类别是'嵌入式 - 片上系统（SoC）'
嵌入式 - 片上系统（SoC） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 时钟频率 | 程序内存大小 | 传播延迟 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 核心架构 | 阀门数量 | 边界扫描 | 速度等级 | 收发器数量 | 内存(字) | 主要属性 | 寄存器数量 | 逻辑块数量 | 逻辑单元数 | 核数量 | 总线兼容性 | 等效门数 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | ||||||||||||||||||||||||||||||||||||||||
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.png) | M2S060T-1FCSG325 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 176 | SmartFusion2 | 200 | Tray | M2S060 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S060T-1FCSG325 | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.82 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||
| A2F200M3F-1FG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 100 MHz | - | - | 64 kB | 2000 LE | 161 I/O | - 40 C | + 100 C | 有 | - | 60 | SmartFusion | Tray | A2F200 | 活跃 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | N | -40°C ~ 100°C (TJ) | Tray | A2F200 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-1CS288 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 100 MHz | - | - | 64 kB | 6000 LE | 有 | - | 176 | SmartFusion | MCU - 31, FPGA - 78 | Tray | A2F500 | 活跃 | TFBGA, BGA288,21X21,20 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA288,21X21,20 | 1.5 V | 未说明 | 1.425 V | 85 °C | 无 | A2F500M3G-1CS288 | 100 MHz | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | A2F500 | e0 | 锡铅银 | 8542.39.00.01 | CMOS | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B288 | 78 | 不合格 | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 1.05 mm | 现场可编程门阵列 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||
| M2S025-1VF400 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 90 | 1.2000 V | 1.14 V | 1.26 V | 207 | Tray | M2S025 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S025-1VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
| M2S050-1FGG896 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 27 | 377 | Tray | M2S050 | 活跃 | FBGA-896 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S050-1FGG896 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.26 | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 377 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| M2S060TS-1FGG676I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 40 | SmartFusion2 | 387 | Tray | M2S060 | 活跃 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025TS-1FCS325I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | 180 | Tray | M2S025 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 无 | M2S025TS-1FCS325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| M2S025TS-FCS325I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | 180 | Tray | M2S025 | 活跃 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090TS-1FCS325 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 kB | - | 166 MHz | SMD/SMT | N | This product may require additional documentation to export from the United States. | 86316 LE | 有 | 7193 LAB | 176 | 180 | Tray | M2S090 | 活跃 | TFBGA, BGA325,21X21,20 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S090TS-1FCS325 | TFBGA | RECTANGULAR | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | 微芯片技术 | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | R-PBGA-B325 | 180 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||
 | XCZU2EG-1SBVA484E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 484-BFBGA, FCBGA | 82 | 0°C~100°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060TS-FG676I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 40 | SmartFusion2 | 387 | Tray | M2S060 | 活跃 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 5CSXFC5D6F31C7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5CSXFC5 | S-PBGA-B896 | 288 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | 2mm | 31mm | 31mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-1FBVB900I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z012S-1CLG485I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 484-LFBGA, CSPBGA | YES | 150 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | 活跃 | 3 (168 Hours) | 485 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 未说明 | S-PBGA-B485 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 55K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 10AS066K3F35E2SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 396 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 5CSEBA5U19I7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | 活跃 | 3 (168 Hours) | 484 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 40 | 5CSEBA5 | S-PBGA-B484 | 66 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | 1.9mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSEMA5F31C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5CSEMA5 | S-PBGA-B896 | 288 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | 2mm | 31mm | 31mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 5CSEBA4U23I7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | 活跃 | 3 (168 Hours) | 672 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 未说明 | 5CSEBA4 | S-PBGA-B672 | 145 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 现场可编程门阵列 | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XCZU6CG-1FFVC900E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSEBA2U19C7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 0.8mm | 未说明 | S-PBGA-B484 | 66 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 现场可编程门阵列 | FPGA - 25K Logic Elements | 25000 | 1.9mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU27DR-2FFVG1517I5180 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 597 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | FBGA-1517 | SMD/SMT | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z030-L2SBG485I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 484-FBGA, FCBGA | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | 活跃 | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 800MHz | 未说明 | S-PBGA-B485 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | 157200 | CAN; ETHERNET; I2C; SPI; UART; USB | 2.44mm | 19mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025TS-VFG400I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 90 | 207 | Tray | M2S025 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 1.14 V | 有 | M2S025TS-VFG400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| M2S050TS-1FCS325 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 176 | 200 | Tray | M2S050 | 活跃 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025TS-FCS325 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | 180 | Tray | M2S025 | 活跃 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB |