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类别是'嵌入式 - 微控制器 - 应用特定'

嵌入式 - 微控制器 - 应用特定 (5239)

产品型号	品牌	数据表	有效性	单价(CNY)	询价	表面安装	终端数量		Date Of Intro																		JESD-609代码	无铅代码	ECCN 代码	端子表面处理	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	温度等级	端口的数量	uPs/uCs/外围ICs类型	比特数	电源电流-最大值	座位高度-最大	地址总线宽度	主时钟/晶体频率-名	边界扫描	低功率模式	外部数据总线宽度	输出时钟频率-最大值	内存(字)	串行I/O数	定时器数量	总线兼容性	最大数据传输率	通信协议	信息访问方法	数据编码/解码方式
PL-25A1	Prolific Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	PROLIFIC TECHNOLOGY INC	,				接触制造商					8542.31.00.01					unknown
ICS9150F-02	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	SSOP	SSOP-56	70 °C	PLASTIC/EPOXY	SSOP	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	3.7 V	3 V	3.3 V	56	1997-09-18	无	e0	无	EAR99	锡铅	8542.39.00.01	DUAL	鸥翼		0.635 mm	compliant		56	R-PDSO-G56	不合格	COMMERCIAL		CLOCK GENERATOR, PROCESSOR SPECIFIC			2.794 mm		14.318 MHz				66.6 MHz									18.415 mm	7.5 mm
PLL702-01XC	Microchip Technology Inc	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	MICROCHIP TECHNOLOGY INC	SSOP-28	70 °C	PLASTIC	SSOP	SSOP28,.3	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	3.63 V	2.25 V	3.3 V	28		活跃			EAR99		8542.39.00.01	DUAL	鸥翼		0.65 mm	compliant			R-PDSO-G28		COMMERCIAL		CLOCK GENERATOR, OTHER			2 mm		14.318 MHz				133 MHz									10.2 mm	5.3 mm
PT7C4512W	Pericom Semiconductor Corporation	数据表	N/A	-	最小起订量: 1 倍率: 1	PERICOM SEMICONDUCTOR CORP	SOIC	,				Transferred			EAR99		8542.39.00.01					unknown		8
CA82C55A-8CP	Tundra Semiconductor Corp	数据表	N/A	-	最小起订量: 1 倍率: 1	NO	Obsolete	TUNDRA SEMICONDUCTOR CORP	PLASTIC, DIP-40	8 MHz	24	70 °C	PLASTIC/EPOXY	DIP	DIP40,.6	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	40		无	e0			锡铅		DUAL	THROUGH-HOLE		2.54 mm	unknown			R-PDIP-T40	不合格	COMMERCIAL	3	PARALLEL IO PORT, GENERAL PURPOSE		10 mA	6.35 mm					8										52.324 mm	15.24 mm
XCZU3EG-2LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	784		有	e1			锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC			3.32 mm										CAN, I2C, SPI, UART					23 mm	23 mm
ICS8MH0-150.000AJT	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 倍率: 1	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC				无			EAR99		8542.39.00.01					unknown
MPC9855VF	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	BGA	MAPBGA-100	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	BGA100,10X10,40	SQUARE	GRID ARRAY, LOW PROFILE	3.465 V	3.135 V	3.3 V	100		无	e0	无	EAR99	锡铅	8542.39.00.01	BOTTOM	BALL		1 mm	not_compliant		100	S-PBGA-B100	不合格	INDUSTRIAL		CLOCK GENERATOR, PROCESSOR SPECIFIC		200 mA	1.7 mm		250 MHz				200 MHz									11 mm	11 mm
MPC9855VF	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Transferred	FREESCALE SEMICONDUCTOR INC	BGA	11 X 11 MM, 1 MM PITCH, MAPBGA-100	3	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	BGA100,10X10,40	SQUARE	GRID ARRAY, LOW PROFILE	3.465 V	3.135 V	3.3 V	100		无	e0		EAR99	Tin/Lead/Silver (Sn/Pb/Ag)	8542.39.00.01	BOTTOM	BALL	245	1 mm	not_compliant	30	100	S-PBGA-B100	不合格	INDUSTRIAL		CLOCK GENERATOR, PROCESSOR SPECIFIC		200 mA	1.7 mm		250 MHz				200 MHz									11 mm	11 mm
XCZU19EG-3FFVD1760I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1760	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	1760		有	e1			锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1760		INDUSTRIAL		PROGRAMMABLE SoC			3.71 mm															42.5 mm	42.5 mm
XCZU19EG-3FFVD1760I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Transferred	XILINX INC	BGA,	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	1760	2017-02-15	有	e1			锡银铜	8542.31.00.01	BOTTOM	BALL		1 mm	compliant			S-PBGA-B1760		INDUSTRIAL		PROGRAMMABLE SoC			3.71 mm															42.5 mm	42.5 mm
XCZU6EG-2LFFVB1156E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1156	4	110 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	1156		有	e1			锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		OTHER		PROGRAMMABLE SoC			3.42 mm										CAN, I2C, SPI, UART					35 mm	35 mm
XQ7Z030-1RF900Q	AMD Xilinx	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Transferred	XILINX INC	31 X 31 MM, 1 MM PITCH, BGA-900	125 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	900		无	e0			锡铅	8542.31.00.01	BOTTOM	BALL		1 mm	not_compliant			S-PBGA-B900	不合格	AUTOMOTIVE		PROGRAMMABLE SoC			3.44 mm															31 mm	31 mm
XCZU9CG-2LFFVC900E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	900		有	e1			锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		OTHER		PROGRAMMABLE SoC			3.42 mm										CAN, I2C, SPI, UART					31 mm	31 mm
MD2202-D32-V3-X-P	SanDisk Corporation	数据表	N/A	-	最小起订量: 1 倍率: 1	NO	Obsolete	SANDISK CORP	DIP	DIP,	85 °C	-40 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	3.6 V	3 V	3.3 V	32		有					8542.31.00.01	DUAL	THROUGH-HOLE	未说明		unknown	未说明	32	R-PDIP-T32	不合格	INDUSTRIAL		SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE								8
XCZU6CG-2SBVA484I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Transferred	XILINX INC	FBGA, BGA484,22X22,32	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	484		有					8542.31.00.01	BOTTOM	BALL		0.8 mm	unknown			S-PBGA-B484		INDUSTRIAL		PROGRAMMABLE SoC			2.61 mm										I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)					19 mm	19 mm
XCZU6CG-2SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	484		有	e1			锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B484		INDUSTRIAL		PROGRAMMABLE SoC			2.61 mm										I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)					19 mm	19 mm
XCZU9CG-1SFVC784I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Transferred	XILINX INC	FBGA, BGA78428X28,32	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	784		有				锡银铜	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	unknown	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC			3.32 mm										I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)					23 mm	23 mm
XCZU9CG-1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	784		有	e1			锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC			3.32 mm										I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)					23 mm	23 mm
PSD813F2-12JI	Waferscale Integration Inc	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	WAFERSCALE INTEGRATION INC	PLASTIC, LDCC-52	26.3 MHz	27	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	52		Obsolete						QUAD	J BEND			unknown			S-PQCC-J52	不合格	INDUSTRIAL	4	PARALLEL IO PORT, GENERAL PURPOSE			4.57 mm					16										19.1 mm	19.1 mm
SCC66470AAB	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	NXP SEMICONDUCTORS	QFP, QFP120,1.2SQ,32	85 °C	-40 °C	PLASTIC/EPOXY	QFP	QFP120,1.2SQ,32	SQUARE	FLATPACK	5 V	120		Obsolete					8542.31.00.01	QUAD	鸥翼		0.8 mm	unknown			S-PQFP-G120	不合格	INDUSTRIAL				100 mA
SCC66470AAB	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Transferred	飞利浦半导体	QFP, QFP120,1.2SQ,32	85 °C	-40 °C	PLASTIC/EPOXY	QFP	QFP120,1.2SQ,32	SQUARE	FLATPACK	5 V	120		无	e0			Tin/Lead (Sn/Pb)	8542.31.00.01	QUAD	鸥翼		0.8 mm	unknown			S-PQFP-G120	不合格	INDUSTRIAL				100 mA
S1100	Desco Industries Inc	数据表	N/A	-	最小起订量: 1 倍率: 1
UPD65881GB-P01-3BS-A	NEC Electronics Group	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Obsolete	NEC ELECTRONICS CORP	QFP	QFP,	85 °C	-40 °C	PLASTIC/EPOXY	QFP	SQUARE	FLATPACK	5.5 V	4.5 V	5 V	44		有	e6	有	EAR99	锡铋	8542.39.00.01	QUAD	鸥翼		0.8 mm	compliant		44	S-PQFP-G44	不合格	INDUSTRIAL		TIMER, PROGRAMMABLE	16		2.8 mm					8				3				PARALLEL, DIRECT ADDRESS		10 mm	10 mm
SC26C198A1A	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	NXP SEMICONDUCTORS	LCC	QCCJ, LDCC84,1.2SQ	8 MHz	3	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC84,1.2SQ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	84		Obsolete					8542.31.00.01	QUAD	J BEND		1.27 mm	unknown		84	S-PQCC-J84	不合格	INDUSTRIAL		SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		200 mA	4.57 mm	8		NO	YES	8		0	8			0.06103515625 MBps	ASYNC, BIT		NRZ	29.3116 mm	29.3116 mm

嵌入式 - 微控制器 - 应用特定 (5239)