N/A

-

Glenair

Glenair

MCU - 151, FPGA - 66

Compliant

FBGA, BGA484,22X22,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA484,22X22,32

1.1 V

未说明

1.07 V

85 °C

有

5CSEBA5U19C7N

FBGA

SQUARE

活跃

INTEL CORP

1.13 V

5.55

64KB

军规圆形连接器

484-FBGA

YES

484

484-UBGA (19x19)

484

MIL-DTL-38999

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

85 °C

0 °C

Circular Connectors

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSEBA5

S-PBGA-B484

66

不合格

1.13 V

1.1,1.2/3.3,2.5 V

OTHER

800MHz

556.3 kB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

1.9 mm

现场可编程门阵列

85000

800 MHz

32075

7

FPGA - 85K Logic Elements

85000

--

Connectors

军规圆形连接器

19 mm

19 mm

N/A

-

Glenair

+ 110 C

0 C

1

矩形MIL规格连接器

Glenair

MIL-Spec / MIL-Type

800 mV

矩形MIL规格连接器

N/A

-

Glenair

+ 110 C

0 C

军规圆形连接器

Glenair

Circular Connectors

700 mV

军规圆形连接器

N/A

-

Glenair

+ 110 C

0 C

Glenair

Glenair

SOC - Systems on a Chip

700 mV

System-On-Modules - SOM

N/A

-

Glenair

+ 110 C

0 C

军规圆形连接器

Glenair

Circular Connectors

700 mV

军规圆形连接器

N/A

-

Glenair

+ 110 C

- 40 C

军规圆形连接器

Glenair

Circular Connectors

700 mV

军规圆形连接器

N/A

-

Glenair

+ 110 C

0 C

1

矩形MIL规格连接器

Glenair

MIL-Spec / MIL-Type

700 mV

矩形MIL规格连接器

N/A

-

Glenair

+ 110 C

- 40 C

1

军规圆形连接器

Glenair

Circular Connectors

800 mV

军规圆形连接器

N/A

-

Glenair

+ 110 C

0 C

军规圆形连接器

Glenair

Circular Connectors

700 mV

军规圆形连接器

N/A

-

Tray

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

561

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

366

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

MCU - 181, FPGA - 145

Box

672-FBGA

672-UBGA (23x23)

580 g

Compliant

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

800MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 40K Logic Elements

--

Unknown

N/A

-

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5ASTMD3E3F31I5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.29

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

-40°C ~ 100°C (TJ)

Tray

Arria V ST

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

BOTTOM

BALL

未说明

1 mm

compliant

5ASTMD3

S-PBGA-B896

540

不合格

1.1,1.2/3.3,2.5 V

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

31 mm

31 mm

N/A

-

1517-BBGA, FCBGA

1517-FBGA (40x40)

MCU - 208, FPGA - 540

-40°C ~ 100°C (TJ)

Tray

Arria V ST

Obsolete

5ASTFD5

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 462K Logic Elements

--

N/A

-

288

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

有

10AS016E3F29E2SG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

1.97

780-BBGA, FCBGA

YES

780-FBGA (29x29)

780

Non-Compliant

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

288

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

3.35 mm

现场可编程门阵列

FPGA - 160K Logic Elements

160000

--

29 mm

29 mm

N/A

-

Compliant

384

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

965287

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS027H4F34I3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

SoC FPGA

FBGA-1152

YES

1152

200 V

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

1 %

活跃

SMD/SMT

210 kΩ

155 °C

-55 °C

厚膜

8542.39.00.01

SOC - Systems on a Chip

1 W

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

3246

1218

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

现场可编程门阵列

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

550 µm

3.2 mm

4.6 mm

N/A

-

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

964848

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS032E4F29I3SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

FBGA-780

YES

780

360

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

FPGA - 320K Logic Elements

320000

2 Core

--

SoC FPGA

29 mm

29 mm

N/A

-

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

965052

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS027H4F35I3SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

SoC FPGA

FBGA-1152

YES

1152

384

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.5 mm

现场可编程门阵列

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

35 mm

35 mm

N/A

-

Production (Last Updated: 1 year ago)

240

Non-Compliant

27 X 27 MM, ROHS COMPLIANT, FBGA-672

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

有

10AS027E1F27I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.64

672-BBGA, FCBGA

YES

672-FBGA (27x27)

672

PRODUCTION (Last Updated: 1 year ago)

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B672

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.25 mm

现场可编程门阵列

FPGA - 270K Logic Elements

--

27 mm

27 mm

N/A

-

0603

1608

+ 155 C

0.000071 oz

- 55 C

1000

PCB 安装

6-1879134-0

TE Connectivity

TE Connectivity / Holsworthy

Details

Thin Film Resistors - SMD

100 V

MouseReel

RN73

0.1 %

10 PPM / C

贴片大功率精密电阻器

41.2 kOhms

Resistors

62.5 mW (1/16 W)

Thin Film

SMD/SMT

700 mV

- 55 C to + 155 C

精密薄膜贴片电阻器

-

薄膜电阻器

0.45 mm

1.55 mm

0.8 mm

N/A

-

0.001764 oz

- 10 C

1000

SMD/SMT

CTS

CTS电子元件

Details

Crystals

5 mm x 3.2 mm

+ 60 C

MouseReel

445

30 PPM

SMD石英

Crystals

24.576 MHz

SMD/SMT

800 mV

12 pF

100 uW

40 Ohms

Crystals

1.35 mm

5 mm

3.2 mm

N/A

-

Cornell Dubilier

Cornell Dubilier - CDE

Details

+ 100 C

0 C

Aluminum Electrolytic Capacitors - Snap In

100

Bulk

381LR

220 uF

Capacitors

800 mV

电解电容器

N/A

-

+ 200 C

1.404962 oz

- 55 C

50

PCB 安装

Bourns

J.W. Miller

5 mOhms

Details

Power Inductors - Leaded

24.3 A

Tray

2300HT

15 %

Standard

Toroidal

大电流

Inductors, Chokes & Coils

Unshielded

Radial

700 mV

0.56 in

0.066 in

8.2 uH

1 kHz

Toroidal

功率感应器

固定电感器

32.512 mm

16.51 mm

N/A

-

0.091712 oz

- 40 C

1500

B41821A7687M000

EPCOS / TDK

35 VDC

EPCOS / TDK

Details

Aluminum Electrolytic Capacitors - Radial Leaded

+ 85 C

Bulk

B41821

20 %

680 uF

Capacitors

Radial

800 mV

电解电容器

10 mm

20 mm

N/A

-

AEC-Q200

+ 155 C

- 40 C

500

PCB 安装

TT Electronics

BI Technologies / TT Electronics

43 mOhms

Power Inductors - SMD

4.1 A

Reel

HA78

20 %

Standard

Wirewound

Inductors, Chokes & Coils

Shielded

SMD/SMT

700 mV

22 uH

1 kHz

功率感应器

3.6 A

固定电感器

8 mm

12.5 mm

12.5 mm