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产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

安装类型

包装/外壳

表面安装

越来越多的功能

外壳材料

供应商器件包装

质量

插入材料

终端数量

后壳材料,电镀

第一种连接器安装类型

第二个连接器安装类型

厂商

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终止次数

终端

温度系数

连接器类型

电阻

定位的数量

组成

颜色

应用

功率(瓦特)

HTS代码

电容量

紧固类型

子类别

额定电流

技术

电压 - 供电

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

入口保护

端子间距

样式

Reach合规守则

外壳完成

外壳尺寸-插入

JESD-30代码

功能

输出的数量

资历状况

审批机构

效率

工作电源电压

失败率

引线间距

电源

温度等级

振荡器类型

极化

最大输出电流

速度

内存大小

反向泄漏电流@ Vr

外壳尺寸,MIL

不同 If 时电压 - 正向 (Vf)

引线样式

电压 - 供电 (Vcc/Vdd)

核心处理器

周边设备

程序存储器类型

芯尺寸

程序内存大小

连接方式

输入类型

功率 - 最大

电缆开口

电压 - 输出

建筑学

输入数量

座位高度-最大

可编程逻辑类型

电压 - 齐纳(标准值)(Vz)

产品类别

第一个连接器

第二个连接器

EEPROM 大小

表格

使用地区

线长

输入连接器

输出连接器

收发器数量

无负载功耗

主要属性

逻辑单元数

核数量

闪光大小

抽头/步数

独立延误次数

第一拍延迟

可用总延误

特征

触点增量

产品类别

座位高度(最大)

长度

宽度

厚度(最大)

触点表面处理厚度 - 配套

材料可燃性等级

评级结果

10AS027E4F27E3LG 10AS027E4F27E3LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

240

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

965282

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

0.9 V

未说明

0.87 V

100 °C

10AS027E4F27E3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

1.92

SoC FPGA

FBGA-672

YES

672

Intel

Tray

0°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

27 mm

27 mm

10AS057K2F35I2SG 10AS057K2F35I2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

通孔

Obsolete

Tape & Reel (TR)

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS057K2F35I2SG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.45

Radial, Disc

YES

1152-FCBGA (35x35)

1152

KYOCERA AVX

100V

-30°C ~ 85°C

Tray

-

0.197 Dia (5.00mm)

±5%

活跃

C0G, NP0

通用型

8542.39.00.01

22 pF

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

-

0.197 (5.00mm)

0.9 V

INDUSTRIAL

1.5GHz

256KB

Straight

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

--

-

0.157 (4.00mm)

35 mm

35 mm

-

-

10AS048E1F29E1SG 10AS048E1F29E1SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

1N3027

22 Ohms

活跃

360

29 X 29 MM, ROHS COMPLIANT, FBGA-780

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

10AS048E1F29E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.68

DO-213AB, MELF (Glass)

YES

DO-213AB (MELF, LL41)

780

微芯片技术

Bulk

-55°C ~ 175°C

Tray

Military, MIL-PRF-19500/115

±2%

Discontinued at Digi-Key

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

OTHER

1.5GHz

256KB

10 µA @ 15.2 V

1.2 V @ 200 mA

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1 W

MCU, FPGA

360

3.35 mm

现场可编程门阵列

20 V

FPGA - 480K Logic Elements

480000

--

29 mm

29 mm

10AS048E2F29E2SG 10AS048E2F29E2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

MS27497E12B

活跃

360

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

10AS048E2F29E2SG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

YES

780

Corsair

Bag

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

29 mm

29 mm

10AS066K4F35E3SG 10AS066K4F35E3SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

121065

活跃

396

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

24

SMD/SMT

82500 LAB

973546

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

10AS066K4F35E3SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

SoC FPGA

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Molex

Bulk

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 660K Logic Elements

660000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS032H1F35E1SG 10AS032H1F35E1SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

Tray

R5F100

A/D 20x8/10b

活跃

Non-Compliant

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

0.9 V

0.87 V

100 °C

10AS032H1F35E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

100-LQFP

YES

100-LQFP (14x20)

1152

Renesas Electronics America Inc

82

-40°C ~ 85°C (TA)

Tray

RL78/G13

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

OTHER

Internal

32MHz

20K x 8

1.6V ~ 5.5V

RL78

DMA, LVD, POR, PWM, WDT

FLASH

16-Bit

256KB (256K x 8)

CSI, I²C, LINbus, UART/USART

MCU, FPGA

3.5 mm

现场可编程门阵列

8K x 8

FPGA - 320K Logic Elements

--

35 mm

35 mm

AGFA023R25A1I1V AGFA023R25A1I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

DS1100

Obsolete

480

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

8-uMAX/uSOP

Analog Devices Inc./Maxim Integrated

Tube

-40°C ~ 85°C

-

4.75V ~ 5.25V

Nonprogrammable

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

5

1

100ns

500ns

100 ns

AGFC019R25A2I3E AGFC019R25A2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

RN73H1E

活跃

480

0402 (1005 Metric)

0402

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RN73H

0.039 L x 0.020 W (1.00mm x 0.50mm)

±0.5%

2

±50ppm/°C

10.1 Ohms

Metal Film

0.063W, 1/16W

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.016 (0.40mm)

AEC-Q200

AGFB008R16A2E3E AGFB008R16A2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

RS73G2A

活跃

384

0805 (2012 Metric)

0805

KOA Speer Electronics, Inc.

Tape & Reel (TR)

-55°C ~ 155°C

RS73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±1%

2

±50ppm/°C

4.22 MOhms

厚膜

0.25W, 1/4W

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.024 (0.60mm)

AEC-Q200

AGFB012R24B2E3V AGFB012R24B2E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Panel Mount, Through Hole

Bulk

Metal

D38999/25HE

活跃

镍铁合金

Gold

768

-

-

不锈钢

-

氟硅弹性体

-

TE Connectivity Deutsch 连接器

600VAC, 850VDC

-65°C ~ 200°C

MIL-DTL-38999 Series III, DTS

Solder

Receptacle, Female Sockets

23

Silver

Aviation, Communication Systems, Industrial

Threaded

-

D

Shielded

抗环境干扰

化学镍

17-99

1.4GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MPU, FPGA

FPGA - 1.2M Logic Elements

-

密封

-

-

AGFB027R31C2I3V AGFB027R31C2I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Bulk

50 Ohms

UFL-2HF

-

活跃

Female

6 GHz

-

1.13mm OD Coaxial Cable

720

-

-

Free Hanging (In-Line)

Free Hanging (In-Line)

Hirose Electric Co Ltd

Female

-40°C ~ 90°C

U.FL

Gray

-

U.FL (UMCC) to U.FL (UMCC)

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

U.FL (UMCC) Plug, Right Angle

U.FL (UMCC) Plug, Right Angle

FPGA - 2.7M Logic Elements

-

-

2.756 (70.00mm)

XCZU3CG-1SFVA625E XCZU3CG-1SFVA625E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

180

XCZU3

625-BFBGA, FCBGA

625-FCBGA (21x21)

霍尼韦尔传感与生产力解决方案

Bulk

0°C ~ 100°C (TJ)

-

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU2EG-2SFVA625I XCZU2EG-2SFVA625I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

74AHC30

活跃

180

625-BFBGA, FCBGA

625-FCBGA (21x21)

恩智浦半导体

Bulk

-40°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCVP1202-2MLEVSVA2785 XCVP1202-2MLEVSVA2785

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, MLCC

Obsolete

50V

0805 (2012 Metric)

Vishay Vitramon

Tape & Reel (TR)

-55°C ~ 150°C

GA

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.1pF

C0G, NP0

汽车

3.3 pF

-

-

-

Epoxy Mountable, High Temperature

-

0.057 (1.45mm)

AEC-Q200

XCZU6CG1FFVB1156I XCZU6CG1FFVB1156I

Other 数据表

N/A

-

最小起订量: 1

倍率: 1

069008

活跃

Molex

Bulk

*

XC7Z014S2CLG400I XC7Z014S2CLG400I

Other 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

Vishay Sfernice

Tape & Box (TB)

*

10AS057H2F34I2SG 10AS057H2F34I2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

121024

活跃

492

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

24

SMD/SMT

71250 LAB

965012

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS057H2F34I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

Molex

Bulk

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS048K4F35I3LG 10AS048K4F35I3LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS048K4F35I3LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

YES

-

1152

Advantech Corp

Bulk

-

Tray

-

2.39 L x 2.01 W x 1.55 H (60.7mm x 51.1mm x 39.4mm)

活跃

ITE (Commercial)

6 W

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

CE, TUVgs

-

0.9 V

INDUSTRIAL

Positive Tip, Negative Sleeve

500mA

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

固定刀片

12V

MCU, FPGA

396

3.5 mm

现场可编程门阵列

Wall Mount (Class II)

Europe

72 (1.83m)

CEE 7/16

Phono Plug, 2.5mm O.D. x 11.5mm

-

FPGA - 480K Logic Elements

480000

--

35 mm

35 mm

10AS048K3F35I2SG 10AS048K3F35I2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

RNC60

活跃

396

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

-

2 x 32 kB

Details

Arria 10 SoC

Intel / Altera

Intel

965306

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS048K3F35I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

SoC FPGA

Axial

YES

Axial

1152

Vishay Dale

Tape & Reel (TR)

-65°C ~ 175°C

Tray

Military, MIL-PRF-55182/03, RNC60

0.097 Dia x 0.280 L (2.46mm x 7.11mm)

±0.1%

活跃

2

±50ppm/°C

124 Ohms

Metal Film

0.25W, 1/4W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

M (1%)

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

2 Core

--

Military, Moisture Resistant, Weldable

SoC FPGA

-

35 mm

35 mm

10AS066K3F35E2LG 10AS066K3F35E2LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

396

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

24

SMD/SMT

82500 LAB

965076

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

10AS066K3F35E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

SoC FPGA

0805 (2012 Metric)

YES

0805

1152

Stackpole Electronics Inc

Tape & Reel (TR)

-55°C ~ 155°C

Tray

RNCS

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.1%

活跃

2

±50ppm/°C

15.4 kOhms

Thin Film

0.1W, 1/10W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

-

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 660K Logic Elements

660000

2 Core

--

Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant

SoC FPGA

0.026 (0.65mm)

35 mm

35 mm

AEC-Q200

10AS022E3F29E1HG 10AS022E3F29E1HG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB

1.2 GHz

220000 LE

+ 100 C

0 C

36

SMD/SMT

27500 LAB

973472

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

10AS022E3F29E1HG

活跃

INTEL CORP

5.67

SoC FPGA

780-BBGA, FCBGA

780-FBGA (29x29)

288

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

12 Transceiver

FPGA - 220K Logic Elements

2 Core

--

SoC FPGA

XCZU25DR-1FFVE1156I XCZU25DR-1FFVE1156I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

*

活跃

XCZU27DR-L2FSVG1517I XCZU27DR-L2FSVG1517I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

*

活跃

5CSEBA6U23I7LN 5CSEBA6U23I7LN

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

Intel Corporation

活跃

INTEL CORP

5.79

5CSEBA6U23I7LN

Tray

*

活跃

compliant

现场可编程门阵列

10AS027H4F34E3SG 10AS027H4F34E3SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB

1.2 GHz

270000 LE

1.784333 oz

1

SMD/SMT

33750 LAB

965051

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

SoC FPGA

FBGA-1152

384

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 270K Logic Elements

2 Core

--

SoC FPGA