类别是'时钟/计时 - 专用'
时钟/计时 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 应用 | 包装方式 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出量 | 引脚数量 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 负载电容 | 电源电流 | 功率耗散 | 最大电源电流 | uPs/uCs/外围ICs类型 | 传播延迟 | 静态电流 | 电源电流-最大值 | 接通延迟时间 | 逻辑功能 | 数据率 | 最大输入电压 | 输入 | 比率-输入:输出 | 逻辑IC类型 | 主时钟/晶体频率-名 | 锁相环 | 差分 - 输入:输出 | 通信IC类型 | 最大工作周期 | 主要目的 | 同边偏斜-最大(tskwd) | 占空比 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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![]() | SI5338M-B-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | YES | 24 | -40°C~85°C | Tray | 1997 | MultiSynth™ | 活跃 | 2 (1 Year) | 24 | EAR99 | 1.71V~3.63V | QUAD | 无铅 | 1.8V | 0.5mm | 200MHz | SI5338 | HCSL, HSTL, LVCMOS, LVDS, LVPECL, SSTL | 4 | 不合格 | 3.3V | 1 | 45mA | CLOCK GENERATOR, PROCESSOR SPECIFIC | 60mA | CML, CMOS, HCSL, HSCL, HSTL, LVDS, LVPECL, SSTL, Crystal | 2:4 | 30MHz | 有 | Yes/Yes | 55 % | Ethernet, Fibre Channel, PCI Express (PCIe), Telecom | 0.9mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SY87729LHY-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 2 | 表面贴装 | 表面贴装 | 32-TQFP Exposed Pad | 32 | 32-TQFP-EP (7x7) | 365MHz | -40°C~85°C | Tape & Reel (TR) | 2000 | AnyClock® | 活跃 | 3 (168 Hours) | 85°C | -40°C | 3.15V~3.45V | SY87729 | PECL | 3.3V | 1 | 3.45V | 3.15V | 275mA | PECL | 1:1 | 有 | Yes/Yes | Ethernet, Fibre Channel, SONET/SDH/ATM | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY2304NZZXI-1T | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold, Tin | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | -40°C~85°C | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | Matte Tin (Sn) | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 140MHz | 20 | CY2304 | LVCMOS | 8 | 4 | 3.3V | 3.6V | 3V | 1 | 5 ns | 25mA | 5 ns | LVCMOS, LVTTL | 1:4 | 低时序偏斜时钟驱动器 | 无 | No/No | 60 % | PCI Express (PCIe) | 60 % | 3mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | AD9523-1BCPZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1GHz | PRODUCTION (Last Updated: 3 months ago) | Tin | 表面贴装 | 72-VFQFN Exposed Pad, CSP | YES | 72 | 2 | -40°C~85°C | Tray | e3 | no | 活跃 | 3 (168 Hours) | 72 | EAR99 | 1.768V~3.465V | QUAD | 260 | 3.3V | 0.5mm | 3.1GHz | 40 | AD9523 | HSTL, LVCMOS, LVDS, LVPECL | 72 | 14 | 3.3V | I2C, SPI | 1 | 75.8mA | 75.8mA | CLOCK GENERATOR, OTHER | CMOS | 2:14 | 400MHz | 有 | Yes/Yes | Ethernet, Fibre Channel, SONET/SDH | 950μm | 10mm | 10mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | ZL30111QDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1 | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 64-TQFP | 64 | 64-TQFP (10x10) | 360.605934mg | 8.192MHz | -40°C~85°C | Tray | 2007 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 3.1V~3.5V | ZL30111 | Clock | 3.3V | 1 | 3.5V | 3.1V | 32mA | 47mA | Clock | 1:5 | 有 | No/No | 60 % | 差分多路复用 | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AD9577BCPZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 40-WFQFN Exposed Pad, CSP | YES | 40 | 637.5MHz | -40°C~85°C | Tray | e3 | no | 活跃 | 3 (168 Hours) | 40 | EAR99 | Matte Tin (Sn) | 3V~3.6V | QUAD | 260 | 3.3V | 0.5mm | 30 | AD9577 | LVCMOS, LVDS, LVPECL | 40 | 8 | 3.3V | 1 | 1μA | Clock | Clock, Crystal | 2:5 | 25MHz | 有 | No/Yes | Ethernet, PCI Express (PCIe), SONET/SDH | 750μm | 6.1mm | 6.1mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | ADN2816ACPZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PRODUCTION (Last Updated: 1 week ago) | 表面贴装 | 表面贴装 | 32-WFQFN Exposed Pad, CSP | 32 | -40°C~85°C | Tray | e3 | no | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | SONET;SDH | 366mW | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 675MHz | 40 | ADN2816 | LVDS | 32 | 2 | 3.3V | 1 | 111mA | 122mA | 366mW | 122mA | 675 Mbps | CML | 1:2 | 有 | Yes/Yes | SONET/SDH | 830μm | 5mm | 5mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||
![]() | ZL30145GGG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 64-BGA | 64 | 622.08MHz | -40°C~85°C | Tray | 活跃 | 1 (Unlimited) | ZL30145 | 1 | Clock | 1:3 | 有 | No/Yes | Ethernet, SONET/SDH, Telecom | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ADN2813ACPZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PRODUCTION (Last Updated: 1 week ago) | 表面贴装 | 表面贴装 | 32-WFQFN Exposed Pad, CSP | 32 | -40°C~85°C | Tray | e3 | no | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | SONET;SDH | 375mW | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 1.25GHz | 40 | ADN2813 | LVDS | 32 | 2 | 3.3V | 1 | 139mA | 375mW | 155mA | 1.25 Gbps | CML | 1:2 | 有 | Yes/Yes | SONET/SDH | 1mm | 5mm | 5mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||
![]() | AD9550BCPZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 1 month ago) | Tin | 表面贴装 | 32-WFQFN Exposed Pad, CSP | YES | 32 | -40°C~85°C | Tray | e3 | no | 活跃 | 3 (168 Hours) | 32 | EAR99 | SONET;SDH | 3.135V~3.465V | QUAD | 无铅 | 260 | 1 | 3.3V | 0.5mm | 810MHz | 30 | AD9550 | CMOS, LVDS, LVPECL | 32 | 2 | 不合格 | 3.3V | 1 | 185mA | 185mA | CMOS | 1:2 | 有 | No/Yes | ATM/SONET/SDH SUPPORT CIRCUIT | Ethernet, GPON, SONET/SHD, T1/E1 | 750μm | 5.1mm | 5.1mm | 无SVHC | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||
![]() | CY2304NZZXC-1T | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold, Tin | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | 0°C~70°C | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | Matte Tin (Sn) | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 140MHz | 20 | CY2304 | LVCMOS | 8 | 4 | 3.3V | 3.6V | 3V | 1 | 25mA | 5 ns | 25mA | 5 ns | LVCMOS, LVTTL | 1:4 | 低时序偏斜时钟驱动器 | 无 | No/No | 60 % | PCI Express (PCIe) | 60 % | 3mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
![]() | ZL30142GGG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 64-BGA | 64 | 622.08MHz | -40°C~85°C | Tray | 2001 | 活跃 | 3 (168 Hours) | 64 | BOTTOM | BALL | 1 | ZL30142 | 64 | 不合格 | 1 | Clock | 3:4 | 有 | No/Yes | ATM/SONET/SDH SUPPORT CIRCUIT | Ethernet, SONET/SDH, Stratum | 9mm | 9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LMK00338RTAR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 表面贴装 | 40-WFQFN Exposed Pad | 40 | 54.68623mg | -40°C~85°C | Tape & Reel (TR) | e3 | yes | 活跃 | 3 (168 Hours) | 40 | EAR99 | Matte Tin (Sn) | TR | 3.15V~3.45V | QUAD | 260 | 1 | 3.3V | 0.5mm | 400MHz | LMK00338 | HCSL, LVCMOS | 8 | 3.3V | 3.45V | 1 | 13.5mA | 5pF | 8.5mA | 2.7 ns | CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal | 3:9 | 低时序偏斜时钟驱动器 | 无 | Yes/Yes | 55 % | PCI Express (PCIe), SATA CPU | 0.05 ns | 800μm | 6mm | 6mm | 750μm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
![]() | SI5315B-C-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 36-VFQFN Exposed Pad | YES | 36 | 92.589543mg | -40°C~85°C | Tray | 2001 | DSPLL® | 活跃 | 2 (1 Year) | 36 | SONET;SDH | 1.71V~3.63V | QUAD | 260 | 1 | 1.8V | 0.5mm | 125MHz | 30 | SI5315 | CML, CMOS, LVDS, LVPECL | 36 | 1 | CML, CMOS, LVDS, LVPECL | 2:2 | 无 | Yes/Yes | ATM/SONET/SDH SWITCHING CIRCUIT | Ethernet, SONET/SDH/PDH, Telecom | 0.9mm | 6mm | 6mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ADN2805ACPZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-WFQFN Exposed Pad, CSP | 32 | -40°C~85°C | Tray | e3 | no | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 1.25GHz | 40 | ADN2805 | LVDS | 32 | 2 | 3.3V | 1 | 118mA | 390mW | 1.25 Gbps | CML | 1:2 | 有 | Yes/Yes | SONET/SDH | 5mm | 5mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | ZL30121GGG2V2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 100-FBGA | 100-CABGA (9x9) | 622.08MHz | -40°C~85°C | Tray | 2009 | 活跃 | 3 (168 Hours) | 2.97V~3.63V | ZL30121 | LVCMOS, LVPECL | 1 | LVCMOS | 11:12 | 有 | No/Yes | SONET/SDH, Stratum | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SY87729LHY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 2 | 表面贴装 | 表面贴装 | 32-TQFP Exposed Pad | 32 | 32-TQFP-EP (7x7) | 365MHz | -40°C~85°C | Tray | 2000 | AnyClock® | 活跃 | 3 (168 Hours) | 85°C | -40°C | 3.15V~3.45V | 365MHz | SY87729 | PECL | 3.3V | 1 | 3.45V | 3.15V | 275mA | 2.42V | PECL | 1:1 | 有 | Yes/Yes | Ethernet, Fibre Channel, SONET/SDH/ATM | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SY87700ALHG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 2 | Industrial grade | 表面贴装 | 表面贴装 | 32-TQFP Exposed Pad | 32 | 32-TQFP-EP (7x7) | 208Mbps | -40°C~85°C | Tray | 2009 | AnyRate® | 活跃 | 3 (168 Hours) | 85°C | -40°C | 3.15V~3.45V | 1.25GHz | SY87700 | PECL | 2 | 3.3V | 1 | 3.45V | 3.15V | 160mA | 160mA | 4V | PECL, TTL | 3:3 | 有 | Yes/Yes | Ethernet, SONET/SDH, ATM applications | 1mm | 7mm | 7mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI5315A-C-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 36-VFQFN Exposed Pad | YES | 36 | 92.589543mg | -40°C~85°C | Tray | 2001 | DSPLL® | 活跃 | 2 (1 Year) | 36 | SONET;SDH | 1.71V~3.63V | QUAD | 1 | 1.8V | 0.5mm | 644.53MHz | SI5315 | CML, CMOS, LVDS, LVPECL | 36 | 1 | CML, CMOS, LVDS, LVPECL | 2:2 | 无 | Yes/Yes | ATM/SONET/SDH SWITCHING CIRCUIT | Ethernet, SONET/SDH/PDH, Telecom | 0.9mm | 6mm | 6mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ADN2855ACPZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PRODUCTION (Last Updated: 3 months ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad, CSP | 32 | -40°C~85°C | Tray | e3 | no | 活跃 | 3 (168 Hours) | 32 | Integrated Circuit (IC) | Matte Tin (Sn) | 670mW | 3V~3.6V | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 200MHz | 30 | ADN2855 | LVDS | 32 | 13 | 不合格 | 3.3V | 1 | 204mA | 670mW | 1.25 Gbps | CML | 1:1 | 有 | Yes/Yes | GPON, BPON, GEPON | 5mm | 5mm | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | AD9524BCPZ-REEL7 | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 2 | PRODUCTION (Last Updated: 1 month ago) | Tin | 表面贴装 | 48-VFQFN Exposed Pad, CSP | YES | 48 | 1GHz | -40°C~85°C | Tape & Reel (TR) | e3 | no | 活跃 | 3 (168 Hours) | 48 | EAR99 | 1.71V~3.465V | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | AD9524 | HSTL, LVCMOS, LVDS, LVPECL | 48 | 14 | 3.3V | 1 | 77.7mA | CLOCK GENERATOR, OTHER | CMOS | 2:6 | 250MHz | 有 | Yes/Yes | Ethernet, Fibre Channel, SONET/SDH | 7mm | 7mm | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | ZL30160GGG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 100-LBGA | 100 | 100-LBGA (11x11) | 750MHz | -40°C~85°C | Tray | 2010 | 活跃 | 1 (Unlimited) | 85°C | -40°C | ZL30160 | HCSL, LVCMOS, LVDS, LVPECL | 4 | 1 | Clock | 4:20 | 有 | Yes/Yes | Ethernet, SONET/SDH | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ZL30122GGG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 64-BGA | 64 | 622.08MHz | -40°C~85°C | Tray | 2009 | e1 | 活跃 | 1 (Unlimited) | 64 | 锡银铜 | 2.97V~3.63V | BOTTOM | BALL | 1 | 1.8V | ZL30122 | LVCMOS, LVPECL | 64 | 1 | LVCMOS | 6:5 | 有 | No/Yes | ATM/SONET/SDH SUPPORT CIRCUIT | SONET/SDH, Telecom | 9mm | 9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI53154-A01AGM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 24-WFQFN Exposed Pad | YES | 24 | 210MHz | -40°C~85°C | Tray | 1997 | 活跃 | 2 (1 Year) | 24 | 3.135V~3.465V | QUAD | 1 | 3.3V | 0.5mm | 100MHz | SI53154 | 24 | 4 | 3.3V | 1 | 35mA | Clock | 1:4 | 无 | Yes/Yes | PCI Express (PCIe) | 750μm | 4mm | 4mm | Unknown | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ZL30321GGG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 100-FBGA | 100 | 125MHz | -40°C~85°C | Tray | e1 | yes | 活跃 | 1 (Unlimited) | 100 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 | 1.8V | 0.8mm | 未说明 | ZL30321 | 100 | 不合格 | 1 | LVCMOS | 11:9 | 有 | No/No | ATM/SONET/SDH NETWORK INTERFACE | Ethernet, SONET/SDH/PDH, Telecom | 9mm | 9mm | ROHS3 Compliant |