铅 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | S-PBGA-B900 | 不合格 | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||
TC8522XBG(O2) | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC68824FN10 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | QCCJ, LDCC84,1.2SQ | 33 MHz | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | 84 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J84 | 不合格 | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 32 | NO | 32 | 2 | 50 MBps | SYNC, BYTE | |||||||||||||||||||||||||||||||||||
MC68824FN10 | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MOTOROLA INC | 33 MHz | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | 84 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J84 | 不合格 | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 32 | NO | 32 | 2 | 50 MBps | SYNC, BYTE |