类别是'嵌入式 - 片上系统（SoC）'
嵌入式 - 片上系统（SoC） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 可编程逻辑类型 | 核心架构 | 速度等级 | 主要属性 | 逻辑单元数 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
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 | M2S060-VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 400 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B400 | 207 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||
 | M2S060TS-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 325 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | 未说明 | S-PBGA-B325 | 200 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | 符合RoHS标准 | |||||||||||||
 | M2S090T-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 484 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 166MHz | 未说明 | M2S090T | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||
| M2S060-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B400 | 207 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||
| M2S050TS-1VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 207 | -40°C~100°C TJ | Tray | SmartFusion®2 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S050TS | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| M2S090TS-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 325 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | 未说明 | R-PBGA-B325 | 180 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | 符合RoHS标准 | |||||||||||||
| M2S150-FCV484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B484 | 273 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||
 | M2S050T-FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 896-BGA | YES | 377 | -40°C~100°C TJ | Tray | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 896 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B896 | 377 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 377 | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 31mm | 31mm | 符合RoHS标准 | |||||||||||||||
 | M2S090TS-FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B676 | 425 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||
| M2S150-1FCV484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B484 | 273 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||
| M2S090T-1FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 676 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 166MHz | 未说明 | M2S090T | S-PBGA-B676 | 425 | 不合格 | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | 现场可编程门阵列 | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||
| M2S090TS-1FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 676 | 425 | -40°C~100°C TJ | Tray | SmartFusion®2 | e3 | yes | 活跃 | 3 (168 Hours) | 676 | 哑光锡 | BOTTOM | BALL | 未说明 | 1.2V | 166MHz | 未说明 | M2S090TS | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | ARM | 1 | FPGA - 90K Logic Modules | 512KB | 2.44mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||
| M2S150T-1FCV484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B484 | 273 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||
| M2S150T-FCV484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | 273 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B484 | 273 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||
 | M2S150-FCS536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | not_compliant | 未说明 | S-PBGA-B536 | 293 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | Non-RoHS Compliant | |||||||||||||||||
| M2S150T-FCSG536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 未说明 | S-PBGA-B536 | 293 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 符合RoHS标准 | ||||||||||||||||||
| M2S090TS-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||
| M2S150TS-FCVG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | yes | 活跃 | 3 (168 Hours) | 484 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B484 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | FPGA - 150K Logic Modules | 512KB | 3.15mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||||||||
| M2S090TS-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||
| M2S060TS-1FGG484T2 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 267 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | 活跃 | 3 (168 Hours) | 未说明 | 未说明 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | FPGA - 60K Logic Modules | 256KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| M2S090-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 484 | 哑光锡 | BOTTOM | BALL | 未说明 | 1.2V | 166MHz | 未说明 | M2S090 | 267 | 不合格 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | ARM | 1 | FPGA - 90K Logic Modules | 512KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||
| M2S090TS-1FGG676T2 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 676-BGA | 425 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | 活跃 | 3 (168 Hours) | 未说明 | 未说明 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | FPGA - 90K Logic Modules | 512KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| M2S150T-1FCS536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | not_compliant | 未说明 | S-PBGA-B536 | 293 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | Non-RoHS Compliant | |||||||||||||||||
| M2S150-1FCSG536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 未说明 | S-PBGA-B536 | 293 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 符合RoHS标准 | ||||||||||||||||||
| M2S060T-1FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 676 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B676 | 387 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | 符合RoHS标准 |