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类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

包装/外壳

表面安装

供应商器件包装

终端数量

第一种连接器安装类型

第二个连接器安装类型

厂商

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终止次数

温度系数

类型

电阻

组成

颜色

功率(瓦特)

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度（摄氏度）

入口保护

端子间距

样式

Reach合规守则

JESD-30代码

功能

输出的数量

资历状况

电源

温度等级

注意

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

座位高度-最大

使用的 IC/零件

提供的内容

可编程逻辑类型

产品类别

第一个连接器

第二个连接器

主要属性

嵌入式

次要属性

逻辑单元数

核数量

闪光大小

特征

产品类别

座位高度(最大)

长度

宽度
XCZU46DR-L2FSVH1760I XCZU46DR-L2FSVH1760I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1760-BBGA, FCBGA

Tray

活跃

1760-FCBGA (42.5x42.5)

AMD 赛灵思

574

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU47DR-1FSVE1156I XCZU47DR-1FSVE1156I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1156-BBGA, FCBGA

Tray

活跃

1156-FCBGA (35x35)

AMD 赛灵思

366

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

10AS027H4F35I3LG 10AS027H4F35I3LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

FBGA-1152

2 x 32 kB

Details

Arria 10 SoC

Intel / Altera

Intel

973480

33750 LAB

SMD/SMT

1

270000 LE

1.2 GHz

2 x 32 kB

This product may require additional documentation to export from the United States.

有

384

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS027H4F35I3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

SoC FPGA

YES

1152

-

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.5 mm

现场可编程门阵列

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

35 mm

35 mm

AGIB023R18A2E1V AGIB023R18A2E1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

480

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCZU43DR-1FSVE1156E XCZU43DR-1FSVE1156E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1156-BBGA, FCBGA

活跃

1156-FCBGA (35x35)

AMD 赛灵思

366

0°C ~ 100°C (TJ)

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-1FFVE1156E XCZU43DR-1FFVE1156E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1156-BBGA, FCBGA

活跃

1156-FCBGA (35x35)

AMD 赛灵思

366

0°C ~ 100°C (TJ)

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVC1802-1LLIVSVA2197 XCVC1802-1LLIVSVA2197

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

2197-BFBGA, FCBGA

Tray

活跃

2197-FCBGA (45x45)

AMD

770

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

AGIB027R31B3E3E AGIB027R31B3E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

XCVM1502-1MSINFVB1369 XCVM1502-1MSINFVB1369

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

AMD

Tray

*

AGFA014R24C2E2VAA AGFA014R24C2E2VAA

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

744

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

AGFB012R24C2E2VAA AGFB012R24C2E2VAA

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

744

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

XCZU5EV-2SFVC784E XCZU5EV-2SFVC784E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

784-BFBGA, FCBGA

Tray

XCZU5

活跃

784-FCBGA (23x23)

AMD

252

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCVC1802-2LLIVSVD1760 XCVC1802-2LLIVSVD1760

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

AMD

726

-40°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCZU49DR-2FSVF1760I XCZU49DR-2FSVF1760I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1760-BBGA, FCBGA

Tray

活跃

1760-FCBGA (42.5x42.5)

AMD 赛灵思

622

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU5EG-1SFVC784E XCZU5EG-1SFVC784E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

784-BFBGA, FCBGA

Tray

XCZU5

活跃

784-FCBGA (23x23)

AMD

252

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

10AS057K2F40I2LG 10AS057K2F40I2LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

1517-BBGA, FCBGA

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

21

SMD/SMT

71250 LAB

964936

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS057K2F40I2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

YES

1517-FCBGA (40x40)

1517

696

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1517

696

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

696

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

40 mm

40 mm

AGFB022R31C3E3E AGFB022R31C3E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

活跃

720

-

Analog Devices Inc./Maxim Integrated

Box

0°C ~ 100°C (TJ)

-

电源管理

Power Supply Supervisor/Tracker/Sequencer

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

MAX34460

Board(s)

12 Channel Sequencer and Monitor

无

-

-

AGFB019R25A3I3E AGFB019R25A3I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

D38999/24MC

活跃

480

-

TE Connectivity Deutsch 连接器

Bag

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

10AS016E4F27I3LG 10AS016E4F27I3LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

0805 (2012 Metric)

RN732A

Obsolete

240

Non-Compliant

有

2 x 32 kB

1.2 GHz

160000 LE

1

SMD/SMT

20000 LAB

964721

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS016E4F27I3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

SoC FPGA

YES

0805

672

KOA Speer Electronics, Inc.

Tape & Reel (TR)

-55°C ~ 155°C

Tray

RN73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.1%

活跃

2

±5ppm/°C

56 kOhms

Thin Film

0.1W, 1/10W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

FPGA - 160K Logic Elements

160000

2 Core

--

Moisture Resistant

SoC FPGA

0.024 (0.60mm)

27 mm

27 mm

MCIMX7S3DVK08SB MCIMX7S3DVK08SB

NXP 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

C&K

Bulk

-

BCM3384MKFSBGB0T BCM3384MKFSBGB0T

Broadcom 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

Broadcom Limited

Tray

*

CYW4373IUBGT CYW4373IUBGT

Cypress 数据表

N/A

-

最小起订量: 1

倍率: 1

Bag

50 Ohms

Q-2F02R0

Bulkhead - Front Side Nut

活跃

Male

11 GHz

-

RG-58

面板安装

Free Hanging (In-Line)

Amphenol Custom Cable

Female

-

-

Black

-

SMA to N-Type

SMA Jack, Right Angle

N-Type Plug, Right Angle

Shielded

48.0 (1.2m) 4.0

10AS066H4F34I3SGES 10AS066H4F34I3SGES

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

1152-BBGA, FCBGA

Bulk

CASNM48

-

活跃

-

-

-

492

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

10AS066H4F34I3SGES

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

YES

1152-FCBGA (35x35)

1152

-

-

TE Connectivity Laird

Male

-

Tray

-

Discontinued at Digi-Key

-

8542.39.00.01

BOTTOM

BALL

-

1 mm

RP-BNC to N-Type

compliant

S-PBGA-B1152

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.65 mm

现场可编程门阵列

N-Type Plug

-

FPGA - 660K Logic Elements

--

-

48.0 (1.2m) 4.0

35 mm

10AS066K2F40I1SG 10AS066K2F40I1SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

1517-BBGA, FCBGA

Obsolete

696

40 X 40 MM, ROHS COMPLIANT, FBGA-1517

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

有

10AS066K2F40I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

YES

1517-FBGA (40x40)

1517

Renesas Electronics America Inc

Tape & Reel (TR)

-40°C ~ 100°C (TJ)

Tray

-

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

FPGA - 660K Logic Elements

--

40 mm

40 mm

1SX250LU3F50I1VG 1SX250LU3F50I1VG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

007700

活跃

704

Molex

Bulk

-40°C ~ 100°C (TJ)

Tray

*

活跃

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 2500K Logic Elements

--