类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | ADC通道数量 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 定时器数量 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | PWM通道数 | 总线兼容性 | 桶式移位器 | 内部总线架构 | 片上数据 RAM 宽度 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | USB 通道数 | 以太网通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||||
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 | AM3715CUSA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 188 | 64kB | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | 423-LFBGA, FCBGA | YES | 423 | ROM | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 800MHz | AM3715 | 423 | 1.1V | 1.8V | I2C, SPI, UART, USB | 1.5V | 32kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 16b | ARM | YES | YES | 浮点 | YES | 65536 | 4 | 1 Core 32-Bit | 有 | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 1.4mm | 16mm | 16mm | 960μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | P1020NXN2HFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2006 | QorIQ P1 | 活跃 | 3 (168 Hours) | 689 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | P1020 | S-PBGA-B689 | 1V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 2.5V 3.3V | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6S4AVM08AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6S | 活跃 | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 未说明 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX357CJQ5C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | YES | 4 | -40°C~85°C TA | Tray | 2005 | i.MX35 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper - with Nickel barrier | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX357 | S-PBGA-B400 | 不合格 | 1.47V | 1.33V | 532MHz | 多功能外围设备 | ARM1136JF-S | 24MHz | 26 | YES | 16 | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | 1-WIRE; CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | 1.6mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX536AVV8C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 529-FBGA | YES | Automotive grade | -40°C~125°C TJ | Tray | 2008 | i.MX53 | e2 | 活跃 | 3 (168 Hours) | 529 | 5A992 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 40 | MCIMX536 | S-PBGA-B529 | 不合格 | 1.15V | 1.11.31.8/3.3V | 1.05V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 27MHz | 32 | 26 | YES | YES | AEC-Q100 | 32 | 浮点 | YES | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, DDR2, DDR3 | USB 2.0 (2), USB 2.0 + PHY (2) | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | 1.85mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6Q5EYM12AD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA, FCBGA | YES | -20°C~105°C TJ | Tray | 2002 | i.MX6Q | e1 | 活跃 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 1.2GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 24MHz | 64 | 26 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3505AZCNAC | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | Copper, Silver, Tin | 491-LFBGA | YES | 491 | 186 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.65mm | 600MHz | AM3505 | 491 | 1.2V | 1.248V | I2S, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 16 | 16b | 12 | ARM | YES | YES | 浮点 | YES | 65536 | 1.8V 3.3V | 4 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography | LCD | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9G45B-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 160 | 65536 | 有 | 64kB | Copper, Silver, Tin | 表面贴装 | 324-TFBGA | 324 | ROM | -40°C~85°C TA | Tray | 2009 | SAM9G | yes | 活跃 | 3 (168 Hours) | 324 | BOTTOM | BALL | 1V | 400MHz | AT91SAM9G45 | EBI/EMI, Ethernet, I2C, MMC, SPI, UART, USART, USB | 3.6V | 900mV | Internal | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | YES | YES | 32b | 7 | ARM | 1.8V 3.3V | 8 | 10/100Mbps | 1 Core 32-Bit | 无 | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | FLASH | 4 | LCD, Touchscreen | 2 | 1 | 800μm | 15.05mm | 15.05mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | OMAPL137DZKB3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 128kB | ACTIVE (Last Updated: 5 days ago) | Copper, Silver, Tin | 表面贴装 | 256-BGA | 256 | Cache | 0°C~90°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 375MHz | OMAPL137 | 1.2V | SPI, USB | 1.32V | 1.14V | 32kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 16b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | 3 | Signal Processing; C674x, System Control; CP15 | 1 | NO | SINGLE | LCD | 2.05mm | 17mm | 17mm | 1.36mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | MPC8270CVVUPEA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1997 | MPC82xx | e1 | 活跃 | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8270 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 32 | 32 | YES | YES | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX283CVM4B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tray | 2002 | i.MX28 | e1 | 活跃 | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | MCIMX283 | S-PBGA-B289 | 1.55V | 1.35V | 454MHz | 多功能外围设备 | ARM926EJ-S | 24MHz | YES | 128000 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | Data; DCP | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | 1.37mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8308VMAGDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 473-LFBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 40 | MPC8308 | S-PBGA-B473 | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4378BZDN100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 表面贴装 | 491-LFBGA | 491 | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.325V | 1GHz | AM4378 | 491 | CAN, I2C, SPI, UART | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | 加密加速器 | TSC, WXGA | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4378BZDNA100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 491-LFBGA | 491 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.325V | 1GHz | AM4378 | 491 | CAN, I2C, SPI, UART | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | 加密加速器 | TSC, WXGA | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9G25-CFU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 105 | 有 | 32kB | Copper, Silver, Tin | 表面贴装 | 247-LFBGA | 247 | ROM | -40°C~85°C TA | Tray | 2004 | SAM9G | yes | 活跃 | 3 (168 Hours) | 247 | BOTTOM | BALL | 1V | 0.5mm | 400MHz | AT91SAM9G25 | 11.8/3.33.3V | 2-Wire, CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB | 1.1V | 900mV | Internal | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, POR, PWM, WDT | 32 | YES | YES | 32b | YES | NO | 6 | 26 | ARM | 1.8V 3.3V | 10/100Mbps | 1 Core 32-Bit | 无 | DDR2, SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | FLASH | 1.37mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| P2020NSN2MFC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | 32 | YES | YES | 16 | 浮点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8245LVV266D | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 352-LBGA | YES | 0°C~105°C TA | Tray | 1998 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | 2.1V | 23.3V | 1.7V | 266MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 3.3V | 1 Core 32-Bit | 无 | SDRAM | I2C, I2O, PCI, UART | 1.65mm | 35mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4376BZDNA80 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 491-LFBGA | 491 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.26V | 800MHz | AM4376 | 491 | CAN, I2C, SPI, UART | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | 加密加速器 | TSC, WXGA | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| P2020NSE2MFC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 固定点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6Q6AVT10AE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 624-FBGA, FCBGA | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | 活跃 | 3 (168 Hours) | 260 | 40 | 1.0GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX283DVM4B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | -20°C~70°C TA | Tray | 2002 | i.MX28 | e1 | 活跃 | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | MCIMX283 | S-PBGA-B289 | 1.55V | 1.35V | 454MHz | 多功能外围设备 | ARM926EJ-S | 24MHz | YES | 128000 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | Data; DCP | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Boot Security, Cryptography, Hardware ID | Keyboard, LCD, Touchscreen | 1.37mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8314VRAGDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8314 | S-PBGA-B620 | 1.05V | 13.3V | 0.95V | 400MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | 2.46mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX233CAG4C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 128-LQFP | -40°C~85°C TA | Tray | 2004 | i.MX23 | e3 | 活跃 | 3 (168 Hours) | 5A992 | Matte Tin (Sn) | 8542.31.00.01 | 260 | 40 | MCIMX233 | 454MHz | MICROPROCESSOR | ARM926EJ-S | 2.0V 2.5V 2.7V 3.0V 3.3V | 1 Core 32-Bit | 无 | DRAM | USB 2.0 + PHY (1) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Cryptography, Hardware ID | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX356AJQ5C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | Automotive grade | 400-LFBGA | YES | 3 | -40°C~85°C TA | Tray | 2008 | i.MX35 | 活跃 | 3 (168 Hours) | 400 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 未说明 | MCIMX356 | S-PBGA-B400 | 不合格 | 1.47V | 1.33V | 532MHz | ARM1136JF-S | YES | AEC-Q100 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART | Multimedia; GPU, IPU, VFP | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; SPI; UART; USB | Secure Fusebox, Secure JTAG | Keypad, KPP, LCD | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D225C-D1M-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 196-TFBGA, CSBGA | YES | -40°C~85°C TA | Tray | SAMA5D2 | e2 | 活跃 | 3 (168 Hours) | 196 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 0.75mm | ATSAMA5D225 | S-PBGA-B196 | 1.9V | 1.7V | 500MHz | 128kB | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | 16 | YES | YES | 浮点 | YES | 65536 | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | 9 | Multimedia; NEON™ MPE | 16 | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 51 | 1.2mm | 11mm | ROHS3 Compliant |