你好!请登入 免费注册

我的订单 我的询价 0755-82520436 3307104213

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

工厂交货时间

生命周期状态

触点镀层

底架

包装/外壳

表面安装

供应商器件包装

终端数量

厂商

操作温度

包装

已出版

系列

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

附加功能

HTS代码

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

电源电压

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

基本部件号

JESD-30代码

输出的数量

资历状况

工作电源电压

电源电压-最大值(Vsup)

电源

温度等级

电源电压-最小值(Vsup)

界面

最大电源电压

最小电源电压

工作电源电流

速度

内存大小

核心处理器

周边设备

时钟频率

程序内存大小

传播延迟

连接方式

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

核心架构

阀门数量

边界扫描

速度等级

收发器数量

内存(字)

主要属性

寄存器数量

逻辑块数量

逻辑单元数

核数量

总线兼容性

等效门数

闪光大小

座位高度(最大)

长度

宽度

RoHS状态

M2S060T-1FCSG325 M2S060T-1FCSG325

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

166 MHz

-

-

64 kB

56520 LE

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

M2S060T-1FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.82

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

A2F200M3F-1FG484I A2F200M3F-1FG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

100 MHz

-

-

64 kB

2000 LE

161 I/O

- 40 C

+ 100 C

-

60

SmartFusion

Tray

A2F200

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

N

-40°C ~ 100°C (TJ)

Tray

A2F200

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

1 Core

256KB

A2F500M3G-1CS288 A2F500M3G-1CS288

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

100 MHz

-

-

64 kB

6000 LE

-

176

SmartFusion

MCU - 31, FPGA - 78

Tray

A2F500

活跃

TFBGA, BGA288,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA288,21X21,20

1.5 V

未说明

1.425 V

85 °C

A2F500M3G-1CS288

100 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

A2F500

e0

锡铅银

8542.39.00.01

CMOS

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

11520 CLBS, 500000 GATES

1.05 mm

现场可编程门阵列

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

11 mm

11 mm

M2S025-1VF400 M2S025-1VF400

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

90

1.2000 V

1.14 V

1.26 V

207

Tray

M2S025

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

M2S025-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

M2S050-1FGG896 M2S050-1FGG896

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

27

377

Tray

M2S050

活跃

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

85 °C

M2S050-1FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.26

FPBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

M2S060TS-1FGG676I M2S060TS-1FGG676I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

166 MHz

-

-

64 kB

56520 LE

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

Production (Last Updated: 2 months ago)

676-BGA

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S025TS-1FCS325I M2S025TS-1FCS325I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

180

Tray

M2S025

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

M2S025TS-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S025TS-FCS325I M2S025TS-FCS325I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

180

Tray

M2S025

活跃

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S090TS-1FCS325 M2S090TS-1FCS325

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

64 kB

-

166 MHz

SMD/SMT

N

This product may require additional documentation to export from the United States.

86316 LE

7193 LAB

176

180

Tray

M2S090

活跃

TFBGA, BGA325,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

M2S090TS-1FCS325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.84

FCBGA-325

YES

325-FCBGA (11x13.5)

325

微芯片技术

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

XCZU2EG-1SBVA484E XCZU2EG-1SBVA484E

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

484-BFBGA, FCBGA

82

0°C~100°C TJ

Tray

Zynq® UltraScale+™ MPSoC EG

活跃

4 (72 Hours)

8542.31.00.01

未说明

未说明

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

ROHS3 Compliant

M2S060TS-FG676I M2S060TS-FG676I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

676-BGA

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

5CSXFC5D6F31C7N 5CSXFC5D6F31C7N

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

8 Weeks

896-BGA

YES

MCU - 181, FPGA - 288

0°C~85°C TJ

Tray

2018

Cyclone® V SX

e1

活跃

3 (168 Hours)

896

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5CSXFC5

S-PBGA-B896

288

不合格

1.13V

1.11.2/3.32.5V

1.07V

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

现场可编程门阵列

FPGA - 85K Logic Elements

85000

2mm

31mm

31mm

符合RoHS标准

XCZU4CG-1FBVB900I XCZU4CG-1FBVB900I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

900-BBGA, FCBGA

204

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC CG

活跃

4 (72 Hours)

8542.31.00.01

未说明

未说明

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

ROHS3 Compliant

XC7Z012S-1CLG485I XC7Z012S-1CLG485I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

484-LFBGA, CSPBGA

YES

150

-40°C~100°C TJ

Tray

2016

Zynq®-7000

e3

yes

活跃

3 (168 Hours)

485

Matte Tin (Sn)

8542.31.00.01

BOTTOM

BALL

未说明

1V

0.8mm

未说明

S-PBGA-B485

1.05V

0.95V

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

667MHz

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

YES

256000

Artix™-7 FPGA, 55K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

1.6mm

19mm

19mm

ROHS3 Compliant

10AS066K3F35E2SG 10AS066K3F35E2SG

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

8 Weeks

1152-BBGA, FCBGA

YES

396

0°C~100°C TJ

Tray

Arria 10 SX

活跃

3 (168 Hours)

8542.39.00.01

BOTTOM

BALL

未说明

0.9V

1mm

未说明

S-PBGA-B1152

396

不合格

0.93V

0.9V

0.87V

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

现场可编程门阵列

FPGA - 660K Logic Elements

660000

3.5mm

35mm

35mm

符合RoHS标准

5CSEBA5U19I7N 5CSEBA5U19I7N

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

8 Weeks

484-FBGA

YES

MCU - 151, FPGA - 66

-40°C~100°C TJ

Tray

2018

Cyclone® V SE

e1

活跃

3 (168 Hours)

484

锡银铜

8542.39.00.01

BOTTOM

BALL

260

1.1V

0.8mm

40

5CSEBA5

S-PBGA-B484

66

不合格

1.13V

1.11.2/3.32.5V

1.07V

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

622MHz

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

现场可编程门阵列

FPGA - 85K Logic Elements

85000

1.9mm

19mm

19mm

符合RoHS标准

5CSEMA5F31C6N 5CSEMA5F31C6N

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

8 Weeks

896-BGA

YES

MCU - 181, FPGA - 288

0°C~85°C TJ

Tray

2018

Cyclone® V SE

e1

活跃

3 (168 Hours)

896

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5CSEMA5

S-PBGA-B896

288

不合格

1.13V

1.11.2/3.32.5V

1.07V

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

现场可编程门阵列

FPGA - 85K Logic Elements

85000

2mm

31mm

31mm

符合RoHS标准

5CSEBA4U23I7N 5CSEBA4U23I7N

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

8 Weeks

672-FBGA

YES

MCU - 181, FPGA - 145

-40°C~100°C TJ

Tray

2018

Cyclone® V SE

e1

活跃

3 (168 Hours)

672

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

260

1.1V

0.8mm

未说明

5CSEBA4

S-PBGA-B672

145

不合格

1.13V

1.11.2/3.32.5V

1.07V

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

现场可编程门阵列

FPGA - 40K Logic Elements

40000

1.85mm

23mm

23mm

符合RoHS标准

XCZU6CG-1FFVC900E XCZU6CG-1FFVC900E

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

900-BBGA, FCBGA

204

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC CG

活跃

4 (72 Hours)

8542.31.00.01

未说明

未说明

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

ROHS3 Compliant

5CSEBA2U19C7N 5CSEBA2U19C7N

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

8 Weeks

484-FBGA

YES

MCU - 151, FPGA - 66

0°C~85°C TJ

Tray

2018

Cyclone® V SE

活跃

3 (168 Hours)

484

8542.39.00.01

BOTTOM

BALL

未说明

1.1V

0.8mm

未说明

S-PBGA-B484

66

不合格

1.13V

1.11.2/3.32.5V

1.07V

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

现场可编程门阵列

FPGA - 25K Logic Elements

25000

1.9mm

19mm

19mm

符合RoHS标准

XCZU27DR-2FFVG1517I5180 XCZU27DR-2FFVG1517I5180

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

597 I/O

- 40 C

+ 100 C

13 Mb

53160 LAB

1

FBGA-1517

SMD/SMT

850 mV

16 Transceiver

6 Core

XC7Z030-L2SBG485I XC7Z030-L2SBG485I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

Copper, Silver, Tin

表面贴装

484-FBGA, FCBGA

130

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

活跃

3 (168 Hours)

485

EAR99

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

BOTTOM

BALL

未说明

1V

0.8mm

800MHz

未说明

S-PBGA-B485

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

100 ps

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 125K Logic Cells

157200

CAN; ETHERNET; I2C; SPI; UART; USB

2.44mm

19mm

19mm

ROHS3 Compliant

M2S025TS-VFG400I M2S025TS-VFG400I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

90

207

Tray

M2S025

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

1.14 V

M2S025TS-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

Production (Last Updated: 2 months ago)

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

40

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

17 mm

17 mm

M2S050TS-1FCS325 M2S050TS-1FCS325

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

176

200

Tray

M2S050

活跃

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S025TS-FCS325 M2S025TS-FCS325

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

180

Tray

M2S025

活跃

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB