类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源 | 界面 | 内存大小 | 速度 | 内存大小 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 定时器/计数器的数量 | 密度 | 议定书 | 核心架构 | 边界扫描 | 功率 - 输出 | 无线电频率系列/标准 | 内存(字) | 敏感度 | 数据率(最大) | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 接收器数 | 调制 | 灵敏度(dBm) | 总线兼容性 | [医]GPIO | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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![]() | SI1020-A-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8.3kB | 表面贴装 | 85-VFLGA Exposed Pad | FLASH | -40°C~85°C | Tape & Reel (TR) | 2000 | Obsolete | 3 (168 Hours) | TxRx + MCU | 1.8V~3.8V | unknown | 240MHz~960MHz | I2C, SPI, UART | 128kB Flash 8.5kB RAM | 8b | 4 | EZRadioPro | 20dBm Max | General ISM < 1GHz | 256kbps | 16 | I2C, SPI, UART | 18.5mA | 85mA | FSK, GFSK, OOK | -121 dBm | 53 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI1023-A-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 53 | 4.3kB | 表面贴装 | 85-VFLGA Exposed Pad | YES | FLASH | -40°C~85°C | Tape & Reel (TR) | 2000 | Obsolete | 3 (168 Hours) | 85 | TxRx + MCU | 1.8V~3.8V | BOTTOM | BUTT | 3.3V | 0.5mm | 240MHz~960MHz | I2C, SPI, UART | 25 MHz | 16kB Flash 4.4kB RAM | 8 | YES | YES | 8b | YES | 4 | EZRadioPro | 20dBm Max | General ISM < 1GHz | 256kbps | 16 | I2C, SPI, UART | 18.5mA | 85mA | FSK, GFSK, OOK | -121 dBm | 53 | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | SI1032-A-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 8.3kB | 表面贴装 | 85-VFLGA Exposed Pad | FLASH | -40°C~85°C | Tape & Reel (TR) | 2000 | Obsolete | 3 (168 Hours) | TxRx + MCU | 1.8V~3.8V | unknown | 240MHz~960MHz | I2C, SPI, UART | 32kB Flash 8.5kB RAM | 8b | 4 | EZRadioPro | 20dBm Max | General ISM < 1GHz | 256kbps | 16 | I2C, SPI, UART | 18.5mA | 85mA | FSK, GFSK, OOK | -121 dBm | 53 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI1012-A-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 768B | 表面贴装 | 42-WFQFN Exposed Pad | FLASH | -40°C~85°C | Tape & Reel (TR) | 2000 | Obsolete | 3 (168 Hours) | TxRx + MCU | 1.8V~3.6V | 240MHz~960MHz | SMBus, SPI, UART | 16kB Flash 768B RAM | 8b | 4 | EZRadioPro | 8051 | 13dBm | General ISM < 1GHz | 256kbps | I2C, SPI, UART | 18.5mA | 17mA~30mA | FSK, GFSK, OOK | -121 dBm | 15 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20707VA2PKWBGT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | -30°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | TxRx + MCU | 3.3V | 2.4GHz | Bluetooth v4.2 | 12dBm | Bluetooth | -96dBm | 3Mbps | I2C, I2S, SPI, UART | 26mA | 60mA | 4DQPSK, 8DPSK, GFSK | 7 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CG8423AM | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 56-UFQFN Exposed Pad | -40°C~105°C | Tray | PRoC™ BLE | Obsolete | 3 (168 Hours) | TxRx + MCU | 1.9V~5.5V | 2.4GHz | 128kB Flash 16kB SRAM | Bluetooth v4.1 | 3dBm | Bluetooth | -89dBm | 1Mbps | I2C, SPI, UART | 16.4mA | 15.6mA | GFSK | 36 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BC6140A02-IQQB-R | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 48-VQFN | 48 | Cut Tape (CT) | 2002 | BlueCore® BC6140™ | Obsolete | 3 (168 Hours) | TxRx + MCU | 2.4GHz | 48kB RAM | Bluetooth v3.0 | 8.5dBm | Bluetooth | -90dBm | 3Mbps | I2C, SPI, UART | -91 dBm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EFR32FG14P233F256GM48-B | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tray | 柔性壁虎 | 活跃 | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 169MHz~915MHz 2.4GHz | 256kB Flash 32kB RAM | 柔性壁虎 | 20dBm | 802.15.4 | -126.2dBm | 1Mbps | I2C, I2S, SPI, UART, USART | 8.4mA~10.2mA | 8.5mA~35.3mA | 2FSK, 4FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 28 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MAX2829ETN+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 56-WFQFN Exposed Pad | YES | 56 | -40°C~85°C | Tube | 2005 | e3 | yes | 活跃 | 3 (168 Hours) | 56 | EAR99 | 仅TxRx | Tin (Sn) | 8542.39.00.01 | 2.7V~3.6V | QUAD | 无铅 | 260 | 1 | 2.7V | 0.5mm | 2.4GHz 5GHz | 30 | MAX2829 | 56 | 不合格 | 802.11a/b/g | -2dBm | WiFi | -75dBm | 54Mbps | SPI | 118mA~210mA | 142mA~157mA | CCK, DSSS, OFDM | 0.8mm | 8mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
![]() | CC2510F32RSPR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4kB | Copper, Lead, Tin | 表面贴装 | 表面贴装 | 36-VFQFN Exposed Pad | 36 | -40°C~85°C | Tape & Reel (TR) | e4 | no | Discontinued | 3 (168 Hours) | 36 | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | 2V~3.6V | QUAD | 260 | 1 | 3V | 0.5mm | 2.4GHz | CC2510 | 36 | 3.3V | SPI, UART | 32kB Flash 4kB SRAM | 8b | 256 kb | 8051 | 1dBm | General ISM > 1GHZ | 500kBaud | I2S, SPI, USART | 14.7mA~22.9mA | 15.5mA~26mA | 2FSK, GFSK, MSK | -103 dBm | 21 | 0.9mm | 6mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||
![]() | MAX2510EEI+T | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | PRODUCTION (Last Updated: 1 month ago) | Tin | 表面贴装 | 表面贴装 | 28-SSOP (0.154, 3.90mm Width) | 28 | -40°C~85°C | Tape & Reel (TR) | 2001 | e3 | yes | 活跃 | 1 (Unlimited) | 28 | EAR99 | 仅TxRx | 2.7V~5.5V | DUAL | 鸥翼 | 260 | 1 | 3V | 0.635mm | 100MHz~600MHz | 30 | MAX2510 | 28 | 不合格 | 3V | 3/5V | 1dBm | General ISM < 1GHz | 14mA | 17mA | 1 | 9.89mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
![]() | DA14583-01F01AT2 | Dialog Semiconductor GmbH | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 42kB | 表面贴装 | 40-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2015 | yes | 活跃 | 3 (168 Hours) | TxRx + MCU | 8542.39.00.01 | 2.35V~3.3V | 未说明 | unknown | 2.4GHz | 未说明 | I2C, SPI, UART | 1Mb Flash 32kB OTP 84kB ROM 50kB SRAM | Bluetooth v4.1 | -1dBm | Bluetooth | I2C, SPI, UART | 3.7mA | 3.4mA | -93 dBm | 24 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EFR32BG12P232F1024GM68-CR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 68-VFQFN Exposed Pad | -40°C~85°C | Cut Tape (CT) | EFR32™ Blue Gecko | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.8V~3.8V | 2.4GHz | 1024kB Flash 128kB RAM | Bluetooth v5.0, Wireless M-Bus | 10dBm | 802.15.4, Bluetooth | -126.2dBm | 2Mbps | I2C, I2S, SPI, UART | 8.4mA~10mA | 8.5mA~35.3mA | 2-FSK, 4-FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 31 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EFR32BG12P433F1024GM68-CR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 68-VFQFN Exposed Pad | -40°C~85°C | Cut Tape (CT) | EFR32™ Blue Gecko | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.8V~3.8V | 2.4GHz | 1024kB Flash 256kB RAM | Bluetooth v5.0, Wireless M-Bus | 19dBm | 802.15.4, Bluetooth | -126.2dBm | 2Mbps | I2C, I2S, SPI, UART | 8.4mA~10mA | 8.5mA~35.3mA | 2-FSK, 4-FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 28 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYRF69313-40LTXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256B | Gold | 表面贴装 | 表面贴装 | 40-VFQFN Exposed Pad | 40 | 0°C~70°C | Tray | 2011 | PRoC® | e3 | Obsolete | 3 (168 Hours) | 40 | 5A991.G | TxRx + MCU | 哑光锡 | 8542.39.00.01 | 4V~5.25V | QUAD | 260 | 3V | 0.5mm | 2.4GHz | 40 | 40 | 3.3V | 3.35V | SPI, USB | 8kB Flash 256B SRAM | 8b | M8C | 0dBm | General ISM > 1GHZ | 1.5Mbps | SPI, USB | 20.2mA~23.4mA | 22.4mA~27.7mA | DSSS, GFSK | -90 dBm | 14 | 1mm | 6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
![]() | CY8C4128FNI-BL573T | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | YES | 36 | -40°C~105°C | Tape & Reel (TR) | 2018 | PSOC® 4 | 活跃 | 1 (Unlimited) | 76 | TxRx + MCU | 1.8V~5.5V | BOTTOM | BALL | 未说明 | 1.8V | 0.4mm | 2.4GHz | 未说明 | R-PBGA-B76 | 256kB Flash 8kB ROM 32kB SRAM | Bluetooth v4.2 | NO | 3dB | Bluetooth, General ISM > 1GHz | 32000 | -92dBm | 8Mbps | I2C, SPI, UART | 16.4mA~18.7mA | 16.5mA~20mA | GFSK | I2C; SPI; UART | 36 | 0.55mm | 4.04mm | 3.87mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
![]() | CYW88359CUBGT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW2070B2KUBXGT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AMIS-53050-XTD | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 32-LQFP | Tube | 2006 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EFR32BG1V132F256GM48-C0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | 2017 | Obsolete | 2 (1 Year) | 48 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | 2.4GHz | S-XQCC-N48 | 256kB Flash 16kB RAM | Bluetooth v4.0 | 0dBm | Bluetooth | -94dBm | 2Mbps | I2C, I2S, SPI, UART | 8.7mA | 8.2mA~126.7mA | 2FSK, 4FSK, GFSK, GMSK, OQPSK | 16 | 0.9mm | 7mm | 7mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | BC51E129B14-IYH-E4 | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 67-WLCSP | 67 | -30°C~85°C | Tape & Reel (TR) | BlueCore® | Obsolete | 3 (168 Hours) | TxRx + MCU | 1.8V~3.6V | 2.4GHz | 48kB RAM | Bluetooth v2.1 +EDR, Class 2 and 3 | 6dBm | Bluetooth | 3Mbps | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HMC4053LP4 | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 1 (Unlimited) | HMC405 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EFR32FG1V131F32GM48-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 柔性壁虎 | yes | 活跃 | 2 (1 Year) | 48 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | compliant | 169MHz~915MHz | S-XQCC-N48 | 32kB Flash 8kB RAM | 柔性壁虎 | 16.5dBm | 802.15.4 | -94dBm | 1Mbps | I2C, I2S, SPI, UART | 8.7mA | 8.2mA | 2FSK, 4FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, MSK, OOK, O-QPSK | 32 | 0.9mm | 7mm | 7mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
![]() | EFR32FG12P232F1024GM48-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 柔性壁虎 | yes | Discontinued | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 2.4GHz | 1024kB Flash 128kB RAM | 19dBm | -102dBm | 2Mbps | I2C, I2S, SPI, UART | 8mA~10.8mA | 8.2mA~126.7mA | 2-FSK, 4-FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 31 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EZR32HG220F32R68G-B0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | yes | Discontinued | 3 (168 Hours) | TxRx + MCU | 1.98V~3.8V | compliant | 142MHz~1.05GHz | 32kB Flash 8kB RAM | 20dBm | 802.15.4 | -133dBm | 1Mbps | I2C, SPI, UART, USART, USB | 11.1mA~13.7mA | 18mA~108mA | 4GFSK, GFSK, GMSK, OOK | 27 | 符合RoHS标准 |