N/A

-

MPC8248

活跃

表面贴装

516-BBGA

516-FPBGA (27x27)

飞思卡尔半导体

Bulk

-40°C ~ 105°C (TA)

MPC82xx

300MHz

PowerPC G2_LE

3.3V

10/100Mbps (2)

1 Core, 32-Bit

无

DRAM, SDRAM

USB 2.0 (1)

I²C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM, Security; SEC

Cryptography, Random Number Generator

-

-

N/A

-

XPC8260

活跃

飞思卡尔半导体

Bulk

*

N/A

-

N/A

-

活跃

Renesas

Bulk

-

N/A

-

1

985837

Intel

Intel

Details

CPU - Central Processing Units

有

Tray

Embedded Processors & Controllers

CPU - Central Processing Units

N/A

-

表面贴装

256

Non-Compliant

266 MHz

1.2 V

N/A

-

Obsolete

Renesas

Bulk

*

N/A

-

活跃

表面贴装

128-LQFP

128-LQFP (14x14)

16KB

Nuvoton Technology Corporation

Tray

-40°C ~ 85°C (TA)

N9H30

300MHz

300MHz

ARM926EJ-S

3.3V

10/100Mbps (1)

1 Core, 32-Bit

有

DDR2, LVDDR, SDRAM

USB 2.0 (2)

CANbus, DMA, eMMC/SD/SDIO, GPIO, I²C, I²S, LINbus, SPI, UART/USART

-

AES, ECC, SHA, TRNG

LCD, Touchscreen

-

4

3~3.6V

N/A

-

表面贴装

Non-Compliant

233 MHz

1.2 V

N/A

-

活跃

表面贴装

515-WFBGA, FCBGA

515-POP-FCBGA (12x12)

德州仪器

Bulk

0°C ~ 90°C (TJ)

Sitara™

800MHz

ARM® Cortex®-A8

1.8V

-

1 Core, 32-Bit

无

SDRAM

USB 2.0 (4)

HDQ/1-Wire, I²C, McBSP, McSPI, MMC/SD/SDIO, UART

Multimedia; NEON™ SIMD

-

LCD

-

N/A

-

N/A

-

活跃

表面贴装

357-BBGA

357-PBGA (25x25)

飞思卡尔半导体

Bulk

-40°C ~ 95°C (TJ)

MPC86xx

50MHz

MPC8xx

3.3V

10Mbps (4), 10/100Mbps (1)

1 Core, 32-Bit

无

DRAM

-

HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

-

-

-

N/A

-

活跃

有

952

Renesas Electronics

Renesas Electronics

Details

时钟缓冲器

Renesas Electronics America Inc

Tray

Tray

*

Clock & Timer ICs

时钟缓冲器

N/A

-

活跃

有

126

Renesas Electronics

Renesas Electronics

Details

时钟缓冲器

表面贴装

841-FBGA

841-FBGA (15x15)

Renesas Electronics America Inc

Tray

-40°C ~ 125°C (TJ)

Tray

RZ/V2MA

Clock & Timer ICs

ARM® Cortex®-A53

1.8V, 3.3V

GbE (1)

2 Core, 64-Bit

无

LPDDR4

Multimedia; NEON™ SIMD

-

-

时钟缓冲器

N/A

-

Obsolete

表面贴装

516-BBGA Exposed Pad

516-TEPBGA (27x27)

飞思卡尔半导体

Tray

-40°C ~ 105°C (TA)

MPC83xx

333MHz

PowerPC e300c3

1.8V, 2.5V, 3.3V

10/100/1000Mbps (2)

1 Core, 32-Bit

无

DDR, DDR2

USB 2.0 + PHY (1)

DUART, HSSI, I²C, PCI, SPI

-

-

-

-

N/A

-

Obsolete

表面贴装

783-BBGA, FCBGA

783-FCBGA (29x29)

飞思卡尔半导体

Tray

-40°C ~ 105°C (TA)

MPC85xx

1.333GHz

PowerPC e500

1.8V, 2.5V, 3.3V

10/100/1000Mbps (4)

1 Core, 32-Bit

无

DDR, DDR2, SDRAM

-

DUART, I²C, PCI, RapidIO

Signal Processing; SPE, Security; SEC

Cryptography, Random Number Generator

-

-

N/A

-

Obsolete

表面贴装

457-LFBGA

457-LFBGA (14x14)

飞思卡尔半导体

Tray

0°C ~ 70°C (TA)

i.MX31

532MHz

ARM1136JF-S

1.8V, 2.0V, 2.5V, 2.7V, 3.0V

-

1 Core, 32-Bit

有

DDR

USB 2.0 (3)

1-Wire, AC97, ATA, FIR, I²C, I²S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART

Multimedia; GPU, IPU, MPEG-4, VFP

Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory

Keyboard, Keypad, LCD

-

N/A

-

活跃

飞思卡尔半导体

Bulk

*

N/A

-

活跃

表面贴装

624-FBGA, FCBGA

624-FCBGA (21x21)

飞思卡尔半导体

Bulk

-40°C ~ 125°C (TJ)

i.MX6

852MHz

ARM® Cortex®-A9

1.8V, 2.5V, 2.8V, 3.3V

10/100/1000Mbps (1)

2 Core, 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

SATA 3Gbps (1)

N/A

-

MPC5200

活跃

表面贴装

272-BBGA

272-PBGA (27x27)

飞思卡尔半导体

Bulk

0°C ~ 70°C (TA)

MPC52xx

400MHz

PowerPC G2_LE

2.5V, 3.3V

10/100Mbps (1)

1 Core, 32-Bit

无

DDR, SDRAM

USB 1.1 (2)

AC97, CAN, J1850, I²C, I²S, IrDA, PCI, PSC, SPI, UART

-

-

-

-

N/A

-

IN-LINE

CERAMIC, METAL-SEALED COFIRED

-55 °C

5 V

4.5 V

125 °C

HS1-80C86RH/PROTO

5 MHz

DIP

RECTANGULAR

Renesas Electronics Corporation

Obsolete

RENESAS ELECTRONICS CORP

5.5 V

5.58

NO

40

DIP,

3A001.A.2.C

8542.31.00.01

CMOS

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-CDIP-T40

不合格

MILITARY

5 MHz

MICROPROCESSOR

16

5.72 mm

20

NO

YES

16

固定点

NO

100k Rad(Si) V

15.24 mm

N/A

-

Obsolete

表面贴装

432-TFBGA

432-MAPBGA (13x13)

飞思卡尔半导体

Tray

-40°C ~ 105°C (TA)

i.MX6SL

1.0GHz

ARM® Cortex®-A9

1.2V, 1.8V, 3.0V

10/100Mbps (1)

1 Core, 32-Bit

有

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (3)

AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

-

N/A

-

-

14 MHz

65x

+ 85 C

- 40 C

30

SMD/SMT

Western Design Center (WDC)

Western Design Center (WDC)

Details

-

Microprocessors - MPU

QFP-44

有

Tube

Microprocessors - MPU

1.8 V to 5 V

8 bit/16 bit

1 Core

Microprocessors - MPU

N/A

-

活跃

通孔

40-DIP (0.600, 15.24mm)

40-PDIP

Harris Corporation

Bulk

-40°C ~ 85°C (TA)

-

5MHz

80C88

5V

-

1 Core, 16-Bit

无

-

-

-

-

-

-

-

N/A

-