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类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

安装类型

包装/外壳

供应商器件包装

厂商

操作温度

包装

系列

电压 - 供电

频率

工作电源电压

内存大小

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

输出功率

数据率

建筑学

使用的 IC/零件

议定书

功率 - 输出

速度等级

无线电频率系列/标准

收发器数量

天线类型

敏感度

主要属性

串行接口

接收电流

传输电流

调制

核数量

闪光大小
XCZU4EG-L2FBVB900E XCZU4EG-L2FBVB900E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU4

活跃

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU29DR-L2FSVF1760I5150 XCZU29DR-L2FSVF1760I5150

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

674 I/O

- 40 C

+ 100 C

13 Mb

53160 LAB

1

FBGA-1760

SMD/SMT

720 mV

16 Transceiver

6 Core

XCVC1902-2MSEVSVA2197 XCVC1902-2MSEVSVA2197

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

0 C

+ 110 C

1

770

Tray

活跃

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD 赛灵思

Details

0°C ~ 100°C (TJ)

Versal™ AI Core

800 mV

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU21DR-L2FFVD1156I5153 XCZU21DR-L2FFVD1156I5153

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

514 I/O

- 40 C

+ 100 C

13 Mb

53160 LAB

1

FBGA-1156

SMD/SMT

720 mV

16 Transceiver

6 Core

XCZU49DR-1FFVF1760E5167 XCZU49DR-1FFVF1760E5167

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

674 I/O

0 C

+ 100 C

13 Mb

53160 LAB

1

FBGA-1760

SMD/SMT

850 mV

16 Transceiver

6 Core

XCZU15EG-2FFVC900I5171 XCZU15EG-2FFVC900I5171

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

746550 LE

220 I/O

- 40 C

+ 100 C

11.3 Mb

42660 LAB

1

FBGA-900

SMD/SMT

850 mV

24 Transceiver

7 Core

XCZU47DR-L1FSVE1156I5149 XCZU47DR-L1FSVE1156I5149

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

394 I/O

- 40 C

+ 100 C

13 Mb

53160 LAB

1

FBGA-1156

SMD/SMT

850 mV

16 Transceiver

6 Core

XCZU6EG-1FFVB1156E5113 XCZU6EG-1FFVB1156E5113

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

469446 LE

353 I/O

0 C

+ 100 C

6.9 Mb

26825.5 LAB

1

FBGA-1156

SMD/SMT

850 mV

24 Transceiver

7 Core

XCVM1802-2MSIVFVC1760 XCVM1802-2MSIVFVC1760

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

- 40 C

+ 110 C

1

500

Tray

活跃

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

Details

-40°C ~ 100°C (TJ)

Versal™ Prime

800 mV

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCZU42DR-1FFVE1156E XCZU42DR-1FFVE1156E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

489300 LE

396 I/O

0 C

+ 100 C

6.8 Mb

27960 LAB

1

Tray

活跃

FBGA-1156

1156-FCBGA (35x35)

AMD 赛灵思

SMD/SMT

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

850 mV

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

8 Transceiver

Zynq®UltraScale+™ FPGA, 489K+ Logic Cells

6 Core

-

UC200TEMAA-N06-MN0AA UC200TEMAA-N06-MN0AA

Quectel 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

100

无线通信模块

0.370377 oz

Tray

UC200

Obsolete

ADC, I2C, PCM, SDIO, UART, USB 2.0

3.4 V

- 35 C

4.5 V

+ 75 C

32 mm x 29 mm x 2.4 mm

-

Module

Quectel

Details

-35°C ~ 75°C

Reel

UC200T

3.4V ~ 4.5V

900MHz, 1.8GHz

-

-

21Mbps

-

EDGE, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA

-

Cellular

不包括天线

-

ADC, I²C, PCM, SDIO, UART, USB

-

-

-

XCZU2EG-1SFVC784I5022 XCZU2EG-1SFVC784I5022

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

103320 LE

252 I/O

- 40 C

+ 100 C

1.2 Mb

5904 LAB

1

FBGA-784

SMD/SMT

850 mV

7 Core

XQZU19EG-1FFRB1517M4961 XQZU19EG-1FFRB1517M4961

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

1143450 LE

- 55 C

+ 125 C

9.8 Mb

65340 LAB

1

FCBGA-1517

SMD/SMT

850 mV

72 Transceiver

7 Core

XCZU15EG-2FFVB1156E4539 XCZU15EG-2FFVB1156E4539

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

746550 LE

353 I/O

0 C

+ 100 C

11.3 Mb

42660 LAB

1

FBGA-1156

SMD/SMT

850 mV

24 Transceiver

7 Core

XQZU49DR-L1FFQF1760I XQZU49DR-L1FFQF1760I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

- 40 C

+ 100 C

13 Mb

53160 LAB

1

BGA-1760

SMD/SMT

850 mV

16 Transceiver

6 Core

XCZU15EG-2FFVC900I4931 XCZU15EG-2FFVC900I4931

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

746550 LE

220 I/O

- 40 C

+ 100 C

11.3 Mb

42660 LAB

1

FBGA-900

SMD/SMT

850 mV

24 Transceiver

7 Core

MPFS095T-1FCSG536E MPFS095T-1FCSG536E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS095T-1FCVG484E MPFS095T-1FCVG484E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS160TS-FCVG484I MPFS160TS-FCVG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160TL-FCVG784E MPFS160TL-FCVG784E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-784

784-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095TL-FCSG536I MPFS095TL-FCSG536I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TS-FCVG484I MPFS250TS-FCVG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS160TL-FCVG784I MPFS160TL-FCVG784I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-784

784-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095T-1FCSG536I MPFS095T-1FCSG536I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS095TL-FCVG784I MPFS095TL-FCVG784I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

BGA-784

784-BGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB