类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 类型 | 端子表面处理 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 深度 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | 资历状况 | 工作电源电压 | 电源 | 界面 | 内存大小 | 工作电源电流 | 电源电流 | 速度 | 内存大小 | 最大电源电流 | 比特数 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 带宽 | 定时器/计数器的数量 | 密度 | 议定书 | 核心架构 | 处理器系列 | 边界扫描 | 低功率模式 | A/D转换器数量 | 可编程I/O数 | 格式 | 功率 - 输出 | 集成缓存 | 无线电频率系列/标准 | 收发器数量 | 内存(字) | UART 通道数 | 敏感度 | 数据率（最大） | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 串行I/O数 | 最大结点温度（Tj） | 接收器数 | 噪声图 | 定时器数量 | 调制 | 外部中断数量 | 灵敏度(dBm) | 总线兼容性 | 环境温度范围高 | [医]GPIO | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||
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 | AD9364BBCZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 144-LFBGA, CSPBGA | 144 | -40°C~85°C | Tray | e1 | no | 活跃 | 3 (168 Hours) | 144 | 仅TxRx | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | 10mm | 70MHz~6GHz | 30 | AD9364 | 144 | 1.3V | 56MHz | LTE | 8dBm | Cellular | SPI | 175mA~275mA | 160mA~490mA | 110°C | 1 | 1.7mm | 10mm | 10.1mm | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYBL10162-56LQXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 36 | 有 | 16kB | 表面贴装 | 表面贴装 | 56-UFQFN Exposed Pad | 56 | FLASH | -40°C~105°C | Tray | 2011 | e4 | Obsolete | 3 (168 Hours) | 56 | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | QUAD | 无铅 | 260 | 1.8V | 2.4GHz | 30 | I2C, SPI, UART | 128kB Flash 8kB ROM 16kB SRAM | 32b | 4 | Bluetooth v4.1 | ARM | YES | 36 | 3dBm | Bluetooth | 16000 | 1Mbps | I2C, SPI, UART | 16.4mA~21.5mA | 12.5mA~20mA | GFSK | -91 dBm | I2C | 0.6mm | 7mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CSR8510A06-ICXR-R | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6-XFBGA | -30°C~85°C | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | 仅TxRx | 2.4GHz | Bluetooth v4.0 | Bluetooth | -91dBm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM43455XKUBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 活跃 | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BLUENRG-232 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 32-VFQFN Exposed Pad | QFN32_POA_8362854 | -40°C~105°C | Tape & Reel (TR) | BlueNRG | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.7V~3.6V | 未说明 | 2.4GHz | 未说明 | I2C, SPI, UART | 256kB Flash 24kB RAM | Bluetooth v4.2 | 8dBm | Bluetooth | -88dBm | 1Mbps | 10 | I2C, SPI, UART | 14.5mA | 14mA~28mA | GFSK | 105°C | 15 | 1mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ADF7025BCPZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 3 weeks ago) | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad, CSP | 48 | -40°C~85°C | Tray | e3 | no | 活跃 | 3 (168 Hours) | 48 | SMD/SMT | 仅TxRx | 2.3V~3.6V | QUAD | 260 | 1 | 3V | 0.5mm | 7mm | 431MHz~464MHz 862MHz~870MHz 902MHz~928MHz | 40 | ADF7025 | 48 | 3.6V | 2.5/3.3V | SPI, Serial | 28mA | 27mA | 13dBm Max | General ISM < 1GHz | 1 | 384kbps | SPI | 19mA~21mA | 14.6mA~28mA | FSK | -104.2 dBm | 750μm | 7mm | 7mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC1310F128RGZT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 20kB | ACTIVE (Last Updated: 4 days ago) | Gold | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 30 | -40°C~85°C | Tape & Reel (TR) | SimpleLink™ | e4 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.8V | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 300MHz~930MHz | 未说明 | CC1310 | I2C, SPI, UART | 128kB Flash 20kB RAM | 1 Mb | 14dBm | General ISM < 1GHz | 50kbps | 1 | I2C, I2S, JTAG, SPI, UART | 5.5mA | 12.9mA~22.6mA | DSSS, GFSK | -124 dBm | 1mm | 7mm | 7mm | 900μm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC2650F128RSMT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 20kB | ACTIVE (Last Updated: 4 days ago) | Gold | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | RSM (S-PVQFN-N32) | 10 | -40°C~85°C | Tape & Reel (TR) | SimpleLink™ | e4 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.8V | QUAD | 无铅 | 260 | 3.3V | 2.4GHz | 未说明 | CC2650 | I2C, SPI, UART | 48 MHz | 128kB Flash 28kB SRAM | 16 | YES | YES | YES | NO | 1 Mb | 6LoWPAN, Bluetooth v5.1, Zigbee® | CORTEX-M3 | YES | YES | FIXED-POINT | 5dBm | YES | 802.15.4, Bluetooth | 28 | 1 | 1Mbps | I2C, I2S, JTAG, SPI, UART | 5.9mA~6.1mA | 6.1mA~9.1mA | 1 | 4 | DSSS, O-QPSK, GFSK | -100 dBm | 10 | 1mm | 4mm | 4mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | CC1101RGPR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 4 days ago) | Gold | 表面贴装 | 表面贴装 | 20-VFQFN Exposed Pad | 20 | 69.994973mg | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 20 | 仅TxRx | 1.8V~3.6V | QUAD | 无铅 | 260 | 1 | 3V | 0.5mm | 4.15mm | 300MHz~348MHz 387MHz~464MHz 779MHz~928MHz | 未说明 | CC1101 | 不合格 | 0 b | 12dBm | General ISM < 1GHz | 600kbps | SPI | 14.3mA~17.1mA | 12.3mA~34.2mA | 1 | 2FSK, 4FSK, ASK, GFSK, MSK, OOK | -116 dBm | 1mm | 4mm | 4mm | 930μm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CC1125RHBR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold, Silver | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | -40°C~85°C | Digi-Reel® | e4 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 2V~3.6V | QUAD | 无铅 | 260 | 1 | 3V | 164MHz~192MHz 274MHz~320MHz 410MHz~480MHz 820MHz~960MHz | 未说明 | CC1125 | 不合格 | 3V | 4kB ROM 256B RAM | 0 b | 16dBm | General ISM < 1GHz | 200kbps | SPI | 17mA~27mA | 26mA~56mA | 1 | 2FSK, 2GFSK, 4FSK, 4GFSK, MSK, OOK | -129 dBm | 4 | 1mm | 5mm | 5mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC1110F32RHHR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 21 | 4kB | ACTIVE (Last Updated: 1 day ago) | Gold | 表面贴装 | 表面贴装 | 36-VFQFN Exposed Pad | 36 | 105.687022mg | FLASH | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 36 | TxRx + MCU | 2V~3.6V | QUAD | 260 | 3V | 300MHz~348MHz 391MHz~464MHz 782MHz~928MHz | CC1110 | I2S, UART, USART, USB | 32kB Flash 4kB SRAM | 12 | 8 | YES | YES | YES | 5 | 8051 | NO | YES | FIXED-POINT | 10dBm | YES | General ISM < 1GHz | 4096 | 1 | 500kBaud | 7 | I2S, USART | 16.2mA~21.5mA | 18mA~36.2mA | 2FSK, ASK, GFSK, MSK, OOK | 18 | -112 dBm | 85°C | 1mm | 6mm | 6mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||
| CC430F5137IRGZR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 30 | 有 | 4kB | ACTIVE (Last Updated: 1 day ago) | Gold | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48 | 139.989945mg | FLASH | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 2V~3.6V | QUAD | 260 | 1 | 2.2V | 0.5mm | 7mm | 300MHz~348MHz 389MHz~464MHz 779MHz~928MHz | CC430F5137 | 48 | I2C, SPI, UART | 32kB Flash 4kB SRAM | 12 | 16b | 2 | MSP430 | 6 | 13dBm | General ISM < 1GHz | 1 | 500kBaud | I2C, IrDA, JTAG, SPI, UART | 15mA~18.5mA | 15mA~36mA | 2FSK, 2GFSK, ASK, MSK, OOK | -117 dBm | 1mm | 7mm | 7mm | 900μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | AT86RF233-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 32-VFQFN Exposed Pad | YES | 32 | 188.609377mg | 32QN2 | -40°C~85°C | Tray | 1999 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 1 | 3V | 2.4GHz | AT86RF233 | 1.83V | 128B SRAM | 6LoWPAN, Zigbee® | 4dBm | 802.15.4, General ISM > 1GHz | 2Mbps | SPI | 11.3mA~11.8mA | 7.2mA~13.8mA | O-QPSK | -101 dBm | 1mm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC2540F256RHAR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 8kB | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 40-VFQFN Exposed Pad | YES | 40 | 21 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 40 | 5A992.C | TxRx + MCU | 2V~3.6V | QUAD | 260 | 3V | 0.5mm | 2.4GHz | CC2540 | 40 | 3V | SPI, UART | 256kB Flash 8kB SRAM | 400μA | 8b | 3 | Bluetooth v5.0 | 8051 | 4dBm | Bluetooth | 8 | 1 | 1Mbps | SPI, USART, USB | 19.6mA~22.1mA | 21.1mA~31.6mA | GFSK | -93 dBm | SPI; USART; USB | 1mm | 6mm | 6mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| CC1310F128RHBR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 20kB | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | -40°C~85°C | Tape & Reel (TR) | SimpleLink™ | e4 | yes | 活跃 | 3 (168 Hours) | 32 | 5A992C | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.8V | QUAD | 无铅 | 260 | 3.3V | 300MHz~930MHz | 未说明 | CC1310 | I2C, SPI, UART | 128kB Flash 20kB RAM | 1 Mb | 14dBm | General ISM < 1GHz | 50kbps | 1 | I2C, I2S, JTAG, SPI, UART | 5.5mA | 12.9mA~22.6mA | DSSS, GFSK | -124 dBm | 15 | 1mm | 5mm | 5mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CC2640F128RHBR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 20kB | ACTIVE (Last Updated: 2 days ago) | Copper, Gold | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | -40°C~85°C | Tape & Reel (TR) | SimpleLink™ | e4 | yes | 活跃 | 3 (168 Hours) | 32 | 5A992C | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.8V | QUAD | 无铅 | 260 | 1 | 3V | 2.4GHz | 未说明 | CC2640 | I2C, SPI, UART | 128kB Flash 28kB SRAM | 1 Mb | Bluetooth v4.1 | 5dBm | Bluetooth | 1Mbps | I2C, I2S, JTAG, SPI, UART | 5.9mA~6.1mA | 6.1mA~9.1mA | DSSS, O-QPSK, GFSK | -97 dBm | 15 | 1mm | 5mm | 5mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC2564BRVMT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 76-VQFN Dual Rows, Exposed Pad | YES | 76 | -40°C~85°C | Tape & Reel (TR) | e3 | yes | 活跃 | 3 (168 Hours) | 76 | 仅TxRx | Matte Tin (Sn) | 2.2V~4.8V | QUAD | 无铅 | 260 | 1 | 3.6V | 0.6mm | 2.4GHz | 未说明 | CC2564 | UART | Bluetooth v4.1 | 12dBm | Bluetooth | 4Mbps | I2S, UART | 40.5mA~41.2mA | 40.5mA~41.2mA | 2 | GFSK, GMSK | -95 dBm | 900μm | 8mm | 8mm | 850μm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CC1310F128RGZR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 20kB | ACTIVE (Last Updated: 2 days ago) | Gold | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | -40°C~85°C | Tape & Reel (TR) | SimpleLink™ | yes | 活跃 | 3 (168 Hours) | 48 | 5A992C | TxRx + MCU | 1.8V~3.8V | QUAD | 无铅 | 3.3V | 0.5mm | 300MHz~930MHz | CC1310 | 128kB Flash 20kB RAM | 1 Mb | 14dBm | General ISM < 1GHz | -124dBm | 50kbps | 1 | I2C, I2S, JTAG, SPI, UART | 5.5mA | 12.9mA~22.6mA | DSSS, GFSK | 30 | 1mm | 7mm | 7mm | 900μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA256RFR2-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 有 | FLASH | 32kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | 206.29948mg | 131072 | -40°C~85°C | Tray | 2004 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.6V | QUAD | 0.5mm | 2.4GHz | ATMEGA256RFR2 | 2/3.3V | I2C, SPI, UART, USART | 256kB Flash 8kB EEPROM 32kB SRAM | 8 | 8b | 6 | Zigbee® | AVR | 38 | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | DSSS, O-QPSK | -100 dBm | 35 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CC2541F256RHAR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 23 | 8kB | ACTIVE (Last Updated: 2 days ago) | Gold | 表面贴装 | 40-VFQFN Exposed Pad | YES | 40 | FLASH | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 40 | 5A992.C | TxRx + MCU | 2V~3.6V | QUAD | 260 | 3V | 0.5mm | 2.4GHz | CC2541 | 40 | 3.6V | 3V | I2C, SPI, UART, USART | 256kB Flash 8kB RAM | 8b | 4 | Bluetooth v5.0 | 8051 | 0dBm | Bluetooth | 8 | 1 | 2Mbps | I2C, SPI, USART | 17.9mA~20.2mA | 16.8mA~18.2mA | GFSK, MSK | -99 dBm | I2C; SPI; USART; USB | 1mm | 6mm | 6mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| CC2530F256RHAR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 21 | 有 | 8kB | ACTIVE (Last Updated: 1 day ago) | Gold | 表面贴装 | 表面贴装 | 40-VFQFN Exposed Pad | 40 | 80.002354mg | FLASH | -40°C~125°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 40 | 5A992.C | TxRx + MCU | 2V~3.6V | QUAD | 260 | 1 | 3V | 0.5mm | 2.4GHz | CC2530 | 40 | 2-Wire, SPI, UART, USART | 256kB Flash 8kB RAM | 8b | 4 | Zigbee® | 8051 | 4.5dBm | 802.15.4 | 1 | 250kbps | 8 | SPI, USART | 20.5mA~24.3mA | 28.7mA~33.5mA | -97 dBm | 1mm | 6mm | 6mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| CC2640R2FRGZR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48 | -40°C~85°C | Tape & Reel (TR) | SimpleLink™ | e4 | yes | 活跃 | 3 (168 Hours) | 48 | 5A992C | TxRx + MCU | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | 1.8V~3.8V | QUAD | 无铅 | 260 | 1 | 3V | 0.5mm | 2.4GHz | 未说明 | CC2640 | I2C, I2S, SPI, UART | 1.45mA | 128kB Flash 20kB RAM | Bluetooth v5.0 | 5dBm | Bluetooth | -97dBm | 2Mbps | 8 | I2C, I2S, SPI, UART | 5.9mA | 9.1mA | GFSK | 85°C | 31 | 1mm | 7mm | 7mm | 900μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| CC1120RHBT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 hours ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | RHB (S-PVQFN-N32_ | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 2V~3.6V | QUAD | 无铅 | 260 | 1 | 3V | 164MHz~192MHz 274MHz~320MHz 410MHz~480MHz 820MHz~960MHz | 未说明 | CC1120 | 不合格 | 3V | 4kB ROM 256B RAM | 0 b | 16dBm | General ISM < 1GHz | 200kbps | SPI | 17mA~23mA | 32mA~54mA | 1 | 2FSK, 2GFSK, 4FSK, 4GFSK, MSK, OOK | -127 dBm | 4 | 1mm | 5mm | 5mm | 900μm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CC110LRGPR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 4 days ago) | Gold | 表面贴装 | 表面贴装 | 20-VFQFN Exposed Pad | 20 | 69.994973mg | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 20 | 仅TxRx | 1.8V~3.6V | QUAD | 260 | 1 | 3V | 0.5mm | 4.15mm | 300MHz~348MHz 387MHz~464MHz 779MHz~928MHz | CC110 | 0 b | 12dBm | General ISM < 1GHz | 600kbps | SPI | 14.3mA~17.1mA | 12.3mA~34.2mA | 1 | 2FSK, 4FSK, GFSK, MSK, OOK | -116 dBm | 1mm | 4mm | 4mm | 930μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AD9361BBCZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 2 weeks ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 144-LFBGA, CSPBGA | 144 | -40°C~85°C | Tray | e1 | no | 活跃 | 3 (168 Hours) | 144 | 5A991.B | 仅TxRx | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 260 | 1 | 1.3V | 0.8mm | 10mm | 70MHz~6GHz | 未说明 | AD9361 | 144 | 1.3V | LTE | 8dBm | Cellular | SPI | 175mA~445mA | 240mA~820mA | 2 | 2.5 dB | 1mm | 10mm | 10mm | 无SVHC | ROHS3 Compliant | 含铅 |