类别是'存储器 - 用于 FPGA 的配置 PROM'
存储器 - 用于 FPGA 的配置 PROM (1097)
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 | XCF01SVO20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | -40°C~85°C | Tray | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | 3V~3.6V | DUAL | 鸥翼 | 225 | 1 | 3.3V | 0.65mm | 30 | XCF*S | 20 | 3.3V | 3.6V | 1.8/3.33V | 3V | 系统内可编程 | 1Mb | 1MX1 | 1 | 0.001A | 1048576 bit | SERIAL | 配置存储器 | 20 | 1.19mm | 6.5024mm | 4.4mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||
 | XC17S100AVO8C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | 0°C~70°C | Tube | 1999 | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | 3V~3.6V | DUAL | 鸥翼 | 225 | 1 | 3.3V | 1.27mm | 30 | XC17S100A | 8 | 3.3V | 3.6V | 3V | OTP | 3-STATE | 1 | 1 Mb | 0.001A | SERIAL | COMMON | 配置存储器 | 1.2mm | 4.9mm | 3.9mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
| EPCS16SI8N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | FLASH | -40°C~85°C | Tube | 2010 | EPCS | e4 | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.B.1 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 1.27mm | compliant | 40MHz | 30 | EPCS16 | R-PDSO-G8 | 不合格 | 3.6V | 3.3V | 3V | 系统内可编程 | 16Mb | SYNCHRONOUS | 0.015mA | 16MX1 | 1 | 16777216 bit | SERIAL | 100000 Write/Erase Cycles | 135°C | 85°C | 1.75mm | 4.9mm | 3.9mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| XCF02SVOG20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20 | XCF02SVOG20C | FLASH | -40°C~85°C | Tube | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 50MHz | 30 | XCF*S | 20 | 不合格 | 3.3V | 3.6V | 3V | 系统内可编程 | Parallel | 2Mb | SYNCHRONOUS | 2MX1 | 0.001A | SERIAL | 20 | 125°C | 85°C | 1.19mm | 6.5mm | 4.39mm | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | AT17LV512A-10JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 20-LCC (J-Lead) | 20 | 722.005655mg | EEPROM | -40°C~85°C | Tube | 1997 | e3 | yes | 活跃 | 2 (1 Year) | 20 | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | J BEND | 245 | 1 | 3.3V | 1.27mm | 33MHz | 40 | AT17LV512A | 3.6V | 3.3V | 3V | 串行EEPROM | 2-Wire, Serial | 5mA | 10mA | 512KX1 | 1 | 512 kb | 0.0002A | 100000 Write/Erase Cycles | 90 | HARDWARE | YES | 4.572mm | 8.9662mm | 8.9662mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
| XCF04SVO20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | -40°C~85°C | Tube | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | 3V~3.6V | DUAL | 鸥翼 | 225 | 1 | 3.3V | 0.65mm | 30 | XCF*S | 20 | 3.3V | 3.6V | 3V | 系统内可编程 | 4Mb | 33MHz | 4MX1 | 1 | 0.001A | 4194304 bit | SERIAL | 配置存储器 | 1.19mm | 6.5024mm | 4.4mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||
 | XCF32PFSG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA, CSPBGA | 48 | FLASH, PROM | -40°C~85°C | Tray | 1999 | e2 | yes | 活跃 | 3 (168 Hours) | 48 | SMD/SMT | EAR99 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | 8542.32.00.51 | 1.65V~2V | BOTTOM | BALL | 260 | 1 | 1.8V | 30 | XCF*P | 48 | 不合格 | 2V | 1.5/3.31.8V | 1.65V | 系统内可编程 | Parallel, Serial | 32Mb | SYNCHRONOUS | 32MX1 | 33554432 bit | 20000 Write/Erase Cycles | 20 | 860μm | 9mm | 8mm | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| XCF08PFSG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA, CSPBGA | 48 | FLASH | -40°C~85°C | Tray | 1999 | e2 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | 8542.32.00.51 | 1.65V~2V | BOTTOM | BALL | 260 | 1 | 1.8V | 50MHz | 30 | XCF*P | 48 | 1.8V | 2V | 1.65V | 系统内可编程 | Parallel, Serial | 8Mb | 8MX1 | 0.001A | 8388608 bit | 20000 Write/Erase Cycles | 860μm | 9mm | 8mm | 无 | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | XCF08PVOG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | FLASH | -40°C~85°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 1.65V~2V | DUAL | 鸥翼 | 260 | 1 | 1.8V | 0.5mm | 50MHz | 30 | XCF*P | 48 | 1.8V | 2V | 1.65V | 系统内可编程 | Parallel | 8Mb | 8MX1 | 0.001A | 8388608 bit | SERIAL | 20000 Write/Erase Cycles | 85°C | 1.2mm | 12.1mm | 18.5mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
| EPCS4SI8N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | -40°C~85°C | Tube | 2010 | EPCS | e4 | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.B.1 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 1.27mm | compliant | 30 | EPCS4 | R-PDSO-G8 | 不合格 | 3.6V | 3.3V | 3V | 系统内可编程 | 4MB | SYNCHRONOUS | 20MHz | 0.015mA | 4MX1 | 1 | 0.00005A | 4194304 bit | SERIAL | 配置存储器 | 100000 Write/Erase Cycles | 1.75mm | 4.9mm | 3.9mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | XC18V04VQG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TQFP | 44 | 0°C~70°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 3V~3.6V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.8mm | 30 | XC18V04 | 44 | 不合格 | 3.3V | 3.6V | 3V | 系统内可编程 | Parallel, Serial | SYNCHRONOUS | 20MHz | 10 ns | 512KX8 | 4 Mb | 0.01A | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 1mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | AT17LV256-10PU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 930.006106mg | EEPROM | -40°C~85°C | Tube | 1997 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 3V~3.6V 4.5V~5.5V | DUAL | 1 | 3.3V | 2.54mm | 12.5MHz | AT17LV256 | 3.6V | 3.3V | 3V | 串行EEPROM | 2-Wire | 256Kb | 10mA | 10mA | 256KX1 | 256 kb | 0.00015A | 100000 Write/Erase Cycles | 90 | HARDWARE | 5.334mm | 10.16mm | 7.11mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| XCF04SVOG20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20 | FLASH | -40°C~85°C | Tube | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 30 | XCF*S | 20 | 3.3V | 3.6V | 3V | 系统内可编程 | Parallel, Serial | 4Mb | 33MHz | 4MX1 | 0.001A | 4194304 bit | 20 | 1.04mm | 6.5mm | 4.39mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
| XC18V01VQ44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 44-TQFP | YES | 44 | 0°C~70°C | Tray | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 44 | EAR99 | Tin/Lead (Sn85Pb15) | 3V~3.6V | QUAD | 鸥翼 | 225 | 1 | 3.3V | 0.8mm | 30 | XC18V01 | 44 | 3.3V | 3.6V | 3V | 系统内可编程 | 33MHz | 128KX8 | 8 | 1 Mb | 0.01A | 15 ns | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 1.2mm | 10mm | 10mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||
| XCF16PVOG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | FLASH | -40°C~85°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 1.65V~2V | DUAL | 鸥翼 | 260 | 1 | 1.8V | 0.5mm | 50MHz | 30 | XCF*P | 48 | 1.8V | 2V | 1.65V | 系统内可编程 | Parallel | 16Mb | 16MX1 | 1 | 16777216 bit | SERIAL | 20000 Write/Erase Cycles | 20 | 125°C | 85°C | 1.2mm | 18.45mm | 12mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
| XCF32PVOG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | -40°C~85°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1 | Matte Tin (Sn) | 8542.32.00.61 | 1.65V~2V | DUAL | 鸥翼 | 260 | 1 | 1.8V | 0.5mm | 30 | XCF*P | 48 | 1.8V | 2V | 1.65V | 系统内可编程 | 32Mb | 32MX1 | 0.001A | 33554432 bit | SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 1mm | 12.1mm | 18.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | AT17LV002-10TQU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 44-TQFP | 44 | EEPROM | -40°C~85°C | Tray | 1997 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.8mm | 15MHz | 40 | AT17LV002 | 不合格 | 3.6V | 3.3/5V | 3V | 串行EEPROM | 2-Wire, Serial | 10mA | SYNCHRONOUS | 2MX1 | 1 | 2 Mb | 0.00035A | 100000 Write/Erase Cycles | 90 | HARDWARE | 1.2mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| XCF16PFSG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA, CSPBGA | 48 | FLASH | -40°C~85°C | Tray | 1999 | e2 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | 8542.32.00.51 | 1.65V~2V | BOTTOM | BALL | 260 | 1 | 1.8V | 50MHz | 30 | XCF*P | 48 | 不合格 | 1.8V | 2V | 1.65V | 系统内可编程 | Parallel, Serial | 16Mb | SYNCHRONOUS | 16MX1 | 16777216 bit | 20000 Write/Erase Cycles | 20 | 860μm | 9mm | 8mm | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | EPC2TI32N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-TQFP | YES | FLASH | -40°C~85°C | Tray | 2016 | EPC | e3 | Obsolete | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | IT CAN ALSO OPERATE AT 5V SUPPLY | 8542.32.00.51 | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.8mm | compliant | 10MHz | 30 | EPC2 | S-PQFP-G32 | 不合格 | 3.6V | 3.3/5V | 3V | 系统内可编程 | 1.6Mb | 18mA | SYNCHRONOUS | 20 ns | 1695680X1 | 1 | 0.0001A | 1695680 bit | SERIAL | 135°C | 85°C | 1.2mm | 7mm | 7mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
 | EPCS1SI8N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | -40°C~85°C | Tube | 2010 | EPCS | e4 | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.B.1 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 1.27mm | compliant | 30 | EPCS1 | R-PDSO-G8 | 不合格 | 3.6V | 3.3V | 3V | 系统内可编程 | 1Mb | SYNCHRONOUS | 20MHz | 1MX1 | 1 | 0.00005A | 1048576 bit | SERIAL | 配置存储器 | 100000 Write/Erase Cycles | 1.75mm | 4.9mm | 3.9mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
 | XCF128XFTG64C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 64-TBGA | YES | 64 | FLASH | -40°C~85°C | Tray | 2005 | e1 | 活跃 | 3 (168 Hours) | 64 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.7V~2V | BOTTOM | BALL | 260 | 1 | 1.8V | 1mm | 50MHz | 30 | XCF128X | 64 | 2V | 1.81.8/3.3V | 1.7V | 系统内可编程 | 128Mb | 85 ns | 8MX16 | 16 | 0.000075A | 134217728 bit | PARALLEL | 1.8V | NO | NO | YES | 4127 | 4words | YES | YES | 1.2mm | 13mm | 10mm | 无 | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | XC18V04PCG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 0°C~70°C | Tray | 1998 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 3V~3.6V | QUAD | J BEND | 245 | 1 | 3.3V | 1.27mm | 30 | XC18V04 | 44 | 不合格 | 3.3V | 3.6V | 3V | 系统内可编程 | Parallel, Serial | SYNCHRONOUS | 20MHz | 10 ns | 512KX8 | 4 Mb | 0.01A | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 3.68mm | 16.66mm | 16.66mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | AT17LV256-10NU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | EEPROM | -40°C~85°C | Tube | 1997 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 3V~3.6V 4.5V~5.5V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 1.27mm | 33MHz | 40 | AT17LV256 | 5V | 3.6V | 3.3V | 3V | 串行EEPROM | 2-Wire, Serial | 256Kb | 10mA | 10mA | 256KX1 | 256 kb | 0.00015A | 100000 Write/Erase Cycles | 90 | HARDWARE | 1.5mm | 5mm | 3.99mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
| AT17LV010-10JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 20-LCC (J-Lead) | 20 | 722.005655mg | EEPROM | -40°C~85°C | Tube | 1997 | e3 | yes | 活跃 | 2 (1 Year) | 20 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 3V~3.6V | QUAD | J BEND | 1 | 3.3V | 1.27mm | 10MHz | AT17LV010 | 5V | 串行EEPROM | 5V | 2-Wire, Serial | 10mA | 10mA | 1MX1 | 1 Mb | 0.0002A | 100000 Write/Erase Cycles | 90 | HARDWARE | 3.68mm | 9.04mm | 9.04mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
| AT17LV256-10JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 20-LCC (J-Lead) | 20 | 722.005655mg | EEPROM | -40°C~85°C | Tube | 1997 | e3 | yes | 活跃 | 2 (1 Year) | 20 | Matte Tin (Sn) | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 3V~3.6V 4.5V~5.5V | QUAD | J BEND | 1 | 3.3V | 1.27mm | 10MHz | AT17LV256 | 3.6V | 3.3V | 3V | 串行EEPROM | 2-Wire, Serial | 256Kb | 10mA | 10mA | 256KX1 | 256 kb | 0.00015A | 80 ns | 100000 Write/Erase Cycles | 90 | HARDWARE | 3.68mm | 9.04mm | 9.04mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 |