类别是'时钟/计时 - 时钟缓冲器，驱动器'
时钟/计时 - 时钟缓冲器，驱动器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 包装方式 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出量 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 极性 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 通道数量 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 负载电容 | 电源电流 | 功率耗散 | 输出电流 | 传播延迟 | 静态电流 | 接通延迟时间 | 家人 | 逻辑功能 | 数据率 | 最大输入电压 | 输出特性 | 无卤素 | 输入 | 比率-输入：输出 | 最大 I(ol) | 差分 - 输入：输出 | Prop. Delay@Nom-Sup | 传播延迟(tpd) | 最大工作周期 | 施密特触发器 | 输入行数 | 输出行数 | fmax-Min | 同边偏斜-最大(tskwd) | 真实输出的数量 | 占空比 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |
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 | SI5330L-B00229-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | YES | 24 | 350MHz | -40°C~85°C | Tape & Reel (TR) | 1997 | 活跃 | 2 (1 Year) | 24 | Fanout Buffer (Distribution), Translator | 1.71V~3.63V | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 40 | SI5330 | LVDS | 24 | 2.75V | 2.25V | 1 | CMOS, HSTL, LVTTL, SSTL | 1:4 | No/Yes | 4 ns | 0.9mm | 4mm | 4mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | HMC850LC3 | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 1 week ago) | 表面贴装 | 表面贴装 | 16-VFCQFN Exposed Pad | 16 | 20GHz | -40°C~85°C | Strip | e4 | no | 活跃 | 3 (168 Hours) | 16 | EAR99 | Fanout Buffer (Distribution) | GOLD (80) OVER NICKEL (50) | 680mW | -3V~-3.6V | QUAD | 无铅 | 未说明 | 1 | 0.5mm | 未说明 | HMC850 | 16 | Non-Inverting | 1 | 95mA | 75 ps | 850 | 28 Gbps | CML | 1:2 | Yes/Yes | 2 | 3mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | SY56028XRMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad, 32-MLF® | 32 | 4.5GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 32 | Fanout Buffer (Distribution), Multiplexer | 镍钯金 | 2.375V~2.625V | QUAD | 无铅 | 1 | 2.5V | unknown | SY56028 | CML | 8 | 不合格 | 2.5V | 2.625V | 2.375V | 1 | ECL | CML, LVDS, LVPECL | 4:2 | Yes/Yes | 0.36 ns | 4500 MHz | 850μm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NB7V58MMNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 21 hours ago) | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | 7GHz | -40°C~85°C | Tube | 2009 | GigaComm™ | yes | 活跃 | 1 (Unlimited) | 16 | Multiplexer, Data | Nickel/Gold/Palladium (Ni/Au/Pd) | 1.71V~3.6V | QUAD | 260 | 1 | 1.8V | 0.5mm | 40 | NB7V58M | CML | 16 | 3.6V | 1 | 100mA | 180 ps | 150mA | 7V | Translator | 无卤素 | CML, LVDS, LVPECL | 2:1 | Yes/Yes | 0.24 ns | 60 % | 950μm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | 8533AG-01LFT | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 650MHz | 0°C~70°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution), Multiplexer | 3.135V~3.465V | ICS8533-01 | LVPECL | 1 | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | 2:4 | Yes/Yes | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 853S011BMILFT | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 2.5GHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 2.375V~3.8V | ICS853S011 | ECL, LVPECL | 1 | CML, LVDS, LVPECL, SSTL | 1:2 | Yes/Yes | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SY56017RMG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | 16-MLF® (3x3) | 4.5GHz | -40°C~85°C | Tube | 2000 | Precision Edge® | 活跃 | 2 (1 Year) | Multiplexer | 85°C | -40°C | 2.375V~2.625V | SY56017 | CML | 2.5V | 1 | 2.625V | 2.375V | 210 ps | 21mA | CML, LVDS, LVPECL | 2:1 | Yes/Yes | 2 | 1 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK74CB218RLFTR | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 28-SSOP (0.154, 3.90mm Width) | 200MHz | 0°C~70°C | Tape & Reel (TR) | 74CB, Buffalo™ | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 3V~3.6V | MK74CB218 | 2 | LVCMOS | 1:8 | No/No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 830154AMI-08LFT | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8-SOIC | 160MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 1.4V~3.465V | ICS830154-08 | LVCMOS | 1 | LVCMOS | 1:4 | No/No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CDC351IDB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | Gold | 表面贴装 | 表面贴装 | 24-SSOP (0.209, 5.30mm Width) | 24 | 172.39345mg | -40°C~85°C | Tube | e4 | yes | 活跃 | 1 (Unlimited) | 24 | EAR99 | Fanout Buffer (Distribution) | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 100MHz | CDC351 | LVTTL, TRI-State | 24 | 10 | 3.3V | 3.6V | 3V | 1 | 50pF | 300μA | 6.6 ns | 25mA | 6.6 ns | 351 | LVTTL | 1:10 | 0.032 A | No/No | 4.2 ns | 0.9 ns | 2mm | 8.2mm | 5.3mm | 1.95mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | PL123-02NGC-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 6-UFDFN Exposed Pad | 200MHz | 0°C~70°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 6 | Fanout Buffer (Distribution) | 1.62V~3.63V | DUAL | 无铅 | 未说明 | 1 | 1.8V | 0.4mm | 未说明 | PL123 | R-PDSO-N6 | 3.63V | 1 | LVCMOS | 1:2 | No/No | 2 | 0.6mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CDC339DBG4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Gold | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | 156.687814mg | -40°C~85°C | Tube | e4 | yes | 活跃 | 1 (Unlimited) | 20 | Fanout Buffer (Distribution) | 600mW | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 1 | 5V | 0.65mm | 80MHz | CDC339 | 20 | 8 | 5V | 5V | 1 | 85mA | 600mW | 9 ns | 85mA | 9 ns | CDC | 3-STATE | TTL | 1:8 | No/No | 60 % | 60 % | 2mm | 7.2mm | 5.3mm | 1.95mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | 8S89831AKILF | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 16-VFQFN Exposed Pad | 2.1GHz | -40°C~85°C | Tube | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution) | 2.375V~3.465V | ICS8S89831 | ECL, LVPECL | 1 | CML, LVDS, LVPECL, SSTL | 1:4 | Yes/Yes | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SY100EP15VK4G-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | 16 | 16-TSSOP | 2.5GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | 100EP, Precision Edge®, ECL Pro® | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution), Multiplexer | 85°C | -40°C | 2.97V~5.5V | SY100EP15 | LVECL, LVPECL | 1 | 5.5V | 2.97V | 4.12V | HSTL, LVECL, LVPECL | 2:4 | Yes/Yes | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL40231LDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 1.6GHz | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution), Multiplexer | 1.35V~3.465V | HCSL, LVCMOS, LVDS, LVPECL | 1 | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | 3:10 | Yes/Yes | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI5330K-B00224-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | YES | 24 | -40°C~85°C | Tray | 1997 | 活跃 | 2 (1 Year) | 24 | Fanout Buffer (Distribution), Translator | 1.71V~3.63V | QUAD | 无铅 | 未说明 | 1 | 3.3V | 0.5mm | 350MHz | 未说明 | SI5330 | LVPECL | 24 | 4 | 3.63V | 2.97V | 1 | 10mA | 4 ns | Clock | CMOS, HSTL, LVTTL, SSTL | 1:4 | No/Yes | 850μm | 4mm | 4mm | Unknown | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LMH2180YD/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | -40°C~85°C | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | 8 | EAR99 | Fanout Buffer (Distribution) | 2.4V~5V | DUAL | 260 | 0.5mm | 75MHz | LMH2180 | 2 | 1 | 2.3mA | 65mA | Clock | 2:2 | No/No | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | HMC744LC3 | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 16-VFCQFN Exposed Pad | 16 | 14GHz | -40°C~85°C | Strip | e4 | no | 活跃 | 3 (168 Hours) | 16 | EAR99 | Fanout Buffer (Distribution) | GOLD (80) OVER NICKEL (50) | 680mW | 3V~3.6V | QUAD | 无铅 | 未说明 | 1 | 3.3V | 0.5mm | 未说明 | HMC744 | 16 | Non-Inverting | 3.6V | 3V | 1 | 87mA | 120 ps | 744 | 14 Gbps | CML | 1:2 | Yes/Yes | 2 | 3mm | 3mm | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | NB7L1008MNTXG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2014 | GigaComm™ | e3 | yes | 活跃 | 1 (Unlimited) | 32 | Fanout Buffer (Distribution), Data | Tin (Sn) | 2.375V~3.6V | QUAD | 1 | 2.5V | 0.5mm | 7GHz | LVPECL | S-XQCC-N32 | 3.6V | 2.5/3.3V | 2.375V | 1 | NB7 | CML, LVDS, LVPECL | 1:8 | Yes/Yes | 0.22 ns | 0.22 ns | 55 % | 0.02 ns | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | PI49FCT3807ASEX | Diodes Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | 66MHz | -40°C~85°C | Tape & Reel (TR) | 49FCT | e3 | Obsolete | 1 (Unlimited) | 20 | EAR99 | Fanout Buffer (Distribution) | Matte Tin (Sn) | 500mW | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 40 | 49FCT3807 | CMOS, TTL | 10 | 3.3V | 3.6V | 3V | 1 | 50pF | 4 ns | FCT | CMOS, TTL | 1:10 | 0.024 A | No/No | 0.5 ns | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | CDC328ADR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ACTIVE (Last Updated: 1 week ago) | Gold | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | 16 | 155.100241mg | -40°C~85°C | Cut Tape (CT) | e4 | yes | Discontinued | 1 (Unlimited) | 16 | EAR99 | Fanout Buffer (Distribution) | COMBINATIONS OF TRUE AND COMPLEMENTARY OUTPUTS POSSIBLE WITH POLARITY-CONTROL INPUTS | TR | 770mW | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 1 | 5V | 100MHz | CDC328 | 16 | 6 | 5V | 5V | 1 | 40mA | 770mW | 5 ns | 40mA | 328 | TTL | 1:6 | 0.048 A | No/No | 1.75mm | 9.9mm | 3.91mm | 1.58mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | CDC204DWRG4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | 500.709277mg | 25°C~70°C | Tape & Reel (TR) | no | Obsolete | 1 (Unlimited) | 20 | Buffer/Driver | TAPE AND REEL | 1.6W | 4.75V~5.25V | DUAL | 鸥翼 | 6 | 5V | 80MHz | CDC204 | 20 | 6 | 5V | 5V | 1 | 50pF | 4μA | 1.6W | 5.7 ns | 4μA | 5.7 ns | 204 | CMOS | 6:6 | 0.024 A | No/No | NO | 7.5mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MC100LVE222FAG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 52-LQFP | 52 | -40°C~85°C | Tray | 2005 | 100LVE | e3 | yes | Obsolete | 2 (1 Year) | 52 | Fanout Buffer (Distribution), Divider, Multiplexer | Tin (Sn) | 3V~5.25V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 1.5GHz | 40 | MC100LVE222 | ECL | 52 | 15 | 3.8V | -3.3/-5V | 3V | 1 | 125mA | Clock | 2.42V | 无卤素 | LVECL, LVPECL | 2:15 | Yes/Yes | 0.05 ns | 1.5mm | 10mm | 10mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | PI6C48535-01LE | Diodes Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20 | 500MHz | -40°C~85°C | Tube | 2011 | e3 | Obsolete | 1 (Unlimited) | 20 | EAR99 | Fanout Buffer (Distribution), Multiplexer | Matte Tin (Sn) | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 40 | PI6C48535 | LVPECL | 4 | 3.3V | 3.6V | 3V | 1 | 60mA | 1.9 ns | 6C | LVCMOS, LVPECL, LVTTL | 2:4 | No/Yes | 500 MHz | 0.08 ns | 60 % | 6.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | ZL40221LDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 750MHz | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution), Multiplexer | 85°C | -40°C | 2.375V~3.465V | LVDS | 3.465V | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 2:6 | Yes/Yes | 5 % | 无 | ROHS3 Compliant | 无铅 |