类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 工作电源电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 内存大小 | 数据总线宽度 | 带宽 | 定时器/计数器的数量 | 议定书 | 核心架构 | 最高频率 | 边界扫描 | 可编程I/O数 | 功率 - 输出 | 无线电频率系列/标准 | 内存(字) | 敏感度 | 数据率（最大） | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 总线兼容性 | 通用输入输出数量 | [医]GPIO | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | EZR32WG330F128R60G-B0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 32kB | 表面贴装 | 64-VFQFN Exposed Pad | 64 | 41 | -40°C~85°C | Tray | 2015 | EZR32WG | yes | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 1.98V~3.8V | 260 | 142MHz~1.05GHz | 未说明 | I2C, SPI, UART, USART, USB | 128kB Flash 32kB RAM | EZRadioPro | 13dBm | 802.15.4 | 1Mbps | I2C, SPI, UART, USART, USB | 11.1mA~13.7mA | 18mA~88mA | 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK | -129 dBm | 38 | Unknown | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | EFR32FG1V132F64GM48-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2016 | yes | 活跃 | 2 (1 Year) | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | 2.4GHz | 64kB Flash 16kB RAM | 柔性壁虎 | 16.5dBm | -99dBm | 2Mbps | I2C, I2S, SPI, UART | 8.7mA | 8.2mA~126.7mA | 2FSK, 4FSK, GFSK, GMSK, OQPSK | 31 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| EFR32FG1P132F64GM48-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 2016 | yes | 活跃 | 2 (1 Year) | 48 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | 2.4GHz | S-XQCC-N48 | 64kB Flash 16kB RAM | 柔性壁虎 | 19.5dBm | -99dBm | 2Mbps | I2C, I2S, SPI, UART | 8.7mA | 8.2mA~126.7mA | 2FSK, 4FSK, GFSK, GMSK, OQPSK | 31 | 0.9mm | 7mm | 7mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| EFR32FG14P231F128GM48-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 柔性壁虎 | 活跃 | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | 169MHz~915MHz | 128kB Flash 16kB RAM | 柔性壁虎 | 20dBm | 802.15.4 | -126.2dBm | 1Mbps | I2C, I2S, SPI, UART, USART | 8.4mA~10.2mA | 8.5mA~35.3mA | 2FSK, 4FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA2561R212-MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | 64-VFQFN Exposed Pad | 64-QFN (9x9) | FLASH | -40°C~85°C | Tray | 1997 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 769MHz~935MHz | ATMEGA2561 | I2C, SPI | 256kB Flash 4kB EEPROM 8kB RAM | 8b | 6LoWPAN, Zigbee® | AVR | 10dBm | 802.15.4, General ISM < 1GHz | -110dBm | 1Mbps | SPI | 8.7mA~9.2mA | 13mA~25mA | DSSS, BPSK, O-QPSK | -110 dBm | 54 | 54 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | ZIC2410QN48 | CEL | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLASH | 8kB | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 150.507618mg | 22 | -40°C~85°C | Bulk | Obsolete | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.35V~3.3V | 2.4GHz | 3.3V | SPI, UART | 96kB Flash 1kB ROM 8kB RAM | 4 | Zigbee® | 8051 | 8dBm | 802.15.4 | -98dBm | 1Mbps | 4 | I2S, SPI, UART | 4.6mA | 33.8mA~46.3mA | O-QPSK | -98 dBm | 22 | 22 | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||
 | CY8C4128LQI-BL593 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 表面贴装 | 56-UFQFN Exposed Pad | YES | 38 | -40°C~85°C TA | Tray | 2018 | PSOC® 4 CY8C41xx BLE | 活跃 | 3 (168 Hours) | 56 | 5A992.B | TxRx + MCU | 8542.31.00.01 | 1.8V~5.5V | QUAD | 无铅 | 3.3V | 0.4mm | 2.4GHz | S-XQCC-N56 | 256kB Flash 8kB ROM 32kB SRAM | Bluetooth v4.2 | NO | 3dB | Bluetooth, General ISM > 1GHz | 32000 | -92dBm | 8Mbps | I2C, SPI, UART | 16.4mA~18.7mA | 16.5mA~20mA | GFSK | I2C; IRDA; SPI; UART | 36 | 0.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | JN5139/Z01,515 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 56-VFQFN | -40°C~85°C | Tape & Reel (TR) | 2010 | Obsolete | 2A (4 Weeks) | TxRx + MCU | 2.2V~3.6V | 2.4GHz | 192kB ROM 96kB RAM | Zigbee® | 3dBm | 802.15.4 | -97dBm | 1Mbps | SPI, UART | 37mA | 38mA | 21 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC2560ANPYFVR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 54-BGA, DSBGA | -40°C~85°C | Tape & Reel (TR) | 不用于新设计 | 3 (168 Hours) | 仅TxRx | 2.2V~4.8V | 2.4GHz | CC2560 | 4.8V | UART | Bluetooth v4.0 | 12dBm | Bluetooth | 4Mbps | I2S, UART | 40.5mA~41.2mA | 40.5mA~41.2mA | GFSK, GMSK | -95 dBm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | EM260-RTY | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 40-VFQFN Exposed Pad | -40°C~85°C | Tray | Obsolete | 3 (168 Hours) | TxRx + MCU | 8542.31.00.01 | 2.1V~3.6V | 2.4GHz | SPI, UART | Zigbee® | 2.5dBm | 802.15.4 | SPI, UART | 36mA | -99 dBm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SESUB-PAN-D14580 | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | PRODUCTION (Last Updated: 2 months ago) | 表面贴装 | 36-SMD Module | -20°C~70°C | Tape & Reel (TR) | 2013 | 活跃 | 3 (168 Hours) | TxRx + MCU | 8542.39.00.01 | 2.35V~3.3V | 2.4GHz | I2C, SPI, UART | 32kB OTP 84kB ROM 50kB SRAM | Bluetooth v4.1 | 0dBm | Bluetooth | I2C, SPI, UART | 5.4mA | 5mA | -94 dBm | 12 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | SI1004-E-GM2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | 4.3kB | 表面贴装 | 42-VFLGA Exposed Pad | 42 | 42-LGA (5x7) | FLASH | -40°C~85°C | Tape & Reel (TR) | 2013 | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 240MHz~960MHz | I2C, SPI, UART | 3.6V | 900mV | 64kB Flash 4.35kB RAM | 8b | 620 kHz | 4 | EZRadioPro | 8051 | 25MHz | 19 | 13dBm | General ISM < 1GHz | -121dBm | 256kbps | I2C, SPI, UART | 18.5mA | 17mA~30mA | FSK, GFSK, OOK | -121 dBm | 19 | 19 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| EFR32MG1P132F256IM48-C0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tray | 2017 | Mighty Gecko | 活跃 | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 256kB Flash 32kB RAM | Bluetooth v4.0, Thread, Zigbee® | 16.5dBm | 802.15.4, Bluetooth | 2Mbps | I2C, I2S, SPI, UART | 8.2mA~126.7mA | 31 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | EFR32FG14P232F128GM32-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | Tape & Reel (TR) | 活跃 | 2 (1 Year) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR32FG1P131F256IM32-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | -40°C~85°C | Tray | 柔性壁虎 | 活跃 | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 169MHz~915MHz | 256kB Flash 32kB RAM | 柔性壁虎 | 20dBm | 2Mbps | I2C, I2S, SPI, UART | 8.2mA~126.7mA | 16 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR32FG14P232F256GM32-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 柔性壁虎 | 活跃 | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | 2.4GHz | 256kB Flash 32kB RAM | 柔性壁虎 | 19dBm | 802.15.4 | -126.2dBm | 1Mbps | I2C, I2S, SPI, UART, USART | 8.4mA~10.2mA | 8.5mA~35.3mA | 2FSK, 4FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 16 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR32BG1B232F256GM32-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 2012 | yes | 活跃 | 2 (1 Year) | 32 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | 2.4GHz | S-XQCC-N32 | 256kB Flash 32kB RAM | Bluetooth v4.0 | 10.5dBm | Bluetooth | -94dBm | 2Mbps | I2C, I2S, SPI, UART | 8.7mA | 8.2mA~126.7mA | 2FSK, 4FSK, GFSK, GMSK, OQPSK | 16 | 0.9mm | 5mm | 5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| EFR32MG13P632F512GM48-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | Discontinued | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 2.4GHz | 512kB Flash 64kB RAM | Bluetooth v4.0, Thread, Zigbee® | 10dBm | 802.15.4, Bluetooth | -102dBm | 2Mbps | I2C, UART, USART | 8.4mA~11mA | 8.5mA~134.3 | 2-FSK, 4-FSK, DSSS, GMSK, O-QPSK | 31 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
| EZR32WG330F64R55G-B0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 64-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2015 | EZR32WG | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 1.98V~3.8V | 142MHz~1.05GHz | I2C, SPI, UART, USART, USB | 64kB Flash 32kB RAM | EZRadio | 13dBm | 802.15.4 | 1Mbps | I2C, SPI, UART, USART, USB | 11.1mA~13.7mA | 18mA~88mA | 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK | -116 dBm | 38 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
| EZR32WG330F64R61G-B0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C~85°C | Tape & Reel (TR) | 2015 | EZR32WG | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 85°C | -40°C | 1.98V~3.8V | 142MHz~1.05GHz | I2C, SPI, UART, USART, USB | 64kB Flash 32kB RAM | EZRadioPro | 16dBm | 802.15.4 | -129dBm | 1Mbps | I2C, SPI, UART, USART, USB | 11.1mA~13.7mA | 18mA~88mA | 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK | -129 dBm | 38 | 38 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| EZR32WG330F64R68G-B0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 64-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2015 | EZR32WG | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 1.98V~3.8V | 142MHz~1.05GHz | I2C, SPI, UART, USART, USB | 64kB Flash 32kB RAM | EZRadioPro | 20dBm | 802.15.4 | 1Mbps | I2C, SPI, UART, USART, USB | 11.1mA~13.7mA | 18mA~88mA | 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK | -133 dBm | 38 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
| EFR32MG1P132F256GM32-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 2016 | yes | 活跃 | 2 (1 Year) | 32 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | 2.4GHz | S-XQCC-N32 | 256kB Flash 32kB RAM | Zigbee® | 16.5dBm | 802.15.4 | -99dBm | 250kbps | I2C, I2S, SPI, UART | 8.7mA | 8.2mA~126.7mA | 16 | 0.9mm | 5mm | 5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| EZR32WG330F128R60G-B0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C~85°C | Tape & Reel (TR) | 2015 | EZR32WG | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 85°C | -40°C | 1.98V~3.8V | 142MHz~1.05GHz | I2C, SPI, UART, USART, USB | 128kB Flash 32kB RAM | EZRadioPro | 13dBm | 802.15.4 | -129dBm | 1Mbps | I2C, SPI, UART, USART, USB | 11.1mA~13.7mA | 18mA~88mA | 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK | -129 dBm | 38 | 38 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| EZR32WG330F64R69G-B0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C~85°C | Tape & Reel (TR) | 2015 | EZR32WG | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 85°C | -40°C | 1.98V~3.8V | 142MHz~1.05GHz | I2C, SPI, UART, USART, USB | 64kB Flash 32kB RAM | EZRadioPro | 20dBm | 802.15.4 | -133dBm | 1Mbps | I2C, SPI, UART, USART, USB | 11.1mA~13.7mA | 18mA~88mA | 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK | -133 dBm | 38 | 38 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| EZR32WG330F256R55G-B0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C~85°C | Tape & Reel (TR) | 2015 | EZR32WG | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 85°C | -40°C | 1.98V~3.8V | 142MHz~1.05GHz | I2C, SPI, UART, USART, USB | 256kB Flash 32kB RAM | EZRadio | 13dBm | 802.15.4 | -116dBm | 1Mbps | I2C, SPI, UART, USART, USB | 11.1mA~13.7mA | 18mA~88mA | 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK | -116 dBm | 38 | 38 | 符合RoHS标准 |