类别是'卡边缘连接器 - 适配器'
卡边缘连接器 - 适配器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 引脚数 | 房屋材料 | 材料 - 绝缘 | 安装选项1 | 板安装选项 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 终端 | ECCN 代码 | 连接器类型 | 定位的数量 | 最高工作温度 | 最小工作温度 | 颜色 | 行数 | 性别 | 附加功能 | HTS代码 | MIL一致性 | 符合 DIN 标准 | IEC一致性 | 过滤功能 | 触点类型 | 混合接触 | 选项 | 螺距 | 触头总数 | 方向 | 端子间距 | Reach合规守则 | 额定电流 | 参考标准 | 触点表面处理 | 终端样式 | 可靠性 | PCB行数 | 螺纹距离 | PCB接触图案 | 本体宽度 | 触点性别 | 房屋颜色 | 引线长度 | 本体深度 | 额定电流(信号) | 触点样式 | 触点电阻 | 磁卡种类 | 读出 | 绝缘电阻 | 定位/湾/行数 | 法兰特性 | 配套触点间距 | 主体/外壳样式 | 电路数量 | 终端类型 | 镀层 | 介电耐压 | 耐用性 | 触点表面处理 终端 | 触点图案 | 插入力-最大值 | 拉坯力 - 最小值 | 配套接点行距 | 绝缘子颜色 | 触点排列 | 产品 | 安装角 | 特征 | 端子长度 | 触点表面处理厚度 | 电镀厚度 | 磁卡厚度 | 板厚 | 辐射硬化 | 无铅 | |||||||||||||||||||||||||||||
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![]() | 45912-0038 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Tin | + 105 C | - 40 C | 510 | EXTreme PowerEdge | 250 V | 0459120038 | 0.328259 oz | US | Polymer | GOLD (30) | 2.071 inch | LIQUID CRYSTAL POLYMER (LCP) | -40 °C | 105 °C | 有 | 45912-0038 | 2 | 活跃 | MOLEX LLC | ONE | 5.75 | 45912 | Gold | 通孔 | BOARD | 14 | Thermoplastic | LOCKING | 兼容板锁 | Details | Tray | 45912 | e3 | 有 | Press-Fit | EAR99 | 卡边缘连接器 | 14 Position | 105 °C | -40 °C | Black | 2 | Female | POWER EDGE, TERMINAL PITCH FOR POWER CONTACTS : 12.90 MM, PANEL MOUNTABLE | 8536.69.40.40 | NO | NO | NO | NO | YES | GENERAL PURPOSE | 12.9 mm | 14 | Vertical | 2.5 mm | compliant | 40 A | UL | COMMERCIAL | 4 | 12.9 mm | STAGGERED | 0.354 inch | FEMALE | Black | 4.5 mm | 0.591 inch | 3 A | HYBRID | 15 mΩ | 5000000000 Ω | RECEPTACLE | 14 | PRESS FIT | Tin | 1000VDC V | TIN (150) | RECTANGULAR | 1.39 N | .139 N | BLACK | Vertical | 0.169 inch | 30u inch | 1.5748 mm | 无 | |||||||||||||||||||||||||||
![]() | 10061913-102ZLF | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper Alloy | 40 | Tray | 10061913 | 活跃 | Gold | 表面贴装 | Nylon | Polyamide (PA), Nylon, Glass Filled | Amphenol ICC (FCI) | SMD/SMT | -55°C ~ 85°C | Tray | - | Solder | 98 Position | Black | 2 Row | Female | Cantilever | 0.039 (1.00mm) | 1.1 A | Gold | PCI Express™ | Dual | - | - | PCI Express | Vertical | Board Guide, Locking Ramp, Pick and Place, Solder Retention | 30.0µin (0.76µm) | 0.062 (1.57mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HSEC8-120-01-S-PV-4-2-WT | Samtec, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 板锁 | 铍铜 | + 125 C | - 55 C | 56 | 边缘率 | PRODUCTION (Last Updated: 1 year ago) | AU | 1.917 inch | LIQUID CRYSTAL POLYMER (LCP) | -55 °C | 125 °C | 有 | HSEC8-120-01-S-PV-4-2-WT | 2 | 活跃 | SAMTEC INC | ONE | 5.77 | Production (Last Updated: 1 year ago) | Gold | Liquid Crystal Polymer (LCP) | 可焊固定夹 | Details | Tray | HSEC8-PV | e3 | EAR99 | 卡边缘连接器 | 24 Position | 2 Row | Receptacle | 8536.69.40.40 | - | 44 | compliant | 3.2 A, 27.5 A | COMMERCIAL | 0.315 inch | 0.599 inch | 2.8 A | HYBRID | 15 mΩ | 1000000000 Ω | 0.032 inch | 1000 Cycles | Tin (Sn) - with Nickel (Ni) barrier | RECTANGULAR | 0.069 inch | BLACK | Power, Signal | Headers | Straight | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MEC2-20-01-L-TH1-NP-WT | Samtec, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Panel | 铍铜 | + 125 C | - 55 C | 12 | 238 V | Gold | Liquid Crystal Polymer (LCP) | Details | Tube | MEC2 | 40 Position | 2 Row | 2 mm | 3.5 A | Sockets | Straight | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CE1008000110111 | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper Alloy | + 105 C | - 55 C | 900 | 12 V | 有 | CE1008000110111 | 活跃 | AMPHENOL ICC | 5.77 | Gold | Thermoplastic (TP) | SMD/SMT | Tray | e3 | 卡边缘连接器 | 80 Position | 2 Row | 0.8 mm | compliant | 0.5 A, 20 A | 1000 MOhms | Matte Tin (Sn) - with Nickel (Ni) barrier | Signal | Headers | Straight | 1.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10121506-480020BLF | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper Alloy | + 105 C | - 55 C | 270 | HPCE | 17 V, 548 V | Tray | 10121506 | 活跃 | GXT | 通孔 | Thermoplastic (TP) | Thermoplastic | Amphenol ICC (FCI) | 通孔 | -55°C ~ 105°C | Tray | 功率边缘 | Press-Fit | 20 Position | Black | 2 Row | Female | - | 2.54 mm, 1.27 mm | 9 A | Gold or Gold, GXT™ | 压装 | Non Specified - Dual Edge | Dual | 5000 MOhms Power, 500 MOhms Signal | 24; 10 | - | Power/Signal | Receptacles | Vertical | 板锁 | - | 0.062 (1.57mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 387-012-541-202 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Copper Alloy | + 105 C | - 40 C | 25 | Bulk | 387-012 | 活跃 | 387-012-541-202 | 接触制造商 | EDAC INC | 5.77 | Gold | Standard | 通孔 | 热塑性聚酯 | 聚酯热塑性塑料 | EDAC Inc. | Details | -40°C ~ 105°C | 387 | Wire Wrap | 卡边缘连接器 | 12 Position | Black | 2 Row | Female | Cantilever | 3.96 mm | compliant | 3 A | Gold | Wire Wrap | Non Specified - Dual Edge | Dual | 5000 MOhms | 6 | Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia | With Flanges | Vertical | - | 10.0µin (0.25µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | 1.57 mm | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10121505-003212CLF | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 105 C | - 55 C | 360 | HPCE | 17 V, 548 V | Tray | 10121505 | 活跃 | Copper Alloy | 通孔 | Thermoplastic (TP) | Thermoplastic | Amphenol ICC (FCI) | 安装座 | -55°C ~ 105°C | Tray | HPCE | Press-Fit | 12 Position | Black | 2 | Female | - | 2.54 mm | Gold or Gold, GXT™ | Solder | Non Specified - Dual Edge | Dual | 5 GOhms, 500 MOhms | 16; 6 | - | Receptacles | Vertical | 板锁 | - | 0.062 (1.57mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10122238-160012BLF | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 55 C | 270 | HPCE | 17 V, 548 V | Tray | 10122238 | 活跃 | Copper Alloy | GXT | Board Edge, Straddle Mount | Thermoplastic (TP) | Thermoplastic | Amphenol ICC (FCI) | + 105 C | -55°C ~ 105°C | Tray | HPCE® | Solder | 12 Position | Black | 2 | Female | - | 2.54 mm, 1.27 mm | 9 A | Gold or Gold, GXT™ | Solder | Non Specified - Dual Edge | Dual | 5000 MOhms Power, 500 MOhms Signal | 8; 6 | Straddle Mount Opening, Unthreaded, 0.146 (3.70mm) | Power/Signal | Receptacles | 直角 | - | - | 0.062 (1.57mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SE1818023111111 | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper Alloy | + 105 C | - 55 C | 540 | 12 V | Gold | Thermoplastic (TP) | SMD/SMT | Tray | 超薄冷边 | 8 Power, 180 Signal | 2 Row | 0.65 mm | 0.5 A | 1000 MOhms | Signal, Power | Headers | Vertical | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CE1201800110111 | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper Alloy | + 105 C | - 55 C | 400 | 12 V | Gold | Thermoplastic (TP) | 通孔 | Tray | 2 Power, 18 Signal | 2 Row | 0.8 mm | 0.5 A, 20 A | 1000 MOhms | Signal, Power | Headers | Vertical | 1.6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 356-022-400-102 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper Alloy | + 105 C | - 40 C | 1 | Bulk | 356-022 | 活跃 | 356-022-400-102 | 活跃 | EDAC INC | 5.77 | Gold | 面板安装 | 热塑性聚酯 | 聚酯热塑性塑料 | EDAC Inc. | 面板安装 | -40°C ~ 105°C | 356 | Solder Eyelet(s) | 卡边缘连接器 | 22 Position | Black | 1 Row | Female | Cantilever | 3.96 mm | compliant | 5 A | Tin | 导线孔 | Non Specified - Dual Edge | Dual | 5000 MOhms | 22 | Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia | Receptacles | Vertical | - | - | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | 1.57 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HSEC8-120-01-SM-DV-A-PE | Samtec, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 84 | 边缘率 | Tray | HSEC8-120 | 活跃 | 铍铜 | AU ON NI | 0.906 inch | LIQUID CRYSTAL POLYMER (LCP) | -55 °C | 125 °C | 有 | HSEC8-120-01-SM-DV-A-PE | STRAIGHT | 2 | 活跃 | SAMTEC INC | ONE | 5.77 | 表面贴装 | Liquid Crystal Polymer (LCP) | LOCKING | Samtec Inc. | Details | -55°C ~ 125°C | Tray | HSEC8 | Solder | 卡边缘连接器 | 40 | Black | 2 | Female | Cantilever | 0.031 (0.80mm) | 40 | compliant | Gold | COMMERCIAL | 2 | 0.28 inch | 0.314 inch | 2.8 A | 黄光型 | 15 mΩ | PCI Express™ | Dual | 1000000000 Ω | 20 | - | 0.032 inch | SURFACE MOUNT | 1000 Cycles | BLACK | 电路板指南 | 3.00µin (0.076µm) | 30u inch | 0.063 (1.60mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87715-9900 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Tin | + 85 C | - 55 C | 3780 | 50 VAC/DC | 0877159900 | 0.068008 oz | Gold | Details | Tray | 87715 | 26 Position | 1.1 A | 通孔 | PCI | Vertical | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10131077-240824BLF | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 55 C | 196 | HPCE | 17 V, 548 V | Tray | 10131077 | 活跃 | Copper Alloy | GXT | Through Hole, Right Angle | Thermoplastic (TP) | Thermoplastic | Amphenol ICC (FCI) | + 105 C | -55°C ~ 105°C | Tray | * | 活跃 | Solder | 24 Position | Black | 2 | Female | - | 2.54 mm, 1.27 mm | 9 A | Gold or Gold, GXT™ | Solder | Non Specified - Dual Edge | Dual | 5000 MOhms Power, 500 MOhms Signal | 12; 16 | - | Power/Signal | Receptacles | 直角 | 板锁 | - | 0.062 (1.57mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10125138-002800BLF | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 105 C | - 55 C | 540 | HPCE | 17 V, 548 V | Tray | 10125138 | 活跃 | Copper Alloy | GXT | 通孔 | Thermoplastic (TP) | Thermoplastic | Amphenol ICC (FCI) | 通孔 | -55°C ~ 105°C | Tray | * | 活跃 | Press-Fit | 28 (Power) | Black | 2 | Female | - | 2.54 mm | 9 A | Gold, GXT™ | 压装 | Non Specified - Dual Edge | Dual | 5000 MOhms Power, 500 MOhms Signal | - | - | Power | Receptacles | Vertical | 板锁 | - | 0.062 (1.57mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10121506-001612ALF | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 55 C | 630 | HPCE | 17 V, 548 V | Tray | 10121506 | 活跃 | Copper Alloy | GXT | 通孔 | Thermoplastic (TP) | Thermoplastic | Amphenol ICC (FCI) | + 105 C | -55°C ~ 105°C | Tray | * | 活跃 | Solder | 12 Position | Black | 2 | Female | - | 2.54 mm, 1.27 mm | 9 A | Gold or Gold, GXT™ | Solder | Non Specified - Dual Edge | Dual | 5000 MOhms Power, 500 MOhms Signal | 8; 6 | - | Power/Signal | Receptacles | Vertical | 板锁 | - | 0.062 (1.57mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10121505-321644ALF | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 安装座 | Copper Alloy | + 105 C | - 55 C | 18 | HPCE | 17 V, 548 V | Tray | 10121505 | 活跃 | GXT | 通孔 | Thermoplastic (TP) | Thermoplastic | Amphenol ICC (FCI) | Details | -55°C ~ 105°C | Tray | 功率边缘 | Press-Fit | 44 Position | Black | 2 Row | Female | - | 2.54 mm, 1.27 mm | 9 A | Gold or Gold, GXT™ | Solder | Non Specified - Dual Edge | Dual | 5000 MOhms Power, 500 MOhms Signal | 24; 22 | - | Power/Signal | Receptacles | Vertical | 板锁 | - | 0.062 (1.57mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HSEC8-120-01-H-DV-A-PE | Samtec, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 84 | 边缘率 | AU ON NI | 0.906 inch | LIQUID CRYSTAL POLYMER (LCP) | -55 °C | 125 °C | 有 | HSEC8-120-01-H-DV-A-PE | STRAIGHT | 2 | BERYLLIUM COPPER | 活跃 | SAMTEC INC | ONE | 5.77 | BOARD | LOCKING | Details | Tray | HSEC8 | 卡边缘连接器 | 40 | compliant | COMMERCIAL | 2 | 0.28 inch | 0.314 inch | 2.8 A | 黄光型 | 15 mΩ | 1000000000 Ω | 0.032 inch | SURFACE MOUNT | 1000 Cycles | BLACK | 30u inch | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HSEC8-125-01-SM-DV-A-WT-K | Samtec, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 84 | 边缘率 | 有 | HSEC8-125-01-SM-DV-A-WT-K | 活跃 | SAMTEC INC | 5.77 | Details | Tray | HSEC8 | e3 | 卡边缘连接器 | unknown | Tin (Sn) - with Nickel (Ni) barrier | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HSEC8-140-01-H-DV-A-WT | Samtec, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 56 | 边缘率 | Details | Tray | HSEC8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 345-080-540-802 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Copper Alloy | + 105 C | - 40 C | 100 | 活跃 | 345-080-540-802 | 接触制造商 | EDAC INC | 5.77 | Gold | 热塑性聚酯 | EDAC Inc. | Details | 345 | 卡边缘连接器 | 80 Position | 2 Row | 2.54 mm | compliant | 3 A | Wire Wrap | 5000 MOhms | With Flanges | Vertical | 1.57 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HSEC8-113-01-SM-DV-A-BL | Samtec, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 边缘率 | Details | Tray | HSEC8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SE1012023111111 | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper Alloy | + 105 C | - 55 C | 400 | 12 V | Gold | Thermoplastic (TP) | SMD/SMT | Reel | 超薄冷边 | 120 Position | 2 Row | 0.65 mm | 0.5 A | 1000 MOhms | Signal | Headers | Vertical | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 101269330808204ALF | AMPHENOL FCI ASIA PTE LTD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 105 C | - 55 C | 25 | HPCE | 17 V, 548 V | Tray | 10126933 | 活跃 | Copper Alloy | GXT | Board Edge, Straddle Mount | Thermoplastic (TP) | Thermoplastic | Amphenol ICC (FCI) | 跨骑式安装 | -55°C ~ 105°C | Tray | HPCE® | Solder | 20 Position | Black | 2 | Female | - | 2.54 mm, 1.27 mm | 9 A | Gold or Gold, GXT™ | Solder | Non Specified - Dual Edge | Dual | 5000 MOhms Power, 500 MOhms Signal | 8; 10 | Straddle Mount Opening, Unthreaded, 0.146 (3.70mm) | Power/Signal | 卡扩展器 | - | 0.062 (1.57mm) |