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类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

厂商

操作温度

包装

系列

零件状态

最高工作温度

最小工作温度

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度（摄氏度）

端子间距

Reach合规守则

频率

基本部件号

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

界面

内存大小

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

核心架构

主要属性

逻辑块数量

逻辑单元数

核数量

等效门数

闪光大小

产品类别

长度

宽度
AGIB022R31B2E3E AGIB022R31B2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU2CG-1SFVC784E XCZU2CG-1SFVC784E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

784-BFBGA, FCBGA

Tray

XCZU2

活跃

784-FCBGA (23x23)

AMD

252

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

AGFB014R24C2I2V AGFB014R24C2I2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

744

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

A2F060M3E-1TQG144I A2F060M3E-1TQG144I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

FLATPACK, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

1.425 V

100 °C

有

A2F060M3E-1TQG144I

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

YES

144

LFQFP,

8542.39.00.01

CMOS

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G144

INDUSTRIAL

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

1536

60000

20 mm

20 mm

MPFS460TS-FC1152M MPFS460TS-FC1152M

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1152-BBGA, FCBGA

Microchip

微芯片技术

MCU - 136, FPGA - 468

Tray

活跃

1152-FCBGA (35x35)

微芯片技术

1

Tray

PolarFire™

SOC - Systems on a Chip

-

3.95MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 461K Logic Modules

128kB

SoC FPGA

1SX040HH3F35E3XG 1SX040HH3F35E3XG

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

1152-BBGA, FCBGA

Tray

活跃

1152-FBGA (35x35)

Intel

374

0°C ~ 100°C (TJ)

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 400K Logic Elements

-

XCVE1752-2MLINSVG1369 XCVE1752-2MLINSVG1369

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

AMD

500

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

XC7Z045-2FFG676E XC7Z045-2FFG676E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

676-BBGA, FCBGA

Tray

XC7Z045

活跃

676-FCBGA (27x27)

AMD

130

0°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

XCVC1502-2MSINSVG1369 XCVC1502-2MSINSVG1369

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

AMD

478

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

XC7Z007S-1CLG400I XC7Z007S-1CLG400I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

400-LFBGA, CSPBGA

Tray

XC7Z007

活跃

400-CSPBGA (17x17)

AMD

100

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

XC7Z100-1FFG900I XC7Z100-1FFG900I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

900-BBGA, FCBGA

Tube

XC7Z100

活跃

900-FCBGA (31x31)

AMD

212

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 444K Logic Cells

-

MPFS250T-1FCG1152E MPFS250T-1FCG1152E

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

BGA-1152

This product may require additional documentation to export from the United States.

16 kB, 4 x 32 kB

667 MHz, 667 MHz

254000 LE

372 I/O

+ 100 C

0 C

1

SMD/SMT

Microchip

Microchip Technology / Atmel

4 x 32 kB

-

Tray

活跃

1152-FCBGA (35x35)

微芯片技术

有

0°C ~ 100°C

Tray

PolarFire™

SOC - Systems on a Chip

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

SoC FPGA

MPFS250T-FCVG784E MPFS250T-FCVG784E

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

FCVG-784

16 kB, 4 x 32 kB

667 MHz, 667 MHz

254000 LE

372 I/O

+ 100 C

0 C

1

SMD/SMT

Microchip

Microchip Technology / Atmel

4 x 32 kB

-

Tray

活跃

784-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

SOC - Systems on a Chip

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

SoC FPGA

MPFS250T-FCG1152E MPFS250T-FCG1152E

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

FCG-1152

This product may require additional documentation to export from the United States.

16 kB, 4 x 32 kB

667 MHz, 667 MHz

254000 LE

372 I/O

+ 100 C

0 C

1

SMD/SMT

Microchip

Microchip Technology / Atmel

4 x 32 kB

-

Tray

活跃

1152-FCBGA (35x35)

微芯片技术

有

0°C ~ 100°C

Tray

PolarFire™

SOC - Systems on a Chip

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

SoC FPGA

MPFS460T-FCG1152E MPFS460T-FCG1152E

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

16 kB, 4 x 32 kB

667 MHz, 667 MHz

461000 LE

468 I/O

+ 100 C

0 C

1

SMD/SMT

Microchip

Microchip Technology / Atmel

4 x 32 kB

-

This product may require additional documentation to export from the United States.

Tray

SOC - Systems on a Chip

-

5 Core

SoC FPGA

MPFS250T-FCG1152I MPFS250T-FCG1152I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

FCG-1152

This product may require additional documentation to export from the United States.

16 kB, 4 x 32 kB

667 MHz, 667 MHz

254000 LE

372 I/O

+ 100 C

0 C

1

SMD/SMT

Microchip

Microchip Technology / Atmel

4 x 32 kB

-

Tray

活跃

1152-FCBGA (35x35)

微芯片技术

有

-40°C ~ 100°C

Tray

PolarFire™

SOC - Systems on a Chip

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

SoC FPGA

5CSEMA4U23C6N 5CSEMA4U23C6N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

672-FBGA

Compliant

64KB

484

672-UBGA (23x23)

MCU - 181, FPGA - 145

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

85 °C

0 °C

925 MHz

5CSEMA4

1.1 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

925MHz

2.9 MB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

40000

ARM

FPGA - 40K Logic Elements

--

10AS066N3F40I2SGES 10AS066N3F40I2SGES

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

1517-BBGA, FCBGA

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

10AS066N3F40I2SGES

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

YES

1517-FCBGA (40x40)

1517

588

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

FPGA - 660K Logic Elements

--

40 mm

40 mm

AGFA019R25A2I3E AGFA019R25A2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

480

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFA012R24B1I1V AGFA012R24B1I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

768

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

M2S060TS-1VFG784 M2S060TS-1VFG784

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

784-FBGA

Tray

活跃

56500 LE

+ 85 C

0 C

PCB 安装

784-VFBGA (23x23)

微芯片技术

395

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

256KB

XCZU6CG-L1FFVB1156I XCZU6CG-L1FFVB1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1156-BBGA, FCBGA

Tray

XCZU6

活跃

1156-FCBGA (35x35)

AMD

328

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XC7Z020L1CLG484I XC7Z020L1CLG484I

Other 数据表

N/A

-

最小起订量: 1

倍率: 1

XC7Z0452FF676I XC7Z0452FF676I

Other 数据表

N/A

-

最小起订量: 1

倍率: 1

10AS016E4F29I3LG 10AS016E4F29I3LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

780-BBGA, FCBGA

Non-Compliant

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS016E4F29I3LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

YES

780-FBGA (29x29)

780

288

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

288

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

3.35 mm

现场可编程门阵列

FPGA - 160K Logic Elements

160000

--

29 mm

29 mm