类别是'嵌入式 - 片上系统(SoC)'
嵌入式 - 片上系统(SoC) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | AGFB006R24C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 576 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX065HH1F35E2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | Tray | 活跃 | 1152-FBGA (35x35) | Intel | 392 | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA006R16A3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 384 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-1MSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | AMD | Tray | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB014R24C3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 744 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB014R24B3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 768 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1502-2LLEVSVA2785 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2785-BFBGA | Tray | 活跃 | 2785-BGA (50x50) | AMD | 702 | 0°C ~ 100°C (TJ) | Versal® Premium | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K4F35I4SGES | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | 396 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Obsolete | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-2MSEVFVB1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 C | + 110 C | 800 mV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-2HSIVFVB1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 40 C | + 110 C | 880 mV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-2MLEVFVC1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 C | + 110 C | 800 mV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MSEVFVB1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 C | + 110 C | 800 mV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2HSIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | Tray | 活跃 | + 110 C | - 40 C | 1760-FCBGA (40x40) | AMD 赛灵思 | 726 | -40°C ~ 100°C (TJ) | Versal™ Prime | 880 mV | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MLEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | Tray | 活跃 | + 110 C | 0 C | 1760-FCBGA (40x40) | AMD 赛灵思 | 726 | 0°C ~ 100°C (TJ) | Versal™ Prime | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB019R25A2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 480 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIB027R29A2E2VR3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 720 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1202-2MSEVSVA2785 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2785-BFBGA | Tray | 活跃 | 2785-BGA (50x50) | AMD | 780 | 0°C ~ 100°C (TJ) | Versal® Premium | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F35E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 1 | SMD/SMT | 82500 LAB | 965384 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K2F35E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | SoC FPGA | YES | 1152-FBGA (35x35) | 1152 | 396 | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||
![]() | 5CSXFC6D6F31I7 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-BGA | BGA, BGA896,30X30,40 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 未说明 | 1.07 V | 无 | 5CSXFC6D6F31I7 | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.57 | YES | 896-FBGA (31x31) | 896 | MCU - 181, FPGA - 288 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B896 | 288 | 不合格 | 1.1,1.2/3.3,2.5 V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||
![]() | 5CSEBA6U23I7SN | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 672-FBGA | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 有 | 5CSEBA6U23I7SN | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.57 | YES | 672-UBGA (23x23) | 672 | MCU - 181, FPGA - 145 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSEBA6 | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||
![]() | 5CSEBA2U23A7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 25K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z100-2FFG900I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 900-BBGA, FCBGA | Tray | XC7Z100 | 活跃 | 900-FCBGA (31x31) | AMD | 212 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 444K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R24C2I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 744 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1VFG784 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 784-FBGA | 活跃 | 56500 LE | + 85 C | 0 C | SMD/SMT | 784-VFBGA (23x23) | 微芯片技术 | Tray | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H2F35E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-1152 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 973486 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032H2F35E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | SoC FPGA | YES | 1152 | 384 | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | 现场可编程门阵列 | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm |