N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

176

SmartFusion2

RISC

1.2, 1.5, 1.8, 2.5, 3.3 V

1

CAN/Ethernet/Serial I2C/SPI/UART/USB

有

表面贴装

200

Tray

M2S060

活跃

Industrial grade

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

325

1.2 V

CAN/Ethernet/Serial

166MHz

64 KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

32 Bit

Industrial

FPGA - 60K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

90

SmartFusion2

1.2000 V

1.14 V

1.26 V

207

Tray

M2S060

活跃

400-LFBGA

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 60K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

176

180

Tray

M2S025

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

无

M2S025-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

90

1.2000 V

1.14 V

1.26 V

195

Tray

M2S010

活跃

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

176

1.2000 V

1.14 V

1.26 V

180

Tray

M2S090

活跃

TFBGA, BGA325,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

有

M2S090-1FCSG325I

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.78

FCBGA-325

YES

325-FCBGA (11x13.5)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

1

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

2.5, 3.3 V

1.14 V

1.26 V

200

Tray

M2S050

活跃

TFBGA, BGA325,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

有

M2S050T-FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

0.046530 oz

84

Tray

M2S005

活跃

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

267

Tray

M2S090

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S090-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

N/A

-

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

161 I/O

0 C

+ 85 C

191 kbit

有

505 LAB

119

0.167354 oz

Tray

M2S005

活跃

LFBGA, BGA256,16X16,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

有

M2S005-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

BGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

Details

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

161

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

161

1.56 mm

现场可编程门阵列

STD

FPGA - 5K Logic Modules

6060

1 Core

128KB

14 mm

14 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

90

169

Tray

M2S005

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S005S-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

200

Tray

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

有

M2S050TS-1FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.82

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

209

Tray

M2S005

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

90

1.2000 V

1.14 V

1.26 V

169

Tray

M2S005

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S005-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.86

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 5K Logic Modules

4956

1 Core

128KB

17 mm

17 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

60

267

Tray

M2S025

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

484-BGA

484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

85 °C

0 °C

1.2 V

166MHz

164.3 kB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 60K Logic Modules

1 Core

256KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

60

267

Tray

M2S050

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

1.14 V

125 °C

无

M2S050T-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

176

180

Tray

M2S090

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

有

M2S090T-1FCSG325I

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.78

FCBGA-325

YES

325-FCBGA (11x13.5)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

N/A

-

Details

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

84

273

Tray

M2S150

活跃

VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

40

1.14 V

有

M2S150TS-FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.82

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

有

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

1 Core

512KB

19 mm

19 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

90

195

Tray

M2S010

活跃

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

200

Tray

M2S050

活跃

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

N/A

-

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

60

1.2000 V

233

Tray

M2S010

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

Details

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 10K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

176

180

Tray

M2S025

活跃

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S060T-FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

N/A

-

N

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

90

1.2000 V

1.14 V

1.26 V

207

Tray

M2S025

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S025T-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

STD

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

119

138

Tray

M2S010

活跃

LFBGA, BGA256,16X16,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

无

M2S010-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm