N/A

-

Details

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

209

Tray

M2S005

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Production (Last Updated: 2 months ago)

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

138

Tray

M2S025

活跃

256-LFBGA

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

90

1.2000 V

1.14 V

1.26 V

207

Tray

M2S050

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

无

M2S050-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

48672

1 Core

256KB

17 mm

17 mm

N/A

-

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

40

SmartFusion2

1.2000 V

1.14 V

1.26 V

387

Tray

M2S060

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

40

1.14 V

有

M2S060-FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

387

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

STD

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

176

SmartFusion2

1.2000 V

1.14 V

1.26 V

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

有

M2S060-FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

STD

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

N/A

-

Production (Last Updated: 2 months ago)

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

200

Tray

M2S050

活跃

TFBGA, BGA325,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

无

M2S050T-FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

27

377

Tray

M2S050

活跃

896-BGA

896-FBGA (31x31)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

209

Tray

M2S005

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Production (Last Updated: 2 months ago)

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

27

377

Tray

M2S050

活跃

FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

无

M2S050-FG896I

50 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.26

FPBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B896

377

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

48672 CLBS

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

48672

56340

1 Core

256KB

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S060TS-1FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

1.2 V

1.14 V

1.26 V

267

Tray

M2S090

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

N/A

-

Details

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

84

273

Tray

M2S150

活跃

VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

BGA484,22X22,32

1.2 V

40

1.14 V

有

M2S150-1FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B484

273

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

273

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

19 mm

19 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

40

425

Tray

M2S090

活跃

BGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

90

207

Tray

M2S050

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S050T-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

48672

1 Core

256KB

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

60

267

Tray

M2S025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S025TS-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

23 mm

23 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

209

Tray

M2S005

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

0.710494 oz

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

267

Tray

M2S060

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

含铅

N/A

-

Production (Last Updated: 2 months ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

176

180

Tray

M2S025

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

有

M2S025TS-1FCSG325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

N/A

-

N

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

40

425

Tray

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

无

M2S090TS-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

40

425

Tray

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

无

M2S090TS-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

BGA-676

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

27

1.2000 V

377

Tray

M2S050

活跃

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

有

M2S050-1FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

FPBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

40

425

Tray

M2S090

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

40

1.14 V

有

M2S090-FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

BGA-676

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

60

1.2000 V

1.14 V

1.26 V

233

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

无

M2S010TS-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

1 Core

256KB

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

无

M2S060T-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

N/A

-

Details

100 MHz

-

-

64 kB

6000 LE

有

-

90

SmartFusion

1.5000 V

1.425 V

500000

1.575 V

MCU - 25, FPGA - 66

Tray

A2F500

活跃

3

有

A2F500M3G-1FGG256M

活跃

MICROSEMI CORP

5.79

256-LBGA

256

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

A2F500

125 °C

-55 °C

8542.39.00.01

compliant

100 MHz

EBI/EMI, Ethernet, I2C, SPI, UART, USART

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ARM

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB