类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 类型 | 端子表面处理 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 界面 | 内存大小 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 议定书 | 外部数据总线宽度 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 敏感度 | 数据率（最大） | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | [医]GPIO | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 无铅 | |||
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 | ATA5811C-PLQW | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~105°C | Tape & Reel (TR) | 1997 | Obsolete | 3 (168 Hours) | 仅TxRx | 2.4V~3.6V | 433MHz 868MHz | 10dBm | General ISM < 1GHz | -116.5dBm | 20kBaud | SPI | 10.3mA~10.5mA | 8.5mA~17.8mA | ASK, FSK | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| ATA5812C-PLQW | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~105°C | Tape & Reel (TR) | 1997 | Obsolete | 3 (168 Hours) | 仅TxRx | 2.4V~3.6V | 315MHz | 10dBm | General ISM < 1GHz | -116.5dBm | 20kBaud | SPI | 10.3mA~10.5mA | 8.5mA~17.8mA | ASK, FSK | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32WB55CEU6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 48-UFQFN Exposed Pad | YES | 30 | -40°C~105°C TA | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.71V~3.6V | QUAD | 无铅 | 未说明 | 3V | 0.5mm | compliant | 2.405GHz~2.48GHz | 未说明 | STM32WB55 | 64 MHz | 512kB Flash 256kB SRAM | 32 | YES | YES | YES | Bluetooth v5.0 | 6dBm | 802.15.4, Bluetooth | -100dBm | 2Mbps | I2C, SPI, UART, USART, USB | 3.8mA~7mA | 8.1mA~13.1mA | 30 | 7mm | 7mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | S2-LPCBQTR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | -40°C~105°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 仅TxRx | 1.8V~3.6V | 未说明 | compliant | 452MHz~527MHz 904MHz~1055MHz | 未说明 | S2-LP | SIGFOX™ | 14dBm | 802.15.4 | -128dBm | 500kbps | SPI | 8.6mA | 20.6mA | 2FSK, 2GFSK, 4FSK, 4GFSK, ASK, OOK | 4 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | TDA5250XUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 38-TFSOP (0.173, 4.40mm Width) | YES | -40°C~85°C | Tape & Reel (TR) | 2003 | yes | Obsolete | 3 (168 Hours) | 38 | 仅TxRx | 8542.39.00.01 | 2.1V~5.5V | DUAL | 鸥翼 | 未说明 | 1 | 3V | 0.5mm | compliant | 868MHz | 未说明 | 38 | R-PDSO-G38 | 不合格 | 13dBm | General ISM < 1GHz | -109dBm | 64kbps | I2C, SPI | 8.6mA~9.1mA | 4.1mA~14.6mA | ASK, FSK | 1.2mm | 9.7mm | 4.4mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| PMA7107XUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 38-TFSOP (0.173, 4.40mm Width) | YES | 10 | -40°C~85°C | Tape & Reel (TR) | 2010 | SmartLEWIS™ | yes | Obsolete | 3 (168 Hours) | 38 | TxRx + MCU | 8542.31.00.01 | 1.9V~3.6V | DUAL | 鸥翼 | 未说明 | 3V | 0.5mm | compliant | 315MHz 434MHz 868MHz 915MHz | 未说明 | 38 | R-PDSO-G38 | 不合格 | 12 MHz | 6kB Flash 12kB ROM 256B RAM | 8 | YES | NO | NO | NO | 10dBm | General ISM < 1GHz | 32kbps | I2C, SPI | 8.9mA~17.1mA | ASK, FSK | 10 | 1.2mm | 9.7mm | 4.4mm | 符合RoHS标准 | ||||||||||||||||||||||||
| PMA7110XUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 38-TFSOP (0.173, 4.40mm Width) | YES | 10 | -40°C~85°C | Tape & Reel (TR) | 2010 | SmartLEWIS™ | yes | Obsolete | 3 (168 Hours) | 38 | TxRx + MCU | 8542.31.00.01 | 1.9V~3.6V | DUAL | 鸥翼 | 未说明 | 3V | 0.5mm | compliant | 315MHz 434MHz 868MHz 915MHz | 未说明 | 38 | R-PDSO-G38 | 不合格 | 12 MHz | 6kB Flash 12kB ROM 256B RAM | 8 | YES | NO | NO | NO | 10dBm | General ISM < 1GHz | 32kbps | I2C, SPI | 8.9mA~17.1mA | ASK, FSK | 10 | 1.2mm | 9.7mm | 4.4mm | 符合RoHS标准 | ||||||||||||||||||||||||
 | AXM0F243-1-TX40 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 28 Weeks | 表面贴装 | 40-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | yes | 活跃 | 1 (Unlimited) | TxRx + MCU | 1.8V~3.6V | 27MHz~1.05GHz | 64kB Flash 8kB SRAM | Sigfox, Wireless M-Bus, Z-Wave® | 16dBm | General ISM < 1GHz | -137dBm | 1Mbps | I2C, SPI, UART | 6.5mA~11mA | 7.6mA~55mA | 4FSK, ASK, FSK, GFSK, GMSK, MSK, PSK | 20 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | NCH-RSL10-101S51-ACG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 51-SMD Module | Industrial grade | -40°C~85°C | Tape & Reel (TR) | yes | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.18V~3.3V | 未说明 | 2.36GHz~2.5GHz | 未说明 | 384kB Flash 76kB SRAM 88kB SRAM | Bluetooth v5.0 | 6dBm | Bluetooth | -96dBm | 4Mbps | PCM, SPI, UART | 3mA~6.2mA | 4.6mA~8.9mA | 4-FSK, FSK, GFSK, MSK, O-QPSK | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | NRF9160-SICA-R7 | Nordic Semiconductor ASA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 161-TFLGA Module | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | TxRx + MCU | 3.1V~5.5V | 700MHz~2.2GHz | GPS | 23dBm | Cellular | -108dBm | 360kbps | 32 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | EZR32HG220F64R63G-C0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | 27 | -40°C~85°C TA | EZR32HG | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.98V~3.8V | 3V | 0.5mm | 142MHz~1.05GHz | 25 MHz | 64kB Flash 8kB RAM | 32 | YES | YES | YES | 20dBm | 802.15.4 | -126dBm | 1Mbps | I2C, SPI, UART, USART, USB | 11.1mA~13.7mA | 44.5mA~93mA | 4GFSK, GFSK, GMSK, OOK | 27 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
 | DA14581-00AT1 | Dialog Semiconductor GmbH | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 50kB | 表面贴装 | 40-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | 2011 | 不用于新设计 | 3 (168 Hours) | 40 | TxRx + MCU | 8542.39.00.01 | 2.35V~3.3V | QUAD | 无铅 | 未说明 | 1 | 3V | 0.4mm | unknown | 2.4GHz | 未说明 | S-PQCC-N40 | 32kB OTP 84kB ROM 50kB SRAM | Bluetooth v4.1 | -1dBm | Bluetooth | -93dBm | I2C, SPI, UART | 3.7mA | 3.4mA | 24 | 0.9mm | 5mm | 5mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
 | EFR32MG21A020F1024IM32-B | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | Tray | 活跃 | 2 (1 Year) | 电信电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYRF7936-40LFXC | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 40-VFQFN Exposed Pad | YES | 0°C~70°C | Tray | CyFi™ | Obsolete | 3 (168 Hours) | 40 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 1 | 2.4V | 0.5mm | unknown | 2.4GHz | 40 | COMMERCIAL | 4dBm | General ISM > 1GHZ | -97dBm | 1Mbps | SPI | 18.4mA~21.2mA | 20.8mA~34.1mA | DSSS, GFSK | 4 | 1mm | 6mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
 | SI1030-A-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8.3kB | 表面贴装 | 85-VFLGA Exposed Pad | FLASH | -40°C~85°C | Tape & Reel (TR) | 2000 | Obsolete | 4 (72 Hours) | TxRx + MCU | 1.8V~3.8V | unknown | 240MHz~960MHz | I2C, SPI, UART | 128kB Flash 8.5kB RAM | 8b | 4 | EZRadioPro | 20dBm Max | General ISM < 1GHz | 256kbps | 16 | I2C, SPI, UART | 18.5mA | 85mA | FSK, GFSK, OOK | -121 dBm | 53 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| SI1037-A-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4.3kB | 表面贴装 | 85-VFLGA Exposed Pad | FLASH | -40°C~85°C | Tape & Reel (TR) | 2000 | Obsolete | 4 (72 Hours) | TxRx + MCU | 1.8V~3.8V | unknown | 240MHz~960MHz | I2C, SPI, UART | 16kB Flash 4.4kB RAM | 8b | 4 | EZRadioPro | 13dBm Max | General ISM < 1GHz | 256kbps | 16 | I2C, SPI, UART | 18.5mA | 17mA~30mA | FSK, GFSK, OOK | -121 dBm | 53 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | EFR32BG12P232F512GM68-C | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 68-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | EFR32™ Blue Gecko | 活跃 | 3 (168 Hours) | 68 | TxRx + MCU | 1.8V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.4mm | compliant | 2.4GHz | S-XQCC-N68 | 512kB Flash 64kB RAM | Bluetooth v5.0, Wireless M-Bus | 10dBm | 802.15.4, Bluetooth | -126.2dBm | 2Mbps | I2C, I2S, SPI, UART | 8.4mA~10mA | 8.5mA~35.3mA | 2-FSK, 4-FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 46 | 0.9mm | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | SAF1508BET/V1,118 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 36-TFBGA | YES | -40°C~85°C TA | Tape & Reel (TR) | 2012 | Obsolete | 1 (Unlimited) | 36 | 仅TxRx | 3V~4.5V | BOTTOM | BALL | 未说明 | 3.6V | 0.5mm | 未说明 | 36 | S-PBGA-B36 | 不合格 | 3.6V | 26MHz | 0.3mA | 1 | 8 | UART, USB | 1.15mm | 3.5mm | 3.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | DA14697-00000HR2 | Dialog Semiconductor GmbH | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 100-VFBGA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | MICROCONTROLLER, RISC | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EFR32MG12P232F512GM68-CR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 68-VFQFN Exposed Pad | -40°C~85°C | Cut Tape (CT) | Mighty Gecko | Discontinued | 3 (168 Hours) | TxRx + MCU | 1.8V~3.8V | 2.4GHz | 512kB Flash 128kB RAM | Bluetooth v5.0, Wireless M-Bus, Zigbee® | 0dBm | 802.15.4, Bluetooth | -126.2dBm | 2Mbps | I2C, I2S, SPI, UART | 8.4mA~10mA | 8.5mA~35.3mA | 2-FSK, 4-FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 31 | ||||||||||||||||||||||||||||||||||||||||||||||
| CYRF69103-40LFXC | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 40-VFQFN Exposed Pad | YES | 0°C~70°C | Tray | PRoC® | Obsolete | 3 (168 Hours) | 40 | TxRx + MCU | 未说明 | 1.8V~3.6V | QUAD | 无铅 | 1 | 3V | 0.5mm | unknown | 2.4GHz | 40 | S-XQCC-N40 | COMMERCIAL | 8kB Flash 256B SRAM | 4dBm | General ISM > 1GHZ | -97dBm | 1Mbps | SPI | 18.9mA~21.9mA | 21.2mA~39.9mA | DSSS, GFSK | 15 | 1mm | 6mm | 6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| STM32WB55CGU6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Industrial grade | 48-UFQFN Exposed Pad | YES | 30 | -40°C~105°C TA | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.71V~3.6V | QUAD | 无铅 | 未说明 | 3V | 0.5mm | compliant | 2.405GHz~2.48GHz | 未说明 | STM32WB55 | 64 MHz | 1MB Flash 256kB SRAM | 32 | YES | YES | YES | Bluetooth v5.0 | 6dBm | 802.15.4, Bluetooth | -100dBm | 2Mbps | I2C, SPI, UART, USART, USB | 3.8mA~7mA | 8.1mA~13.1mA | 30 | 7mm | 7mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | STM32WB55RGV6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 68-VFQFN Exposed Pad | YES | 49 | -40°C~105°C TA | 活跃 | 3 (168 Hours) | 68 | TxRx + MCU | 1.71V~3.6V | QUAD | 无铅 | 未说明 | 3V | 0.4mm | compliant | 2.405GHz~2.48GHz | 未说明 | STM32WB55 | 64 MHz | 1MB Flash 256kB SRAM | 32 | YES | YES | YES | Bluetooth v5.0 | 6dBm | 802.15.4, Bluetooth | -100dBm | 2Mbps | I2C, SPI, UART, USART, USB | 3.8mA~7mA | 8.1mA~13.1mA | 49 | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| STM32WB55CCU6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 48-UFQFN Exposed Pad | YES | 30 | -40°C~105°C TA | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.71V~3.6V | QUAD | 无铅 | 未说明 | 3V | 0.5mm | compliant | 2.402GHz~2.48GHz | 未说明 | 64 MHz | 1MB Flash 256kB SRAM | 32 | YES | YES | YES | Bluetooth v5.0, Thread, Zigbee® | 6dBm | 802.15.4, Bluetooth | -100dBm | 2Mbps | I2C, SPI, UART, USART, USB | 4.5mA~7.9mA | 5.2mA~12.7mA | GFSK | 30 | 7mm | 7mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| STM32WB55CGU7 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 48-UFQFN Exposed Pad | YES | 30 | -40°C~105°C TA | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.71V~3.6V | QUAD | 无铅 | 未说明 | 3V | 0.5mm | compliant | 2.402GHz~2.48GHz | 未说明 | 64 MHz | 1MB Flash 256kB SRAM | 32 | YES | YES | YES | Bluetooth v5.0, Thread, Zigbee® | 6dBm | 802.15.4, Bluetooth | -100dBm | 2Mbps | I2C, SPI, UART, USART, USB | 4.5mA~7.9mA | 5.2mA~12.7mA | GFSK | 30 | 7mm | 7mm | 符合RoHS标准 |