类别是'IC、晶体管插座 - 适配器'
IC、晶体管插座 - 适配器 (370)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 房屋材料 | 质量 | 本体材质 | 触点材料 - 配套 | 触点材料 - 柱子 | 板材 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | ECCN 代码 | 定位的数量 | 最高工作温度 | 最小工作温度 | 行数 | 性别 | 附加功能 | 额定电流 | 螺距 | 方向 | 深度 | 额定电流 | 间距 - 配套 | 螺纹距离 | 接头数量 | 触点表面处理 - 柱子 | 引线长度 | 绝缘电阻 | 行间距 | 电缆长度 | 感应距离 | 设备插座类型 | 端子柱长度 | 间距--柱子 | 转换自(适配器端) | 转换(适配器端) | 特征 | 高度 | 长度 | 宽度 | 触点表面处理厚度 - 配套 | 触点表面处理厚度 - 柱子 | 材料可燃性等级 | 达到SVHC | RoHS状态 | 可燃性等级 | 无铅 | |||
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![]() | 32-450001-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 32 | Brass | FR4 Epoxy Glass | Gold | 2007 | Correct-A-Chip® 450001 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.050 1.27mm | 32 | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOJ | DIP, 0.4 (10.16mm) Row Spacing | 1.58mm | 40.6mm | 10.0μin 0.25μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
![]() | 232-1285-19-0602J | 3M | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Copper | 1A | Gold | Wire | 通孔 | 32 | Polysulfone (PSU), Glass Filled | 453.59237g | 铍铜 | 铍铜 | Gold | -55°C~125°C | 2011 | Textool™ | 活跃 | 1 (Unlimited) | Wire Wrap | 32 | 150°C | -55°C | Female | 2.54mm | 1A | 0.100 2.54mm | 32 | Gold | 1GOhm | 0.620 15.75mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 封闭框架 | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||
![]() | 28-450001-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 28 | Brass | FR4 Epoxy Glass | Gold | 2009 | Correct-A-Chip® 450001 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.050 1.27mm | 28 | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOJ | DIP, 0.4 (10.16mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
![]() | 16-304235-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 16 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | FR4 Epoxy Glass | Gold | 105°C | 2009 | Correct-A-Chip® 304235 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 1A | 16 | Tin-Lead | IC SOCKET | 0.125 3.18mm | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 包括插座 | 10.0μin 0.25μm | 200.0μin 5.08μm | UL94 V-0 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | 228-1277-19-0602J | 3M | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Copper | 1A | Gold | Through Hole, Wire | 通孔 | 28 | Polysulfone (PSU), Glass Filled | 453.59237g | 铍铜 | 铍铜 | Gold | -55°C~125°C | 2011 | Textool™ | 活跃 | 1 (Unlimited) | Solder | 28 | 150°C | -55°C | Female | 2.54mm | 32mm | 1A | 0.100 2.54mm | 28 | Gold | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 50.3mm | 6.9mm | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||
![]() | 224-1275-29-0602J | 3M | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Copper | 1A | Gold | 通孔 | 通孔 | 24 | Polysulfone (PSU), Glass Filled | 453.59237g | 铍铜 | 铍铜 | Gold | -55°C~125°C | 2011 | Textool™ | 活跃 | 1 (Unlimited) | Solder | 24 | 150°C | -55°C | Female | 2.54mm | 1A | 0.100 2.54mm | 24 | Gold | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 封闭框架 | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||||||||||||
![]() | 16-35W000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | SOIC | 16 | Brass | FR4 Epoxy Glass | 2008 | Correct-A-Chip® 35W000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.050 1.27mm | 16 | Gold | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
![]() | 1109523 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | TO-8 | 8 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | FR4 Epoxy Glass | Gold | 2007 | Correct-A-Chip® 1109523 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 1A | 0.100 2.54mm | 8 | Tin-Lead | IC SOCKET | 0.125 3.18mm | DIP, 0.3 (7.62mm) Row Spacing | JEDEC | 包括插座 | 5.85mm | 10.2mm | 10.0μin 0.25μm | 200.0μin 5.08μm | UL94 V-0 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||
![]() | 1109342 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | 44 | Polyphenylene Sulfide (PPS) | 磷青铜 | Brass | FR4 Epoxy Glass | Tin | 105°C | 2017 | Correct-A-Chip® 1109342 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | SOCKET ADAPTER, 94V-0 | 2.54mm | 2.54mm | 40 | Tin-Lead | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.6 (15.24mm) Row Spacing | 150.0μin 3.81μm | 200.0μin 5.08μm | UL94 V-0 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||
![]() | 08-354000-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 8 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 105°C | 2006 | Correct-A-Chip® 354000 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 2 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 8 | 7.62 mm | IC SOCKET | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 200.0μin 5.08μm | UL94 V-0 | Non-RoHS Compliant | UL94 V-0 | |||||||||||||||||||||||||||||||
![]() | 16-304633-18 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | 16 | Brass | FR4 Epoxy Glass | 105°C | 2009 | Correct-A-Chip® 304633 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.050 1.27mm | 16 | Tin-Lead | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.3 (7.62mm) Row Spacing | 200.0μin 5.08μm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
![]() | 16-354000-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 16 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 105°C | 2012 | Correct-A-Chip® 354000 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 2 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 16 | 7.62 mm | IC SOCKET | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | Non-RoHS Compliant | UL94 V-0 | |||||||||||||||||||||||||||||||
![]() | 240-3639-19-0602J | 3M | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Copper | 1kV | 1A | Gold | Through Hole, Wire | 通孔 | 40 | Polysulfone (PSU), Glass Filled | Glass, Polysulfone | 铍铜 | 铍铜 | Gold | -55°C~125°C | 2001 | Textool™ | 活跃 | 1 (Unlimited) | Wire Wrap | 40 | 150°C | -55°C | Female | 2.54mm | Straight | 6.9mm | 1A | 0.100 2.54mm | 40 | Gold | 3m | 25.4 mm | 3m | 3 m | 0.620 15.75mm | 0.100 2.54mm | DIP, 1.0 (25.40mm) Row Spacing | DIP, 1.0 (25.40mm) Row Spacing | 封闭框架 | 65.5mm | 42.2mm | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||
![]() | 32-655000-10-P | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 32 | Copper | Brass | FR4 Epoxy Glass | Silver | 2006 | Correct-A-Chip® 655000 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 0.020 0.50mm | Tin-Lead | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | TSOP | DIP, 0.6 (15.24mm) Row Spacing | 200.0μin 5.08μm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
![]() | 20-353000-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Lead, Tin | 通孔 | 通孔 | 20 | RYTON | 磷青铜 | Brass | FR4 Epoxy Glass | Tin-Lead | 2006 | Correct-A-Chip® 353000 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 1A | 0.050 1.27mm | 20 | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.3 (7.62mm) Row Spacing | 包括插座 | 200.0μin 5.08μm | UL94 V-0 | Non-RoHS Compliant | UL94 V-0 | |||||||||||||||||||||||||||||||
![]() | 32-652000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 32 | Brass | FR4 Epoxy Glass | 2012 | Correct-A-Chip® 652000 | e4 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | UL 94V-0 | 1A | 0.050 1.27mm | 32 | Gold | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.6 (15.24mm) Row Spacing | 10.0μin 0.25μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
![]() | 16-35W000-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 16 | Brass | FR4 Epoxy Glass | 2003 | Correct-A-Chip® 35W000 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 0.050 1.27mm | 16 | Tin-Lead | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | 1.58mm | 20.3mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
![]() | 24-350000-10-HT | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 通孔 | 通孔 | 24 | POLYAMIDE | Brass | Polyimide (PI) | Tin | 2005 | Correct-A-Chip® 350000 | e0 | no | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.050 1.27mm | 24 | Tin-Lead | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | 高温 | 200.0μin 5.08μm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | 16-354W00-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 16 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 105°C | 2005 | Correct-A-Chip® 354W00 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 16 | Tin-Lead | IC SOCKET | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 1.58mm | 20.3mm | 10.0μin 0.25μm | 200.0μin 5.08μm | UL94 V-0 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
![]() | 24-354W00-20 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 24 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 105°C | 2005 | Correct-A-Chip® 354W00 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 24 | Tin-Lead | IC SOCKET | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | 200.0μin 5.08μm | UL94 V-0 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
![]() | 16-354W00-20 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 16 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 105°C | 2005 | Correct-A-Chip® 354W00 | e0 | 活跃 | 1 (Unlimited) | Solder | EAR99 | STANDARD: UL 94V-0 | 3A | 0.100 2.54mm | 16 | Tin-Lead | IC SOCKET | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | 200.0μin 5.08μm | UL94 V-0 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
![]() | 44-647-10 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 44 | 铍铜 | 磷青铜 | Gold | Bulk | 2002 | 647 | e4 | 活跃 | 1 (Unlimited) | Solder | EAR99 | UL 94V-0 | 3A | 44 | Tin | IC SOCKET | 0.180 4.57mm | SOIC | DIP, 0.6 (15.24mm) Row Spacing | 2.39mm | 69.9mm | 10.0μin 0.25μm | 200.0μin 5.08μm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||
![]() | 20-350000-10-HT | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | 通孔 | 20 | POLYAMIDE | Brass | Polyimide (PI) | Tin | 2005 | Correct-A-Chip® 350000 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 插座适配器 | 0.050 1.27mm | 20 | Tin-Lead | 3.175mm | IC SOCKET | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | 高温 | 200.0μin 5.08μm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | LCQT-QFP0.8-80 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | QFP | 80 | Polyester | Brass | FR4 Epoxy Glass | -55°C~125°C | Correct-A-Chip® | 活跃 | 1 (Unlimited) | Solder | 125°C | -55°C | 0.031 0.80mm | Gold | 5.9944mm | 0.236 6.00mm | 0.100 2.54mm | 多种包装 | QFP | Flash | UL94 V-0 | 无SVHC | Non-RoHS Compliant | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||||
![]() | 18-354000-11-RC | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 3A | Gold | 表面贴装 | 表面贴装 | 18 | Polyamide (PA46), Nylon 4/6, Glass Filled | 铍铜 | Brass | Gold | 2009 | Correct-A-Chip® 354000 | 活跃 | 1 (Unlimited) | Solder | 3A | 0.100 2.54mm | Gold | 762μm | 0.030 0.76mm | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | 10.0μin 0.25μm | UL94 V-0 | ROHS3 Compliant | UL94 V-0 |