类别是'嵌入式 - 片上系统(SoC)'
嵌入式 - 片上系统(SoC) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | HTS代码 | 子类别 | 端子位置 | 终端形式 | 端子间距 | Reach合规守则 | JESD-30代码 | 温度等级 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 建筑学 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | EEPROM 大小 | 主要属性 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||
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![]() | 10AS057K2F40E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 21 | SMD/SMT | 71250 LAB | 973526 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, | 网格排列 | PLASTIC/EPOXY | 0.9 V | 0.87 V | 100 °C | 有 | 10AS057K2F40E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | SoC FPGA | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | 696 | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | FPGA - 570K Logic Elements | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||
![]() | XCVM1302-1LSENSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | 424 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z010-1CLG225C | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | XC7Z010 | 活跃 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | AMD | 86 | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | - | - | Intel | 720 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C614ABZI-S2F44T | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | A/D 16x10/12b SAR ; D/A 2x7/8b Sigma-Delta | 活跃 | 表面贴装 | 124-VFBGA | 124-VFBGA (9x9) | Infineon Technologies | 100 | -40°C ~ 85°C (TA) | PSoC® 6 | External, Internal | 150MHz | 1M x 8 | 1.7V ~ 3.6V | ARM® Cortex®-M4F | Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, LVD, PMC, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT | FLASH | 32-Bit | 2MB (2M x 8) | eMMC/SD/SDIO, FIFO, I²C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-1SFVA625E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | XCZU2 | 活跃 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5CG-1FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | XCZU5 | 活跃 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIB022R31B1I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | - | - | Intel | 720 | -40°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-2FFVB1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | XCZU6 | 活跃 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 328 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-L1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | XCZU3 | 活跃 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z020-1CLG400CES | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | XC7Z020 | Obsolete | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 130 | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1MLIVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | AMD | Tray | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU5EV-1SFVC784Q | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | XAZU5 | 活跃 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | -40°C ~ 125°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | XCZU5 | 活跃 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C2E3VAA | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | - | - | Intel | 720 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-2FBG676CES | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | XC7Z045 | Obsolete | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 130 | 0°C ~ 85°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQE-S473T | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | Details | SoC FPGA | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 34 | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | ARM Microcontrollers - MCU | ||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4126AZE-S455T | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 1500 | Infineon | Infineon Technologies | Details | SoC FPGA | 表面贴装 | 64-LQFP | 64-TQFP (10x10) | Infineon Technologies | 54 | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | ARM Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQS-S283T | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 2500 | Infineon | Infineon Technologies | Details | 有 | SoC FPGA | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 34 | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100 | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | ARM Microcontrollers - MCU | ||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147AZE-S265T | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | A/D 16x10b, 20x12b SAR | CY8C4147 | Tape & Reel (TR) | 54 | 有 | 1500 | Infineon | Infineon Technologies | Details | SoC FPGA | 表面贴装 | 64-LQFP | 64-TQFP (10x10) | Infineon Technologies | 活跃 | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 128KB (128K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | ARM Microcontrollers - MCU | ||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQS-S273T | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | A/D 16x10b, 20x12b SAR | CY8C4147 | Tape & Reel (TR) | 34 | 有 | 2500 | Infineon | Infineon Technologies | Details | SoC FPGA | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 活跃 | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100 | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | ARM Microcontrollers - MCU | ||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | Tray | M2S060 | 活跃 | Non-Compliant | - | 166 MHz | 56520 LE | - | 64 kB | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 267 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FSVG1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-VF400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | M2S025 | 活跃 | - | 166 MHz | 27696 LE | SMD/SMT | - | 64 kB | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | 207 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090TS-FGG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | M2S090 | 活跃 | - | 166 MHz | 86316 LE | - | 64 kB | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 267 | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB |