类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 工作电源电压 | 通道数量 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 内存大小 | uPs/uCs/外围ICs类型 | 数据率 | 使用的 IC/零件 | 带宽 | 议定书 | 边界扫描 | 筛选水平 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 内存(字) | 敏感度 | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 总线兼容性 | 通用输入输出数量 | 环境温度范围高 | 固件版本 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | BM78SPPS5MC2-0002AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | Module | BM78SPPS5MC2-0002AA | -20°C~70°C | Tray | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 3.3V | UNSPECIFIED | 无铅 | 1 | 1.9V | 2.4GHz | BM78 | X-XXMA-N | 4MB Flash 320kB ROM 28kB SRAM | 32 kbps | Bluetooth v4.2 | 电信电路 | 10dBm | Bluetooth | Integrated, Chip | UART | 37mA | 43mA | -92 dBm | 7 | 70°C | 1.2 | 2.46mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | CYBLE-224110-00 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | Module | YES | -40°C~105°C | Cut Tape (CT) | 2015 | Obsolete | 3 (168 Hours) | 32 | 5A992.B | 8473.30.11.80 | 1.8V~5.5V | UNSPECIFIED | 无铅 | 1 | 3.3V | 0.76mm | 2.4GHz | R-XXMA-N32 | 256kB Flash 32kB SRAM | 1Mbps | Bluetooth v4.1 | 电信电路 | 9.5dBm | Bluetooth | Integrated, Chip | -95dBm | I2C, SPI, UART | 21.5mA | 20mA | 1.9mm | 15.4mm | 9.5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | CYBLE-022001-00 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 21-SMD Module | 21 | 17 | -40°C~85°C | Tape & Reel (TR) | 2015 | EZ-BLE™ PRoC™ | 活跃 | 3 (168 Hours) | 21 | 5A992.B | SEATED HGT-NOM | 8473.30.11.80 | 1.8V~4.5V | UNSPECIFIED | 无铅 | 260 | 3.3V | 0.76mm | 2.4GHz | 30 | I2C, SPI, UART | 128kB Flash 16kB SRAM | 1Mbps | Bluetooth v4.1 | NO | 3dBm | Bluetooth | Integrated, Chip | 16000 | I2C, SPI, UART | 16.4mA | 15.6mA | -91 dBm | I2C, I2S, IDE, SPI, UART | 1.6mm | 10mm | 10mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
 | ADRV9361-Z7035 | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | Module | 0 | -40°C~85°C | Bulk | 活跃 | 1 (Unlimited) | 70MHz~6GHz | AD9361 | LTE | Cellular | Antenna Not Included, U.FL | SPI | 175mA~445mA | 240mA~820mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYBLE-014008-00 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 32-SMD Module | 32 | -40°C~85°C | Tape & Reel (TR) | 2015 | EZ-BLE™ PSoC® | 活跃 | 3 (168 Hours) | 32 | 5A992.B | SEATED HGT-NOM | 8473.30.11.80 | 1.7V~5.5V | UNSPECIFIED | 无铅 | 未说明 | 3.3V | 0.66mm | 2.4GHz | 未说明 | 128kB Flash 16kB SRAM | 微处理器电路 | 1Mbps | Bluetooth v4.1 | 3dBm | Bluetooth | Integrated, Trace | -87dBm | I2C, SPI, UART | 16.4mA~21.5mA | 12.5mA~20mA | 1.8mm | 11mm | 11mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | CYBLE-222014-01 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 22-SMD Module | 22 | -40°C~85°C | Tape & Reel (TR) | 2015 | EZ-BLE™ PRoC™ | yes | 活跃 | 3 (168 Hours) | 22 | 5A992.B | 1.8V~4.5V | UNSPECIFIED | 无铅 | 未说明 | 1 | 3.3V | 0.762mm | 2.4GHz | 未说明 | 5.5V | I2C, SPI, UART | 256kB Flash 32kB SRAM | 1Mbps | Bluetooth v4.2 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | 1 | I2C, SPI, UART | 16.4mA | 15.6mA | -91 dBm | 16 | 1.6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | CYBLE-222005-00 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | Module | YES | -40°C~85°C | Tape & Reel (TR) | 2015 | EZ-BLE™ PRoC™ | Obsolete | 不适用 | 22 | 5A992.B | 8473.30.11.80 | 1.8V~5.5V | UNSPECIFIED | 无铅 | 1 | 3.3V | 2.4GHz | S-XXMA-N22 | 256kB Flash 32kB SRAM | 1Mbps | Bluetooth v4.1 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | -91dBm | I2C, SPI, UART | 16.4mA | 15.6mA | 1.6mm | 10mm | 10mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | CYBLE-012011-00 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 31-SMD Module | 35 | -40°C~85°C | Tape & Reel (TR) | 2011 | EZ-BLE™ PRoC™ | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.8V~5.5V | 2.4GHz~2.48GHz | I2C, SPI, UART | 5.5V | 1.8V | 128kB Flash 16kB SRAM | 1Mbps | Bluetooth v4.1 | 3dBm | Bluetooth | Integrated, Trace | -87dBm | I2C, SPI, UART | 16.4mA | 15.6mA | -87 dBm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | ENW-89847A3KF | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | YES | -40°C~85°C | Tape & Reel (TR) | 不用于新设计 | 3 (168 Hours) | 60 | 8542.39.00.01 | 1.8V~3.6V | UNSPECIFIED | 无铅 | 未说明 | 1 | 3.3V | 2.4GHz~2.48GHz | 未说明 | R-XXMA-N60 | 256kB Flash 192kB RAM | Bluetooth v4.2 | 电信电路 | 0dBm | Bluetooth | Integrated, Chip | -93dBm | I2C, SPI, UART | 3.3mA | 2mm | 15.6mm | 8.7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | CYBT-343026-01 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 24-SMD Module | YES | -30°C~85°C TA | Tape & Reel (TR) | EZ-BT™ WICED® | 活跃 | 3 (168 Hours) | 24 | 2.3V~3.6V | UNSPECIFIED | 无铅 | 未说明 | 1 | 1.22mm | 2.402GHz~2.48GHz | 未说明 | R-XXMA-N24 | 512kB Flash | 6Mbps | Bluetooth v4.2 | 电信电路 | 12dBm | Bluetooth | Integrated, Trace | -96.5dBm | I2C, I2S, PCM, SPI, UART | 26.4mA | 60.3mA | 8DPSK, DQPSK, GFSK | 1.95mm | 15.5mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | XPC100100S-01 | Lantronix, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | Module | FLASH, SRAM | -40°C~85°C | Bulk | 2012 | xPico® | 活跃 | 不适用 | 85°C | -40°C | 3.3V | 125MHz | 3.3V | Ethernet, Serial | 256kB | 921kbps | Ethernet | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYBLE-202007-01 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 30-SMD Module | YES | -40°C~85°C | Cut Tape (CT) | 2017 | PRoC™ BLE | 活跃 | 不适用 | 30 | 5A992.B | 8473.30.11.80 | 1.8V~4.5V | UNSPECIFIED | 无铅 | 未说明 | 1 | 3.3V | 1.27mm | 2.4GHz | 未说明 | R-XXMA-N30 | 256kB Flash 32kB SRAM | 1Mbps | Bluetooth v4.2 | 电信电路 | 7.5dBm | Bluetooth | Integrated, Trace | -93dBm | I2C, SPI, UART | 16.4mA | 27mA | 2mm | 23mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | XPC100100B-01 | Lantronix, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | Module | FLASH, SRAM | -40°C~85°C | Bulk | 2007 | xPico® | 活跃 | 不适用 | 85°C | -40°C | 3.3V | 125MHz | 3.3V | Ethernet, Serial | 256kB | 921kbps | Ethernet | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYBT-353027-02 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 19-SMD Module | YES | -30°C~85°C TA | Tape & Reel (TR) | EZ-BT™ WICED® | 活跃 | 3 (168 Hours) | 19 | 2.3V~3.6V | UNSPECIFIED | 无铅 | 1 | 1.05mm | 2.402GHz~2.48GHz | S-XXMA-N19 | 512kB Flash | 6Mbps | Bluetooth v5.0 | 电信电路 | 12dBm | Bluetooth | Integrated, Trace | -96.5dBm | I2C, I2S, PCM, SPI, UART | 26.4mA | 60.3mA | 8DPSK, DQPSK, GFSK | 1.75mm | 9mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | ESP32-WROVER | Espressif Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 表面贴装 | 38-SMD Module | ESP32-WROVER | -40°C~85°C | Tape & Reel (TR) | ESP32 | 活跃 | 3 (168 Hours) | 2.3V~3.6V | 2.4GHz~2.5GHz | I2C, I2S, SPI, UART | 80mA | 448kB ROM 536kB SRAM | 150Mbps | ESP32-D0WDQ6 | 802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3 | 20dBm | Bluetooth, WiFi | PCB Trace | -98dBm | 16 | GPIO, I2C, I2S, PWM, SDIO, SPI, UART | CCK, DSSS, OFDM | 20 | 3.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | RN4020-V/RMBEC133 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | YES | Automotive grade | -30°C~85°C | Tray | 活跃 | 3 (168 Hours) | 24 | 1.8V~3.6V | UNSPECIFIED | 无铅 | 1 | 3.3V | 2.4GHz | RN4020 | R-XXMA-N24 | I2C, SPI, UART | 16mA | 64kB Flash | 1Mbps | Bluetooth v4.1 | TS 16949 | 电信电路 | 7.5dBm | Bluetooth | Integrated, Trace | -92.5dBm | 3 | AIO, PIO, SPI, UART | GFSK | 10 | 1.3.3 | 2.5mm | 19.5mm | 11.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
 | RN4020-V/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 24 | -30°C~85°C | Tray | 2014 | 活跃 | 1 (Unlimited) | 24 | 8542.39.00.01 | 1.8V~3.6V | UNSPECIFIED | 1 | 3.3V | 1.2mm | 2.4GHz | RN4020 | SPI, UART | 64kB Flash | 1Mbps | Bluetooth v4.1 | 电信电路 | 7.5dBm | Bluetooth | Integrated, Trace | AIO, PIO, SPI, UART | 16mA | GFSK | -92.5 dBm | 1.10.09 | 2.38mm | 19.5mm | 11.5mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | RN42HID-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 35 | Automotive grade | -40°C~85°C | Tray | 2010 | 活跃 | 3 (168 Hours) | 32 | 3V~3.6V | UNSPECIFIED | 1 | 3.3V | 2.4GHz | RN42 | R-XXMA-N32 | SPI, UART, USB | 300kbps | Bluetooth v2.1 +EDR, Class 2 | TS 16949 | 电信电路 | 4dBm | Bluetooth | Integrated, Trace | UART | 45mA | 30mA | -80 dBm | HID/6.11 | 2mm | 25.8mm | 13.4mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | RN42XVP-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 通孔 | 20-DIP Module | NO | 20 | -40°C~85°C | Bulk | 2009 | 活跃 | 3 (168 Hours) | 20 | 8542.39.00.01 | 3V~3.6V | DUAL | 1 | 3.3V | 2.4GHz | RN42XV | 3.3V | 300kbps | 78MHz | Bluetooth v2.1 + EDR, Class 2 | 电信电路 | 4dBm | Bluetooth | Integrated, Trace | -86dBm | 10 | UART | 35mA | 65mA | FHSS, GFSK | -80 dBm | 6.3 | 2mm | 24.4mm | 29.9mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | 455-00113 | Laird - Wireless & Thermal Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 底座安装 | Module | -30°C~85°C | Sentrius™ | 活跃 | 9V~30V | 512MB Flash 256MB RAM | 1Gbps | SAMA5D36 | 802.11ac | WiFi | 不包括天线 | USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 455-00081 | Laird - Wireless & Thermal Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 底座安装 | Module | -30°C~85°C | Sentrius™ | 活跃 | 9V~30V | 512MB Flash 256MB RAM | 1Gbps | SAMA5D36 | 802.11ac, Bluetooth v5.0 | Bluetooth, WiFi | 不包括天线 | USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ESP-WROOM-02 | Espressif Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 表面贴装 | 18-SMD Module | -40°C~85°C | Tape & Reel (TR) | 2015 | 活跃 | 3 (168 Hours) | 2.7V~3.6V | 2.4GHz~2.5GHz | 72.2Mbps | 802.11b/g/n | 20dBm | WiFi | Integrated, Trace | -98dBm | 120mA~170mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 455-00076 | Laird - Wireless & Thermal Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 底座安装 | Module | -30°C~85°C | Sentrius™ | 活跃 | 9V~30V | 512MB Flash 256MB RAM | 1Gbps | SAMA5D36 | 802.11ac, Bluetooth v5.0 | Bluetooth, WiFi | 不包括天线 | USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPWF01SC.11 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NRND (Last Updated: 6 months ago) | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tray | Obsolete | 3 (168 Hours) | 25 | 5A992.C | UNSPECIFIED | 1 | 3.3V | 2.4GHz | SPWF01 | R-XXMA-N25 | 3.3V | 1 | 1.5MB Flash 64kB RAM | 65Mbps | 802.11b/g/n | 电信电路 | 18.3dBm | WiFi | Antenna Not Included, U.FL | -96dBm | UART | 105mA | 210mA~344mA | DSSS, OFDM | -96 dBm | 2.45mm | 26.924mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | SPWF01SA.21 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 表面贴装 | 表面贴装 | Module | 30 | -40°C~85°C | Tray | Obsolete | 3 (168 Hours) | 25 | 5A992.C | UNSPECIFIED | 1 | 3.3V | 2.4GHz | SPWF01 | R-XXMA-N25 | 3.3V | 1 | 512kB Flash 64kB RAM | 65Mbps | 802.11b/g/n | 电信电路 | 18.3dBm | WiFi | Integrated, Chip | -96dBm | UART | 105mA | 210mA~344mA | DSSS, OFDM | -96 dBm | 2.45mm | 26.924mm | 无 | ROHS3 Compliant | 无铅 |