类别是'评估板 - 嵌入式 - 复杂逻辑器件(FPGA, CPLD)'
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 引脚数 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 操作模式 | 传播延迟 | 输入数量 | 组织结构 | 座位高度-最大 | 内存宽度 | 可编程逻辑类型 | 记忆密度 | 阀门数量 | 并行/串行 | 内存IC类型 | 速度等级 | 输出功能 | 宏细胞数 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 专用输入数量 | 等效门数 | 系统内可编程 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||
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![]() | XC4036XLA-09HQ160C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | HQFP, HQFP160,1.2SQ | 5.81 | 227 MHz | 3 | 85 °C | PLASTIC/EPOXY | HQFP | HQFP160,1.2SQ | SQUARE | FLATPACK, HEAT SINK/SLUG | 3.6 V | 3.3 V | 30 | 3 V | 160 | XC4036XLA-09HQ160C | e0 | 锡铅 | CAN ALSO USE 65000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 288 | 不合格 | 3.3 V | OTHER | 288 | 1296 CLBS, 22000 GATES | 4.1 mm | 现场可编程门阵列 | 1.1 ns | 1296 | 1296 | 22000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | XCS30XL-3BG256I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | BGA | BGA, | 5.83 | 3 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.6 V | 3.3 V | 30 | 3 V | 256 | XCS30XL-3BG256I | e0 | 无 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | compliant | 256 | S-PBGA-B256 | 不合格 | 576 CLBS, 10000 GATES | 3.5 mm | 现场可编程门阵列 | 576 | 10000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | XC4085XLA-08HQ208C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | PLASTIC/EPOXY | HFQFP | HQFP208,1.2SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 | 263 MHz | 5.85 | QFP-208 | QFP | XILINX INC | Obsolete | 无 | XC4085XLA-08HQ208C | 3 V | 208 | 85 °C | e0 | 无 | Tin/Lead (Sn85Pb15) | CAN ALSO USE 180000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 208 | S-PQFP-G208 | 160 | 不合格 | 3.3 V | OTHER | 160 | 3136 CLBS, 55000 GATES | 4.1 mm | 现场可编程门阵列 | 1 ns | 3136 | 7448 | 55000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||
![]() | XQ6VLX240T-1RF784M | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | 活跃 | XILINX INC | 5.82 | 未说明 | XQ6VLX240T-1RF784M | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 未说明 | compliant | 现场可编程门阵列 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV150-6FGG456I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, | 5.82 | 333 MHz | 3 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 2.625 V | 2.5 V | 30 | 2.375 V | 456 | XCV150-6FGG456I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 456 | S-PBGA-B456 | 不合格 | 864 CLBS, 164674 GATES | 2.6 mm | 现场可编程门阵列 | 0.6 ns | 864 | 164674 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | XCV100-6BGG256C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, | 5.81 | 333 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 2.625 V | 2.5 V | 30 | Compliant | 2.375 V | 256 | XCV100-6BGG256C | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.27 mm | compliant | 256 | S-PBGA-B256 | 不合格 | OTHER | 600 CLBS, 108904 GATES | 2.55 mm | 现场可编程门阵列 | 108904 | 0.6 ns | 600 | 108904 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||
![]() | XCF01SVOG20C0936 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | TSSOP | TSSOP, | 5.48 | 3 | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 30 | 20 | XCF01SVOG20C0936 | e3 | 有 | 3A991.B.1 | 哑光锡 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 20 | R-PDSO-G20 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 1MX1 | 1.19 mm | 1 | 1048576 bit | SERIAL | 配置存储器 | 6.5024 mm | 4.4 mm | |||||||||||||||||||||||||||||||||
![]() | XC3090-100CB164M | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | GQFF, TAPEPAK,164P,.025 | 5.82 | 100 MHz | 1 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | TAPEPAK,164P,.025 | SQUARE | FLATPACK, GUARD RING | 5 V | 未说明 | 164 | XC3090-100CB164M | e0 | 3A001.A.2.C | 锡铅 | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | 8542.39.00.01 | QUAD | FLAT | 225 | 0.65 mm | unknown | 164 | S-CQFP-F164 | 142 | 不合格 | 5 V | MILITARY | 142 | 320 CLBS, 5000 GATES | 2.921 mm | 现场可编程门阵列 | 7 ns | 320 | 320 | 5000 | 28.702 mm | 28.702 mm | |||||||||||||||||||||||||||||||||
![]() | XC3064-100PG132M | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 有 | Obsolete | XILINX INC | PGA | PGA, PGA132,14X14 | 5.79 | 100 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA132,14X14 | SQUARE | 网格排列 | 5 V | 未说明 | Compliant | 132 | 132 | XC3064-100PG132M | 3A001.A.2.C | 125 °C | -55 °C | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 未说明 | 2.54 mm | unknown | 132 | S-CPGA-P132 | 110 | 不合格 | 5 V | 5 V | MILITARY | 5.6 kB | 110 | 224 CLBS, 3500 GATES | 3.9116 mm | 现场可编程门阵列 | 100 | 688 | 7 ns | 224 | 224 | 3500 | 37.084 mm | 37.084 mm | 无 | |||||||||||||||||||||||||||
![]() | XC4028XLA-07BG256C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | BGA | PLASTIC, BGA-256 | 5.81 | 294 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA256,20X20,50 | SQUARE | 网格排列 | 3.6 V | 3 V | 3.3 V | 30 | Non-Compliant | 256 | XC4028XLA-07BG256C | e0 | 无 | Tin/Lead (Sn63Pb37) | CAN ALSO USE 50000 GATES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | not_compliant | 256 | S-PBGA-B256 | 256 | 不合格 | 3.3 V | OTHER | 256 | 1024 CLBS, 18000 GATES | 2.55 mm | 现场可编程门阵列 | 0.9 ns | 1024 | 1024 | 18000 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||
![]() | XC4028XLA-08HQ208I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | QFP-208 | 5.83 | 263 MHz | 3 | PLASTIC/EPOXY | HFQFP | HQFP208,1.2SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 30 | Compliant | 3 V | 208 | 208 | XC4028XLA-08HQ208I | e0 | Tin/Lead (Sn85Pb15) | 100 °C | -40 °C | CAN ALSO USE 50000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 208 | S-PQFP-G208 | 256 | 不合格 | 3.3 V | 3.3 V | 4 kB | 256 | 1024 CLBS, 18000 GATES | 4.1 mm | 现场可编程门阵列 | 8 | 2560 | 1 ns | 1024 | 1024 | 18000 | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||
![]() | XC4036XLA-07BG432I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | 5.92 | 294 MHz | 3 | PLASTIC/EPOXY | BGA | BGA432,31X31,50 | SQUARE | 网格排列 | 3.3 V | 432 | XC4036XLA-07BG432I | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.27 mm | not_compliant | S-PBGA-B432 | 288 | 不合格 | 3.3 V | 288 | 现场可编程门阵列 | 1296 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4044XLA-08HQ160C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | HQFP, HQFP160,1.2SQ | 5.81 | 263 MHz | 3 | 85 °C | PLASTIC/EPOXY | HQFP | HQFP160,1.2SQ | SQUARE | FLATPACK, HEAT SINK/SLUG | 3.6 V | 3.3 V | 30 | 3 V | 160 | XC4044XLA-08HQ160C | e0 | 锡铅 | CAN ALSO USE 80000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 320 | 不合格 | 3.3 V | OTHER | 320 | 1600 CLBS, 27000 GATES | 4.1 mm | 现场可编程门阵列 | 1 ns | 1600 | 1600 | 27000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | XCV50E-8FGG256I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, BGA256,16X16,40 | 5.8 | 416 MHz | 3 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | 256 | XCV50E-8FGG256I | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | 176 | 不合格 | 1.2/3.6,1.8 V | 176 | 384 CLBS, 20736 GATES | 2 mm | 现场可编程门阵列 | 0.4 ns | 384 | 1728 | 20736 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
![]() | XQ4VLX25-10FF668I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | 活跃 | XILINX INC | 5.85 | 4 | XQ4VLX25-10FF668I | e0 | Tin/Lead (Sn63Pb37) | not_compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV50E-8PQG240I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | QFP | FQFP, QFP240,1.3SQ,20 | 5.8 | 416 MHz | 3 | PLASTIC/EPOXY | FQFP | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.89 V | 1.8 V | 40 | 1.71 V | 240 | XCV50E-8PQG240I | e3 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 158 | 不合格 | 1.2/3.6,1.8 V | 158 | 384 CLBS, 20736 GATES | 4.1 mm | 现场可编程门阵列 | 0.4 ns | 384 | 1728 | 20736 | 32 mm | 32 mm | ||||||||||||||||||||||||||||||||||||
![]() | XC18V04VQ44C0901 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | TQFP, | 5.6 | 20 ns | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | SQUARE | FLATPACK, THIN PROFILE | 3.3 V | 30 | Non-Compliant | 44 | XC18V04VQ44C0901 | e0 | 无 | 3A001.B.1.A | 锡铅 | 8542.32.00.71 | QUAD | 鸥翼 | 225 | 1 | 0.8 mm | compliant | 44 | S-PQFP-G44 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 512KX8 | 1.2 mm | 8 | 4194304 bit | PARALLEL/SERIAL | 配置存储器 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||
![]() | XC4085XLA-07HQ208I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | 5.88 | 294 MHz | 3 | PLASTIC/EPOXY | HLFQFP | HQFP208,1.2SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 3.3 V | 208 | XC4085XLA-07HQ208I | e0 | Tin/Lead (Sn85Pb15) | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G208 | 160 | 不合格 | 3.3 V | 160 | 现场可编程门阵列 | 7448 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV300-6BGG352I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.79 | 333 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 2.625 V | 2.5 V | 30 | 2.375 V | 352 | XCV300-6BGG352I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1.27 mm | compliant | 352 | S-PBGA-B352 | 不合格 | 1536 CLBS, 322970 GATES | 1.7 mm | 现场可编程门阵列 | 0.6 ns | 1536 | 322970 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | XCV600-4FGG676I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, | 5.8 | 250 MHz | 3 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 2.625 V | 2.5 V | 30 | 2.375 V | 676 | XCV600-4FGG676I | e1 | 有 | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 676 | S-PBGA-B676 | 不合格 | 3456 CLBS, 661111 GATES | 2.6 mm | 现场可编程门阵列 | 0.8 ns | 3456 | 661111 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||
![]() | XC2V40-5BF957C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | XILINX INC | , | 5.58 | XC2V40-5BF957C | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4062XLA-08BG560I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | BGA | PLASTIC, BGA-560 | 5.82 | 263 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA560,33X33,50 | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 30 | 3 V | 560 | XC4062XLA-08BG560I | e0 | Tin/Lead (Sn63Pb37) | CAN ALSO USE 130000 GATES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | not_compliant | 560 | S-PBGA-B560 | 384 | 不合格 | 3.3 V | 384 | 2304 CLBS, 40000 GATES | 1.7 mm | 现场可编程门阵列 | 1 ns | 2304 | 2304 | 40000 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||
![]() | XCV600-5BGG432I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.78 | 294 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 2.625 V | 2.5 V | 30 | 2.375 V | 432 | XCV600-5BGG432I | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | 不合格 | 3456 CLBS, 661111 GATES | 1.7 mm | 现场可编程门阵列 | 0.7 ns | 3456 | 661111 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||
![]() | XC4052XLA-08HQ208C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | QFP-208 | 8.75 | 263 MHz | 3 | 85 °C | PLASTIC/EPOXY | HFQFP | HQFP208,1.2SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 30 | Non-Compliant | 3 V | 208 | XC4052XLA-08HQ208C | e0 | 无 | Tin/Lead (Sn85Pb15) | CAN ALSO USE 100000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 208 | S-PQFP-G208 | 160 | 不合格 | 3.3 V | OTHER | 160 | 1936 CLBS, 33000 GATES | 4.1 mm | 现场可编程门阵列 | 1 ns | 1936 | 4598 | 33000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||
![]() | XC7372-7PC84C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | LCC | PLASTIC, LCC-84 | 5.86 | 95.2 MHz | 3 | 37 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | 5.25 V | 5 V | Non-Compliant | 4.75 V | 84 | XC7372-7PC84C | e0 | Tin/Lead (Sn85Pb15) | 72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 84 | S-PQCC-J84 | 不合格 | 3.3/5,5 V | COMMERCIAL | 18.5 ns | 12 DEDICATED INPUTS, 37 I/O | 5.08 mm | OT PLD | MACROCELL | 72 | NO | 12 | NO | 29.3116 mm | 29.3116 mm |