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类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

生命周期状态

安装类型

包装/外壳

越来越多的功能

外壳材料

供应商器件包装

插入材料

后壳材料，电镀

厂商

操作温度

包装

系列

JESD-609代码

无铅代码

终端

连接器类型

定位的数量

端子表面处理

颜色

应用

紧固类型

子类别

额定电流

方向

屏蔽/屏蔽

峰值回流焊温度（摄氏度）

入口保护

Reach合规守则

外壳完成

引脚数量

外壳尺寸-插入

速度

内存大小

外壳尺寸，MIL

核心处理器

周边设备

程序内存大小

连接方式

电缆开口

建筑学

可编程逻辑类型

产品类别

筛选水平

速度等级

主要属性

寄存器数量

核数量

闪光大小

特征

产品类别

触点表面处理厚度 - 配套

材料可燃性等级
XCVM1402-1LSIVSVD1760 XCVM1402-1LSIVSVD1760

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

726

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

AGFA008R16A2E2V AGFA008R16A2E2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Bulk

Metal

MS27467E25B

活跃

Copper Alloy

Gold

384

Free Hanging (In-Line)

-

-

Aluminum

-

-

-

Amphenol Aerospace Operations

-

-65°C ~ 175°C

Military, MIL-DTL-38999 Series I, LJT

Crimp

Plug, Male Pins

19

橄榄色

Aviation, Military

卡口锁

-

A

Shielded

抗环境干扰

橄榄色镉包镍

25-19

1.4GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MPU, FPGA

FPGA - 764K Logic Elements

-

联接螺母

50.0µin (1.27µm)

-

XCVE1752-1LSIVSVA1596 XCVE1752-1LSIVSVA1596

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

500

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCZU7EG-3FFVC1156E XCZU7EG-3FFVC1156E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.873 V

0.927 V

360

Tray

XCZU7

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.9000 V

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

MPFS095T-1FCVG784T2 MPFS095T-1FCVG784T2

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

MCU - 136, FPGA - 276

784-BFBGA, FCBGA

784-FCBGA (23x23)

PEI-Genesis

Bulk

-40°C ~ 125°C (TJ)

*

-

857.6KB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

128KB

XCZU3CG-1SBVA484E XCZU3CG-1SBVA484E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU3

活跃

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

82

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

AGFB012R24B3E3E AGFB012R24B3E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

768

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

XCVM1302-2MLENBVB1024 XCVM1302-2MLENBVB1024

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

316

Tray

活跃

1024-BFBGA

1024-BGA (31x31)

AMD

Non-Compliant

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XAZU3EG-1SFVA625Q XAZU3EG-1SFVA625Q

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.808 V

0.892 V

128

Tray

XAZU3

活跃

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

0.8500 V

-40 to 125 °C

Zynq® UltraScale+™ MPSoC EG

625

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

1

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU2CG-1SFVC784I XCZU2CG-1SFVC784I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU2

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

M2S060-FGG484 M2S060-FGG484

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

1.14 V

1.26 V

有

This product may require additional documentation to export from the United States.

-

166 MHz

56520 LE

60

4710 LAB

Microchip

Microchip Technology / Atmel

SmartFusion2

Details

-

64 kB

267

Tray

M2S060

活跃

SoC FPGA

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2 V

0 to 85 °C

Tray

SmartFusion2

SOC - Systems on a Chip

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 60K Logic Modules

1 Core

256KB

SoC FPGA

M2S005S-VFG256 M2S005S-VFG256

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

M2S005

活跃

-

166 MHz

6060 LE

-

64 kB

256-LBGA

256-FPBGA (17x17)

微芯片技术

161

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 5K Logic Modules

1 Core

128KB

M2S060-FG484 M2S060-FG484

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

267

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

484-BGA

484-FPBGA (23x23)

微芯片技术

Non-Compliant

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

XCZU7CG-1FFVF1517E XCZU7CG-1FFVF1517E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.808 V

0.892 V

464

Tray

XCZU7

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

0.8500 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU5EV-3SFVC784E XCZU5EV-3SFVC784E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.873 V

0.927 V

252

Tray

XCZU5

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

0.9000 V

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

A2F200M3F-1FG256I A2F200M3F-1FG256I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

A2F200

活跃

256-LBGA

256-FPBGA (17x17)

微芯片技术

MCU - 25, FPGA - 66

-40°C ~ 100°C (TJ)

SmartFusion®

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

XCZU4EV-2SFVC784E XCZU4EV-2SFVC784E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.8500 V

252

表面贴装

252

Tray

XCZU4

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

192,150

0 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU11EG-3FFVC1760E XCZU11EG-3FFVC1760E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.9000 V

512

512

Tray

XCZU11

活跃

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

653100

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

1760

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

3

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

597120

-

XCZU5EG-L2SFVC784E XCZU5EG-L2SFVC784E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU5

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU4CG-2FBVB900I XCZU4CG-2FBVB900I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

FCBGA

0.8500 V

0.808 V

204

0.892 V

204

Tray

XCZU4

活跃

Industrial grade

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

192,150

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

900

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

M2S150-FCV484I M2S150-FCV484I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

273

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

484-BFBGA

484-FBGA (19x19)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 150K Logic Modules

1 Core

512KB

M2S025TS-1VFG400T2 M2S025TS-1VFG400T2

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

207

Tray

M2S025

活跃

40

有

M2S025TS-1VFG400T2

Microsemi Corporation

活跃

MICROSEMI CORP

5.81

400-LFBGA

400-VFBGA (17x17)

微芯片技术

1.2000 V

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

e1

有

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

1

FPGA - 25K Logic Modules

256KB

A2F500M3G-CSG288 A2F500M3G-CSG288

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.425 V

500000

1.575 V

MCU - 31, FPGA - 78

Tray

A2F500

活跃

288-TFBGA, CSPBGA

288-CSP (11x11)

微芯片技术

1.5000 V

0 to 85 °C

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

XCZU7EG-L2FBVB900E XCZU7EG-L2FBVB900E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU7

活跃

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU7EG-L1FFVC1156I XCZU7EG-L1FFVC1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU7

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

360

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-