N/A

-

有

80 MHz

64 I/O

54 Mbps

+ 85 C

3.63 V

- 40 C

168

2.97 V

SMD/SMT

287 mA

CAN, I2C, SPI, UART

88 mA

Microchip

Microchip Technology / Atmel

SRAM

256 kB

Tray

PIC32MZ1025

A/D 20x12b SAR

活跃

RF System on a Chip - SoC

表面贴装

DQFN-132

132-VQFN (10x10)

微芯片技术

MSL 3 - 168 hours

-40°C ~ 85°C (TA)

Tray

PIC® 32MZ

Wi-Fi

Wireless & RF Integrated Circuits

Si

2.4 GHz

CAN, Ethernet, I2C, I2S, SPI, UART, USB

Internal

200MHz

256K x 8

2.97V ~ 3.63V

MIPS32® M-Class

Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT

Flash

32-Bit Single-Core

1MB

CANbus, Ethernet, I²C, IrDA, SPI, SQI, UART/USART, USB OTG

21.5 dBm

32bit

-

- 76 dBm

20 Channel

RF System on a Chip - SoC

PIC32 MZ

N/A

-

External

MCU - 31, FPGA - 78

Tray

A2F200

活跃

288-TFBGA, CSPBGA

288-CSP (11x11)

ABS

ABS

微芯片技术

Compliant

-40°C ~ 100°C (TJ)

SmartFusion®

Grey

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

80 mm

无SVHC

UL94 HB

IP65

N/A

-

250V

574

Tray

活跃

通孔

Radial

1760-FCBGA (42.5x42.5)

Polyester, Metallized

AMD

--

-55°C ~ 105°C

Bulk

MKT369

0.492 L x 0.173 W (12.50mm x 4.40mm)

±10%

活跃

--

PC引脚

通用型

0.082µF

0.394 (10.00mm)

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

长寿命

0.370 (9.40mm)

--

N/A

-

活跃

574

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

Glenair

零售包装

-40°C ~ 100°C (TJ)

*

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

Bulk

Metal

M12D-04PMMS

活跃

Copper Alloy

Gold

面板安装

Bulkhead - Rear Side Nut

Zinc Alloy

Polyamide (PA), Nylon, Glass Filled

-

Amphenol LTW

250V

-40°C ~ 105°C

M

焊杯

Receptacle, Male Pins

4

Silver

-

Threaded

4A

D

Unshielded

IP68/IP69K - Dust Tight, Water Resistant, Waterproof

Nickel

M12-4

-

-

-

-

-

N/A

-

活跃

360

29 X 29 MM, ROHS COMPLIANT, FBGA-780

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.68

10AS048E1F29I1SG

有

100 °C

2010 (5025 Metric)

YES

2010

780

Kamaya Inc.

Tape & Reel (TR)

-55°C ~ 155°C

Tray

RMC

0.197 L x 0.098 W (5.00mm x 2.50mm)

±1%

Discontinued at Digi-Key

2

±100ppm/°C

2.32 kOhms

厚膜

0.75W, 3/4W

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B780

-

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.35 mm

现场可编程门阵列

FPGA - 480K Logic Elements

--

-

0.028 (0.70mm)

29 mm

29 mm

-

N/A

-

RN73R1E

活跃

492

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

有

10AS048H2F34I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.68

0402 (1005 Metric)

YES

0402

1152

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

Tray

RN73R

0.039 L x 0.020 W (1.00mm x 0.50mm)

±0.25%

Discontinued at Digi-Key

2

±10ppm/°C

3.28 kOhms

Thin Film

0.063W, 1/16W

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

-

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.65 mm

现场可编程门阵列

FPGA - 480K Logic Elements

--

Automotive AEC-Q200, Moisture Resistant

0.016 (0.40mm)

35 mm

35 mm

AEC-Q200

N/A

-

活跃

240

Non-Compliant

27 X 27 MM, ROHS COMPLIANT, FBGA-672

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

有

10AS032E2F27I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

672-BBGA, FCBGA

YES

672-FBGA (27x27)

672

PEI-Genesis

Bulk

-40°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B672

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.25 mm

现场可编程门阵列

FPGA - 320K Logic Elements

--

27 mm

27 mm

N/A

-

533

活跃

360

Non-Compliant

29 X 29 MM, ROHS COMPLIANT, FBGA-780

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

有

10AS032E1F29I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

表面贴装

4-SMD, No Lead

YES

780-FBGA (29x29)

780

CTS-Frequency Controls

Tape & Reel (TR)

-20°C ~ 70°C

Tray

533

0.197 L x 0.126 W (5.00mm x 3.20mm)

Discontinued at Digi-Key

TCXO

8542.39.00.01

3V

BOTTOM

BALL

1 mm

compliant

24 MHz

±2ppm

HCMOS

S-PBGA-B780

Standby (Power Down)

Crystal

10mA

INDUSTRIAL

10µA

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.35 mm

现场可编程门阵列

-

FPGA - 320K Logic Elements

--

0.065 (1.65mm)

29 mm

29 mm

-

N/A

-

活跃

396

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

有

10AS057K1F35I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

PEI-Genesis

Bulk

-40°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

--

35 mm

35 mm

N/A

-

活跃

704

Glenair

零售包装

-40°C ~ 100°C (TJ)

Tray

*

活跃

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 2800K Logic Elements

--

N/A

-

活跃

688

PEI-Genesis

Bulk

0°C ~ 100°C (TJ)

Tray

*

活跃

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 2500K Logic Elements

--

N/A

-

活跃

396

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

10AS066K4F35I3SGES

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Knowles Syfer

Tape & Reel (TR)

-40°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

FPGA - 660K Logic Elements

--

35 mm

35 mm

N/A

-

活跃

396

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

- 40 C

24

SMD/SMT

82500 LAB

967072

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

有

10AS066K2F35I1HG

活跃

INTEL CORP

5.67

SoC FPGA

1152-BBGA, FCBGA

1152-FBGA (35x35)

PEI-Genesis

Bulk

-40°C ~ 100°C (TJ)

Tray

*

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 660K Logic Elements

2 Core

--

SoC FPGA

N/A

-

活跃

588

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

21

SMD/SMT

71250 LAB

965378

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS057N3F40I2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

Axial

YES

Axial

1517

Stackpole Electronics Inc

Bulk

-55°C ~ 155°C

Tray

RNF

0.108 Dia x 0.344 L (2.75mm x 8.75mm)

±1%

活跃

2

±100ppm/°C

487 kOhms

Metal Film

0.5W, 1/2W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1517

588

不合格

-

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

588

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

2 Core

--

Flame Retardant Coating, Safety

SoC FPGA

-

40 mm

40 mm

N/A

-

活跃

1160

有

This product may require additional documentation to export from the United States.

4 x 32 kB

1 GHz

2800000 LE

+ 100 C

- 40 C

10

SMD/SMT

350000 LAB

960576

Intel

Intel / Altera

Stratix

Details

4 x 32 kB

-

SoC FPGA

表面贴装

4-SMD, No Lead

SiTime

Tape & Reel (TR)

-40°C ~ 85°C

Tray

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

活跃

XO (Standard)

SOC - Systems on a Chip

2.5V

74.175824 MHz

±10ppm

LVCMOS, LVTTL

Standby (Power Down)

MEMS

33mA

0.85 V

70µA

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

-

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

24 Transceiver

-

FPGA - 2800K Logic Elements

4 Core

--

SoC FPGA

0.039 (1.00mm)

-

N/A

-

活跃

696

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

21

SMD/SMT

71250 LAB

965015

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

0.9 V

未说明

0.87 V

100 °C

有

10AS057K2F40E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

1517-BBGA, FCBGA

YES

1517-FCBGA (40x40)

1517

Glenair

零售包装

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1517

696

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

696

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

40 mm

40 mm

N/A

-

492

有

2 x 32 kB

1.2 GHz

660000 LE

24

SMD/SMT

82500 LAB

965023

Intel

Intel / Altera

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

100 °C

10AS066H3F34I2LG

BGA

SQUARE

活跃

INTEL CORP

活跃

This product may require additional documentation to export from the United States.

Arria 10 SoC

Details

0.9 V

未说明

0.87 V

有

0.93 V

5.45

SoC FPGA

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

Glenair

零售包装

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 660K Logic Elements

660000

2 Core

--

SoC FPGA

35 mm

35 mm

N/A

-

活跃

492

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS048H4F34I3SG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

YES

1152

EDAC Inc.

Bulk

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

35 mm

35 mm

N/A

-

活跃

384

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

965061

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS032H3F35E2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

FBGA-1152

YES

1152

EDAC Inc.

Bulk

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.5 mm

现场可编程门阵列

FPGA - 320K Logic Elements

320000

2 Core

--

SoC FPGA

35 mm

35 mm

N/A

-

活跃

240

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

965289

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

0.9 V

未说明

0.87 V

100 °C

有

10AS032E2F27E2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

FBGA-672

YES

672

Glenair

零售包装

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

FPGA - 320K Logic Elements

320000

2 Core

--

SoC FPGA

27 mm

27 mm

N/A

-

Metal

活跃

Copper Alloy

Gold

360

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

964847

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS032E4F29I3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

Panel Mount, Through Hole

FBGA-780

YES

Flange

不锈钢

780

Glenair

零售包装

-65°C ~ 175°C

Tray

806

活跃

Solder

Plug, Male Pins

Silver

8542.39.00.01

Threaded

SOC - Systems on a Chip

CMOS

BOTTOM

F

BALL

未说明

1 mm

compliant

Passivated

26-20A

S-PBGA-B780

360

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

FPGA - 320K Logic Elements

320000

2 Core

--

SoC FPGA

29 mm

29 mm

N/A

-

活跃

396

1152-BBGA, FCBGA

1152-FCBGA (35x35)

KYOCERA AVX

Bulk

-40°C ~ 100°C (TJ)

Tray

*

活跃

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 570K Logic Elements

--

N/A

-

Bulk

Metal

KJB0T

活跃

Gold

240

Non-Compliant

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

964965

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

0.9 V

未说明

0.87 V

100 °C

有

10AS027E2F27E2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

SoC FPGA

面板安装

FBGA-672

YES

Flange

铝合金

672

ITT Cannon, LLC

-

-65°C ~ 175°C

Tray

KJB

活跃

Crimp

Receptacle, Female Sockets

22

橄榄色

8542.39.00.01

Threaded

SOC - Systems on a Chip

-

CMOS

BOTTOM

C

BALL

-

未说明

抗环境干扰

1 mm

compliant

橄榄色镉

13-35

S-PBGA-B672

240

不合格

0.9 V

OTHER

1.5GHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

FPGA - 270K Logic Elements

270000

2 Core

--

-

SoC FPGA

27 mm

27 mm

50.0µin (1.27µm)

N/A

-

SG-8101

活跃

360

有

2 x 32 kB

1.2 GHz

270000 LE

+ 100 C

0 C

36

SMD/SMT

33750 LAB

965044

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

有

10AS027E2F29E1HG

活跃

INTEL CORP

5.64

SoC FPGA

表面贴装

4-SMD, No Lead

780-FBGA (29x29)

EPSON

Tape & Reel (TR)

-40°C ~ 85°C

Tray

SG-8101

0.197 L x 0.126 W (5.00mm x 3.20mm)

活跃

XO (Standard)

SOC - Systems on a Chip

1.8V ~ 3.3V

unknown

36.7 MHz

±15ppm

CMOS

Standby (Power Down)

Crystal

6.8mA (Typ)

950 mV

1.1µA

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

12 Transceiver

-

FPGA - 270K Logic Elements

2 Core

--

SoC FPGA

0.051 (1.30mm)

-