类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 最大电源电流 | 电源电流-最大值 | 电流源 | 逻辑功能 | 数据率 | 通信IC类型 | 最大工作周期 | 收发器数量 | 消费者集成电路类型 | 输出低电流-最大值 | 标准 | 电池供电 | PSRR-Min | 混合动力车 | 马克斯噪音 | ISDN接入速率 | 参考点 | 输出高电压-最小 | 输出低电压-最大值 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | VSC8582XKS-11 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 256-BGA | YES | -40°C~125°C | Tray | 活跃 | 4 (72 Hours) | 256 | 1V | BOTTOM | BALL | 1V | unknown | S-PBGA-B256 | Ethernet | GMII, SerDes, SPI, TBI | 1 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9041BP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 28-PLCC | 1.182714g | -40°C~85°C | Tube | 2001 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 4.5V~5.5V | 数字锁相环 | 1 | 5.5V | 4.5V | 60mA | 60mA | 60mA | 60mA | 60 % | 1 | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE79R70DJC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | 32-PLCC (11.43x13.97) | Commercial grade | 0°C~70°C | Tube | 2002 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 4.75V~5.25V | Subscriber Line Interface Concept (SLIC) | 5V | 2-Wire | 1 | 4.75V | 6.5mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL38002QDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 48-TQFP | YES | 48 | 9.071791g | -40°C~85°C | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 哑光锡 | 90mW | 2.7V~3.6V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 20MHz | 30 | 回声消除 | 3.3V | 2 | Serial | 1 | 20mA | ISDN回音消除器 | 7mm | 7mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
.png) | ZL50111GAG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 552-BGA | 552-PBGA (35x35) | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | 1.65V~1.95V | ZL50111 | Telecom Circuit | TDM | 1 | 950mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9122AP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | -40°C~85°C | Tube | e3 | yes | 活跃 | 1 (Unlimited) | 28 | 哑光锡 | 4.5V~5.5V | QUAD | J BEND | 260 | 5V | 30 | 回声消除 | 5V | 5V | Serial | 2 | 70mA | ISDN回音消除器 | 4.57mm | 11.505mm | 11.505mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | LE79112AKVC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | TQFP | 128 | 128-TQFP | 503.487531mg | Tray | 活跃 | 3 (168 Hours) | 3.3V | Telecom Circuit | 2-Wire | 32 | 3.3V | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT88L70ASR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | -40°C~85°C | Tape & Reel (TR) | 2003 | e3 | yes | 活跃 | 3 (168 Hours) | 18 | EAR99 | 哑光锡 | 500mW | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 3V | 3.58MHz | 30 | DTMF接收器 | 3V | 3V | 1 | 2mA | Receiver | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | MT8888CS1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | 800.987426mg | -40°C~85°C | Tube | 2000 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 1W | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.58MHz | 30 | DTMF 收发器 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | LE79R79-1DJCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Industrial grade | 0°C~70°C | Tape & Reel (TR) | e3 | 活跃 | 3 (168 Hours) | 32 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 5V | Subscriber Line Interface Concept (SLIC) | 不合格 | 5V | 5V | 2-Wire | 1 | 6.5mA | CONSTANT CURRENT | 30 dB | 2-4 CONVERSION | 79 dBrnC | 3.556mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| MT8880CS1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | 800.987426mg | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 1W | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.58MHz | 30 | DTMF 收发器 | 不合格 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 2.65mm | 7.5mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | ST7590T | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | NRND (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 100-TQFP Exposed Pad | 100 | -40°C~80°C | Tray | e1 | 活跃 | 3 (168 Hours) | 100 | 5A992.C | Integrated Circuit (IC) | Tin/Silver/Copper (Sn/Ag/Cu) | 8V~18V | QUAD | 鸥翼 | 18V | 0.5mm | ST7590 | Power Line Networking System-On-Chip | 13V | I2C, SPI | 1 | 35mA | 128 kbps | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE79114KVC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 128-TQFP | 128-TQFP | Tray | 活跃 | 3 (168 Hours) | 3.3V | PCM | 1 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE88286DLC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 80-LQFP | 80 | 80-eLQFP | Tray | 2001 | 活跃 | 3 (168 Hours) | 4.75V~35V | Telecom Circuit | PCM | 2 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9075BL1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 100-BQFP | 100-MQFP (14x20) | -40°C~85°C | Tray | 2001 | 活跃 | 1 (Unlimited) | 4.75V~5.25V | 收发器 | 1 | 150mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TP3420AV308 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 20-LCC (J-Lead) | YES | 20 | 70°C | Tube | e0 | no | Obsolete | 3 (168 Hours) | 20 | 5A991.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 4.75V~5.25V | QUAD | J BEND | 250 | 1 | 5V | 1.27mm | TP3420 | 20 | 5V | 5V | COMMERCIAL | ISDN | 192 kbps | 数码单反 | 0.0032A | CCITT I.430 | BASIC | S/T | 2.4V | 0.4V | 4.57mm | 8.89mm | 8.89mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||
| MT8889CSR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | -40°C~85°C | Tape & Reel (TR) | 2001 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 5V | 3.579MHz | DTMF 收发器 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | LE57D111BTC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) | Industrial grade | -40°C~85°C | Tray | 2011 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 4.75V~5.25V | Subscriber Line Interface Concept (SLIC) | 5V | 2 | 4.75V | 9mA | 9mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8486YSN-04 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-BBGA, FCBGA | 256-FCBGA (17x17) | Tray | 活跃 | 4 (72 Hours) | 1.2V | 收发器 | Serial | 1 | 10 Gbps | 1 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8658XHJ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 444-BGA Exposed Pad | 444 | 444-BGA (27x27) | Tray | 活跃 | 4 (72 Hours) | 90°C | 0°C | Ethernet | Ethernet | 1 | 1.25 Gbps | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE58QL021FJC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 44-PLCC (16.58x16.58) | Industrial grade | -40°C~85°C | Tube | 1993 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 3.3V | Subscriber Line Interface Concept (SLIC) | 3.3V | PCM | 4 | 3.135V | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC7427XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 672-BGA | YES | Tray | 2011 | SparX™-III-26 | 活跃 | 4 (72 Hours) | 672 | 1V | BOTTOM | BALL | 1V | S-PBGA-B672 | 以太网交换机 | OTHER | Serial | 1 | 1 Gbps | 电信电路 | 2.44mm | 27mm | 27mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3019-F-FT | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | 16 | 67.301768mg | 0°C~70°C | Tube | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 16 | Tin (Sn) | 3V~3.6V | DUAL | 鸥翼 | 260 | 0.65mm | 40 | SI3019 | Direct Access Arrangement (DAA) | 3.3V | 3.6V | 3V | GCI, PCM, SPI | 1 | 8.5mA | 8.5mA | 消费电路 | 5mm | 4.4mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
| LE89116QVC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | LQFP | 48-LQFP | 181.692094mg | Tray | 2010 | 活跃 | 3 (168 Hours) | 1 | PCM | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT88L70AN1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | 453.59237mg | -40°C~85°C | Tube | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 500mW | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 3.58MHz | 30 | DTMF接收器 | 3V | 3V | 1 | 2mA | 5.5mA | Receiver | DTMF信号电路 | 2mm | 7.2mm | 5.3mm | 无 | ROHS3 Compliant | 无铅 |