类别是'嵌入式 - 片上系统(SoC)'
嵌入式 - 片上系统(SoC) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 包装/外壳 | 供应商器件包装 | 操作温度 | 包装 | 系列 | 零件状态 | 温度系数 | 电阻 | 子类别 | 额定功率 | 电阻器类型 | 引脚数量 | 输出的数量 | 输出电压 | 工作电源电压 | 速度 | 内存大小 | 输出电流 | 核心处理器 | 周边设备 | 连接方式 | 输出功率 | 建筑学 | 产品类别 | 电阻公差 | 主要属性 | 闪光大小 | 输入电压 | 产品类别 | 转速比 | 产品长度 | 产品宽度 | |||||||||||
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XCVP1502-1LLIVSVA2785-ES9749 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 40 C | 1 | Xilinx | Xilinx | SoC FPGA | + 110 C | 50.0000 ppm/°C | 26.1 kOhm | SOC - Systems on a Chip | 0.25 W | High Reliability, MIL-PRF-55182 | 700 mV | 1 | System-On-Modules - SOM | 8.89 | ||||||||||||||||||||||||||||||
XQVC1902-1LSIVSQD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 40 C | 1 | Xilinx | Xilinx | SoC FPGA | + 110 C | 100.0000 ppm/°C | 121 Ohm | SOC - Systems on a Chip | 0.2500, 0.5000 W | 700 mV | 1 | System-On-Modules - SOM | 6.73 | |||||||||||||||||||||||||||||||
XCZU67DR-1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Xilinx | Xilinx | 1 | SOC - Systems on a Chip | SoC FPGA | 1:1 | 11.43 | 11.43 mm | |||||||||||||||||||||||||||||||||||||
XCVE1752-2MSIVSVG1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 110 C | - 40 C | 1 | Xilinx | Xilinx | SoC FPGA | AEC-Q200 | 100 ppm/K | 1.5 kOhm | SOC - Systems on a Chip | 1 W | 通用型 | 800 mV | 1 | System-On-Modules - SOM | 3.2 mm | 4.6 mm | ||||||||||||||||||||||||||||
XCVM2502-2LLEVSVC2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 C | 1 | Xilinx | Xilinx | SoC FPGA | + 110 C | 100 ppm/K | 1.6 MOhm | SOC - Systems on a Chip | 0.1 W | 通用型 | 700 mV | 1 | System-On-Modules - SOM | |||||||||||||||||||||||||||||||
XCVE2102-2HSISBVA484 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | 通孔 | + 110 C | - 40 C | 1 | Xilinx | Xilinx | SoC FPGA | DIP | -40 to 85 °C | SOC - Systems on a Chip | 6 | 1 | 24 V | 880 mV | 0.835 A | 20 W | 18 to 75 V | System-On-Modules - SOM | ||||||||||||||||||||||||||
XCVE2002-1LSISBVA484 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 40 C | 1 | Xilinx | Xilinx | SoC FPGA | + 110 C | 50.0000 ppm/°C | 5.36 kOhm | SOC - Systems on a Chip | 0.25 W | High Reliability, MIL-PRF-55182 | 700 mV | 1 | System-On-Modules - SOM | 8.89 | ||||||||||||||||||||||||||||||
XQVP1202-1MLIVSQA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 40 C | 1 | Xilinx | Xilinx | SoC FPGA | + 110 C | 200 ppm/K | 1 Ohm | SOC - Systems on a Chip | 0.0625 W | 通用型 | 800 mV | 5 | System-On-Modules - SOM | 1 | 0.5 | |||||||||||||||||||||||||||||
XCVE1752-1LSEVSVG1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 C | Xilinx | Xilinx | SoC FPGA | + 100 C | 100 ppm/K | 75 Ohm | SOC - Systems on a Chip | 1 W | 通用型 | 700 mV | 1 | System-On-Modules - SOM | 3.2 | 4.6 | ||||||||||||||||||||||||||||||
XCVE1752-1MSEVSVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 C | 1 | Xilinx | Xilinx | SoC FPGA | + 100 C | 50 ppm/°C | 4.99 kOhm | SOC - Systems on a Chip | 0.25 W | 高可靠性 | 800 mV | 0.1 | System-On-Modules - SOM | 3.2 | 1.6 | |||||||||||||||||||||||||||||
XCVE2002-2HSISFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 40 C | 1 | Xilinx | Xilinx | SoC FPGA | + 110 C | SOC - Systems on a Chip | 250 mW | Industrial | 880 mV | 1 | System-On-Modules - SOM | |||||||||||||||||||||||||||||||||
XCVE2302-2LSESFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 C | 1 | Xilinx | Xilinx | SoC FPGA | + 110 C | 100.0000 ppm/°C | 15.4 MOhm | SOC - Systems on a Chip | 0.5 W | Industrial | 700 mV | 1 | System-On-Modules - SOM | 2.29 | 6.1 | |||||||||||||||||||||||||||||
XQVP1202-1LLIVSQA2785 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 110 C | - 40 C | 1 | Xilinx | Xilinx | SoC FPGA | AEC-Q200 | 100 ppm/K | 330 kOhm | SOC - Systems on a Chip | 1 W | 通用型 | 700 mV | 1 | System-On-Modules - SOM | 6.3 mm | 3.15 mm | ||||||||||||||||||||||||||||
XQVC1802-1LLIVIQA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 40 C | 1 | Xilinx | Xilinx | SoC FPGA | + 110 C | 50.0000 ppm/°C | 137 kOhm | SOC - Systems on a Chip | 0.5 W | Industrial | 700 mV | 1 | System-On-Modules - SOM | 6.1 | ||||||||||||||||||||||||||||||
STID128-BYA | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||
AMA3B2KK-KBR | Ambiq Micro, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 108-BGA | AMA3B2KK | 108-BGA (5.3x4.3) | 74 | -40°C ~ 85°C | Tape & Reel (TR) | Apollo3 Blue Plus | 活跃 | 96MHz | 768KB | ARM? Cortex?-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | GPIO, I2C, SPI, UART/USART, USB OTG | MCU | 2MB | ||||||||||||||||||||||||||||||
AGIB027R31A2I1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | |||||||||||||||||||||||||||||||
AGIB027R31A1E1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | |||||||||||||||||||||||||||||||
AGIB022R31A1I2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | |||||||||||||||||||||||||||||||
AGFC019R31C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | |||||||||||||||||||||||||||||||
AGFC019R31C3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | |||||||||||||||||||||||||||||||
AGIB019R31B2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | |||||||||||||||||||||||||||||||
AGFB023R31C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | |||||||||||||||||||||||||||||||
AGFB023R31C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | |||||||||||||||||||||||||||||||
AGID023R18A2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements |