类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 最高工作温度 | 最小工作温度 | HTS代码 | 额定功率 | 电压 - 供电 | 端子位置 | 功能数量 | 端子间距 | 频率 | 基本部件号 | 最大输出电流 | 工作电源电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 数据率 | 使用的 IC/零件 | 议定书 | 最高频率 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 敏感度 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |
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 | ZICM357SP2-1C-HT-R | CEL | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | -40°C~110°C | Tape & Reel (TR) | MeshConnect™ | 活跃 | 3 (168 Hours) | 2.1V~3.6V | 2.4GHz | SPI, UART | 192kB Flash 12kB SRAM | 250kbps | EM357 | Zigbee® | 20dBm | 802.15.4 | Antenna Not Included, Castellation | JTAG, SPI, UART | 34mA | 150mA~175mA | -103 dBm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | WT41U-A-AI56IAPC | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | Strip | 活跃 | 3 (168 Hours) | |||||||||||||||||||||||||||||||||||||||||||||||
 | SM1231E433A | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tray | 2007 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 1.8V~3.6V | 433MHz | SM123 | SPI | 300kbps | SX1231 | 17dBm | General ISM < 1GHz | 不包括天线 | -120dBm | SPI | 16mA | 16mA~95mA | FSK, GFSK, GMSK, MSK, OOK | -120 dBm | 符合RoHS标准 | ||||||||||||||||||||||||||
 | XC09-038WNC | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Module | 0°C~70°C | Bulk | 2006 | 9XCite™ | Obsolete | 1 (Unlimited) | 2.85V~5.5V | 900MHz | 37.5kbps | 6dBm | General ISM < 1GHz | Integrated, Wire Antenna | -108dBm | UART | 45mA~55mA | 55mA | FHSS, FSK | ||||||||||||||||||||||||||||||||||
 | Z357PA10-SMT-P-PC | MMB Networks | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tray | RapidConnect™ | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.7V~3.6V | 2.4GHz | SPI, UART | 192kB Flash 12kB RAM | 921.6kbps | EM357 | Zigbee® | 20dBm | 802.15.4 | Integrated, Chip | -102dBm | SPI, UART | 28mA | 205mA~208mA | -102 dBm | 符合RoHS标准 | |||||||||||||||||||||||||||
| ZICM3588SP2-2 | CEL | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 33-SMD Module | -40°C~85°C | Bulk | MeshConnect™ | Discontinued | 3 (168 Hours) | 3.3V | 2.4GHz | 512kB Flash 64kB SRAM | 250kbps | EM3588 | Zigbee® | 20dBm | 802.15.4 | Antenna Not Included, Castellation | -103dBm | SPI, UART | 34mA | 150mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| ZICM3588SP2-2C | CEL | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 33-SMD Module | -40°C~85°C | Bulk | MeshConnect™ | Discontinued | 3 (168 Hours) | 3.3V | 2.4GHz | 512kB Flash 64kB SRAM | 250kbps | EM3588 | Zigbee® | 20dBm | 802.15.4 | Antenna Not Included, Castellation | -103dBm | SPI, UART | 34mA | 150mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | RC1880 | Radiocrafts AS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 2017 | 活跃 | 供应商未定义 | 1.8V~3.8V | 862MHz~930MHz | 128kB Flash 20kB SRAM | 50kbps | CC1310 | 14dBm | General ISM < 1GHz | Antenna Not Included, Castellation | -110dBm | SPI, UART | 24mA | 32mA | 2FSK | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | WT32-A-AI4 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | Module | 50 | -30°C~85°C | Cut Tape (CT) | 2009 | Obsolete | 3 (168 Hours) | 50 | 8542.39.00.01 | 1.8V~3.6V | UNSPECIFIED | 1 | 1mm | 2.4GHz | 3.3V | SPI, Serial, UART, USB | 3Mbps | BlueCore5 | Bluetooth v2.1 + EDR, Class 2 | 电信电路 | 7dbm | Bluetooth | Integrated, Chip | -86dBm | I2S, PIO, SPI, UART, USB | 4.5mA | DQPSK, GFSK | -87 dBm | 2.6mm | 23.9mm | 15.9mm | 无 | 符合RoHS标准 | |||||||||||||||||
 | 317030015 | Seeed Technology Co., Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 40-SMD Module | Bulk | Obsolete | 1 (Unlimited) | 1.8V~3.6V | 2.4GHz | 256kB Flash 16kB RAM | 2Mbps | nRF51822 | Bluetooth v4.0 | 4dBm | Bluetooth | Integrated, Trace | -93dBm | I2C, SPI, UART | 13mA | 10.5mA | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | EBWT11U | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 表面贴装 | Module | -40°C~85°C | Bulk | 活跃 | 1 (Unlimited) | 3V~3.6V | 3Mbps | Bluetooth v2.1 + EDR, Class 1 | 17dBm | Bluetooth | Integrated, Chip + U.FL | -88dBm | SPI, UART, USB | 36mA | 88mA~138mA | ||||||||||||||||||||||||||||||||||||
 | 450-0104C | Laird - Wireless & Thermal Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -30°C~85°C | Strip | 2016 | TiWi-uB2 | 活跃 | 4 (72 Hours) | 2.2V~4.8V | 2.4GHz | 3.9Mbps | CC2564 | Bluetooth v4.0 Dual Mode | 10dBm | Bluetooth | 不包括天线 | -94dBm | UART | 44.5mA | 38.5mA~39.2mA | DPSK, DQPSK, FHSS, GFSK | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | A110LR09A00GR | Anaren | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Gold | 表面贴装 | 表面贴装 | 24-LGA | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2011 | AIR™ | 活跃 | 3 (168 Hours) | 1.8V~3.6V | 902MHz~928MHz | 600kbps | CSR8510 | 10dBm | General ISM < 1GHz | Integrated, Trace | SPI | 15mA | -112 dBm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | A2541R24A10GR | Anaren | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 2013 | AIR™ | yes | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 2V~3.6V | 2.4GHz | 256kB Flash 8kB RAM | 2Mbps | CC2541 | Bluetooth v4.0 | 1dBm | Bluetooth | Integrated, Trace | 14mA | 13mA | -94 dBm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | ENW-C9A21B4EF | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | PCB模块 | -40°C~85°C | Tape & Reel (TR) | 2010 | PAN4561L | 活跃 | 2 (1 Year) | 85°C | -40°C | 2.7V~3.4V | 2.4GHz | 60kB Flash 4kB RAM | 250kbps | MC13213 | 0dBm | 802.15.4 | Antenna Not Included, U.FL | -92dBm | I2C, UART | 45mA | 43mA | -92 dBm | ROHS3 Compliant | |||||||||||||||||||||||||||
 | HUM-868-PRC-UFL | Linx Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 32-SMD Module | -40°C~85°C | Tray | HumPRC™ | 活跃 | 1 (Unlimited) | 2V~3.6V | 863MHz~870MHz | 115.2kbps | 9.5dBm | General ISM < 1GHz | Antenna Not Included, U.FL | -100dBm | UART | 23.5mA | 22mA~40.5mA | FHSS, FSK | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| RN123-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 32-DIP Module | -30°C~85°C | Bulk | 2012 | WiFly GX | Obsolete | 1 (Unlimited) | 85°C | -30°C | 3V~3.6V | 2.4GHz | 48V | SPI, UART | 4MB Flash 300kB ROM 80kB RAM | 54Mbps | 802.11b/g | 18dBm | WiFi | Integrated, Chip + U.FL | -85dBm | UART | 40mA | 110mA | CDK, DBPSK, DQPSK, DSSS | -85 dBm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||
 | WYSBCVJXM | Taiyo Yuden | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | -30°C~85°C | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | 85°C | -30°C | 1.8V~3.3V | 2.4GHz | UART, USB | 300Mbps | 802.11a/b/g/n, Bluetooth v4.1 | 17dBm | Bluetooth, WiFi | Integrated, Chip | -88dBm | UART, USB | -88 dBm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| CC-MX-LB69-ZK-B | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Module | 2016 | ConnectCore® i.MX51 | Obsolete | 1 (Unlimited) | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| XB24-Z7SIT-001 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | -40°C~85°C | Bulk | 2007 | XBee® ZB | Obsolete | 1 (Unlimited) | 2.1V~3.6V | 2.4GHz | 250kbps | EM250 | Zigbee® | 1dBm | 802.15.4 | Antenna Not Included, RP-SMA | UART | 38mA~40mA | 35mA~45mA | DSSS | -96 dBm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | XBP24-ACI-001J | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | -40°C~85°C | Bulk | 2012 | XBee-Pro® 802.15.4 | Obsolete | 1 (Unlimited) | 2.8V~3.4V | 2.4GHz | 3.6V | ADC, UART | 250kbps | EM357 | 18dBm | 802.15.4 | Integrated, Chip | UART | 55mA | 215mA | DSSS | -100 dBm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | XT09-SI-NA | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 底座安装 | 底座安装 | Module | -40°C~85°C | Bulk | 2008 | XTend® | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1W | 2.8V~5.5V | 900MHz | 900mA | 5.5V | Serial, UART | 225kbps | 30dBm | General ISM < 1GHz | Antenna Not Included, RP-SMA | -110dBm | UART | 80mA | 90mA~730mA | FHSS, FSK | -110 dBm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
 | RM024-S50-M-01 | Laird - Wireless & Thermal Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tray | 2012 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.3V~3.6V | 2.4GHz | 3.3V | UART | 3.6V | 2.3V | 500kbps | RAMP | 2.4835GHz | 18dBm | General ISM > 1GHZ | Integrated, Chip | -95dBm | UART | 9.5mA~36mA | 40mA~166mA | FHSS, MSK | -95 dBm | Unknown | 符合RoHS标准 | |||||||||||||||||||||||
 | XT09-MI-NA | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 底座安装 | 底座安装 | Module | -40°C~85°C | Bulk | 2008 | XTend® | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1W | 2.8V~5.5V | 900MHz | 5.5V | Serial, UART | 225kbps | 30dBm | General ISM < 1GHz | Antenna Not Included, MMCX | -110dBm | UART | 80mA | 90mA~730mA | FHSS, FSK | -110 dBm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
 | ESP-32 | RF Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | Module | -40°C~85°C | 活跃 | 不适用 | 2.7V~3.6V | 2.4GHz~2.5GHz | 150Mbps | 802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3 | 20.5dBm | Bluetooth, WiFi | -97dBm | ADC, GPIO, I2C, I2S, PWM, SDIO, SPI, UART | CCK, DSSS, OFDM | 符合RoHS标准 |