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类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

生命周期状态

安装类型

包装/外壳

表面安装

越来越多的功能

外壳材料

供应商器件包装

插入材料

终端数量

后壳材料，电镀

厂商

操作温度

系列

JESD-609代码

无铅代码

终端

连接器类型

定位的数量

端子表面处理

颜色

应用

HTS代码

紧固类型

子类别

额定电流

技术

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度（摄氏度）

入口保护

端子间距

Reach合规守则

额定电流

时间@峰值回流温度-最大值(s)

外壳完成

引脚数量

外壳尺寸-插入

JESD-30代码

输出的数量

资历状况

电源

温度等级

速度

内存大小

外壳尺寸，MIL

核心处理器

周边设备

程序内存大小

连接方式

电缆开口

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

筛选水平

速度等级

主要属性

寄存器数量

逻辑块数量

逻辑单元数

核数量

等效门数

闪光大小

特征

长度

宽度

触点表面处理厚度 - 配套

材料可燃性等级
XCZU65DR-2FFVE1156I XCZU65DR-2FFVE1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Bulk

Composite

CTVS07RF

活跃

Copper Alloy

Gold

面板安装

Bulkhead - Front Side Nut

Composite

Thermoplastic

-

Amphenol Aerospace Operations

-

-65°C ~ 200°C

MIL-DTL-38999 Series III, Tri-Start™ TV

Crimp

Receptacle, Male Pins

5

Silver

Aviation, Marine, Military

Threaded

B

Shielded

抗环境干扰

-

化学镍

11-5

-

-

-

50.0µin (1.27µm)

-

XCZU65DR-1FSVE1156I XCZU65DR-1FSVE1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

EDAC Inc.

Bulk

*

XCZU3CG-2SBVA484I XCZU3CG-2SBVA484I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

FCBGA

0.8500 V

0.808 V

82

0.892 V

82

Tray

XCZU3

活跃

Industrial grade

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

154,350

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

484

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

M2S060-FGG676 M2S060-FGG676

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Non-Compliant

387

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

676-BGA

676-FBGA (27x27)

微芯片技术

1.2000 V

0 to 85 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 60K Logic Modules

1 Core

256KB

XCZU11EG-2FFVF1517E XCZU11EG-2FFVF1517E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU11

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

464

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

M2S010TS-1FGG484T2 M2S010TS-1FGG484T2

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

233

Tray

M2S010

活跃

40

有

M2S010TS-1FGG484T2

Microsemi Corporation

活跃

MICROSEMI CORP

5.81

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

e1

有

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

1

FPGA - 10K Logic Modules

256KB

M2S090TS-1FGG676T2 M2S090TS-1FGG676T2

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

425

Tray

M2S090

活跃

676-BGA

676-FBGA (27x27)

微芯片技术

1.2000 V

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

512KB

XAZU4EV-L1SFVC784I XAZU4EV-L1SFVC784I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.698 V

0.742 V

252

Tray

XAZU4

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

0.7200 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

M2S010T-1FG484 M2S010T-1FG484

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.14 V

1.26 V

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S010T-1FG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.2000 V

0 to 85 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

M2S150T-1FCV484I M2S150T-1FCV484I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.14 V

1.26 V

273

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

484-BFBGA

484-FBGA (19x19)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 150K Logic Modules

1 Core

512KB

M2S010T-1VF400I M2S010T-1VF400I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.14 V

1.26 V

195

Tray

M2S010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

无

M2S010T-1VF400I

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

17 mm

17 mm

XCZU7EG-1FFVC1156I XCZU7EG-1FFVC1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.892 V

360

Tray

XCZU7

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.808 V

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

M2S090T-1FGG676I M2S090T-1FGG676I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

425

Tray

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

1.14 V

有

M2S090T-1FGG676I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.78

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

40

S-PBGA-B676

425

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

1

FPGA - 90K Logic Modules

86316

512KB

27 mm

27 mm

M2S150-1FCG1152I M2S150-1FCG1152I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

574

Tray

M2S150

活跃

-

166 MHz

146124 LE

SMD/SMT

-

64 kB

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 150K Logic Modules

1 Core

512KB

M2S010TS-1VFG400T2 M2S010TS-1VFG400T2

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

195

Tray

M2S010

活跃

,

40

有

M2S010TS-1VFG400T2

Microsemi Corporation

活跃

MICROSEMI CORP

5.8

400-LFBGA

400-VFBGA (17x17)

微芯片技术

1.2000 V

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

e1

有

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

1

FPGA - 10K Logic Modules

256KB

XCZU11EG-2FFVB1517E XCZU11EG-2FFVB1517E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU11

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

488

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

A2F200M3F-CSG288 A2F200M3F-CSG288

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.425 V

200000

1.575 V

MCU - 31, FPGA - 78

Tray

A2F200

活跃

11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-288

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA288,21X21,20

1.5 V

未说明

1.425 V

85 °C

有

A2F200M3F-CSG288

80 MHz

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

微芯片技术

1.5000 V

0 to 85 °C

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

OTHER

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

现场可编程门阵列

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

11 mm

11 mm

A2F200M3F-PQG208I A2F200M3F-PQG208I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.425 V

200000

1.575 V

MCU - 22, FPGA - 66

Tray

A2F200

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

有

A2F200M3F-PQG208I

80 MHz

FQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.51

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

1.5000 V

-40 to 100 °C

SmartFusion®

Pure Matte Tin (Sn)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

66

不合格

1.5,1.8,2.5,3.3 V

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

4608 CLBS, 200000 GATES

4.1 mm

现场可编程门阵列

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

28 mm

28 mm

XCZU17EG-2FFVB1517I XCZU17EG-2FFVB1517I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU17

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

644

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU17EG-1FFVB1517I XCZU17EG-1FFVB1517I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU17

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

644

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU4EV-2FBVB900I XCZU4EV-2FBVB900I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.8500 V

0.808 V

204

0.892 V

204

Tray

XCZU4

活跃

Industrial grade

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

192,150

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

900

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU7CG-2FFVC1156I XCZU7CG-2FFVC1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

CE, CSA, UL

Cutler Hammer, Div of Eaton Corp

Panel

360

Tray

XCZU7

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

PDG52P1200D3WN

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

1,200 A

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU3CG-L1SBVA484I XCZU3CG-L1SBVA484I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

82

Tray

XCZU3

活跃

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

Miscellaneous

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

M2S050T-1VFG400I M2S050T-1VFG400I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Greenlee

1.2000 V

207

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

400-LFBGA

400-VFBGA (17x17)

微芯片技术

02466

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

XCZU2CG-L1SFVC784I XCZU2CG-L1SFVC784I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Cutler Hammer, Div of Eaton Corp

0.8500 V

252

Tray

XCZU2

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

DH227NRKV

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

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