N/A

-

Terminal: ¼in Triple Quick-Connect, no accessories

Y

622

Tray

活跃

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD 赛灵思

BARKER MICROFARADS INC

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

Terminal: ¼in QUAD Quick Connect, w/Resistor

Y

366

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

BARKER MICROFARADS INC

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

Terminal: ¼in QUAD Quick Connect, w/Stud Can

Y

561

Tray

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

BARKER MICROFARADS INC

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

Terminal: ¼in Combos: 2, 3 or 4, Ground Lug

Y

366

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

BARKER MICROFARADS INC

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

Terminal: ¼in QUAD Quick Connect, Ground Lug

Y

366

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

BARKER MICROFARADS INC

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

Term: ¼in Solder Lug Quick-Connect, Ground Lug

Y

366

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

BARKER MICROFARADS INC

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

±3%

405uF

370VAC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXBB5D4F31C6N

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

1.13 V

5.28

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

Obsolete

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXBB5

S-PBGA-B896

250

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

250

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

31 mm

31 mm

N/A

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.15 V

未说明

1.12 V

100 °C

有

5ASXFB5G4F35I3N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.18 V

5.28

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

MCU - 208, FPGA - 385

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASXFB5

S-PBGA-B1152

540

INDUSTRIAL

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

35 mm

35 mm

N/A

-

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXMB5G4F40C6N

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

1.13 V

5.28

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

MCU - 208, FPGA - 540

0°C ~ 85°C (TJ)

Tray

SWT

e1

Obsolete

5000

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB5

S-PBGA-B1517

540

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

40 mm

40 mm

N/A

-

MCU - 208, FPGA - 385

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5ASXFB5G4F35I5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

67.8

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

BOTTOM

BALL

未说明

1 mm

compliant

5ASXFB5

S-PBGA-B1152

385

不合格

BIDIRECTIONAL

1.1,1.2/3.3,2.5 V

INDUSTRIAL

800MHz

跨压抑制二极管

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

385

17434 CLBS

2.7 mm

现场可编程门阵列

58

FPGA - 462K Logic Elements

17434

462000

93.6

--

35 mm

35 mm

N/A

-

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXBB3D4F35C6N

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

1.13 V

5.28

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

MCU - 208, FPGA - 385

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

Obsolete

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXBB3

S-PBGA-B1152

385

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

385

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

35 mm

35 mm

N/A

-

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXBB3D4F40C6N

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

1.13 V

5.27

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

MCU - 208, FPGA - 540

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

Obsolete

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXBB3

S-PBGA-B1517

540

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

40 mm

40 mm

N/A

-

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXFB3H4F40C5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

MCU - 208, FPGA - 540

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXFB3

S-PBGA-B1517

540

商业扩展

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

40 mm

40 mm

N/A

-

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

1.07 V

85 °C

5ASXBB5D6F31C6N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

0°C ~ 85°C (TJ)

Tray

Arria V SX

活跃

BOTTOM

BALL

1 mm

compliant

5ASXBB5

S-PBGA-B896

250

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

250

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

31 mm

31 mm

N/A

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.15 V

未说明

1.12 V

100 °C

有

5ASXFB3G4F35I3N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.18 V

5.28

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

MCU - 208, FPGA - 385

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASXFB3

S-PBGA-B1152

540

INDUSTRIAL

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

35 mm

35 mm

N/A

-

1517-BBGA, FCBGA

1517-FBGA (40x40)

MCU - 208, FPGA - 540

-40°C ~ 100°C (TJ)

Tray

Arria V SX

Obsolete

5ASXFB5

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 462K Logic Elements

--

N/A

-

INTEL CORP

MCU - 208, FPGA - 540

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXBB5D4F40C4N

BGA

SQUARE

生命周期结束

1.13 V

5.28

1517-BBGA

YES

1517-FBGA (40x40)

1517

Intel Corporation

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXBB5

S-PBGA-B1517

540

商业扩展

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

40 mm

40 mm

N/A

-

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

1.07 V

85 °C

5ASXMB5E6F31C6N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

0°C ~ 85°C (TJ)

Tray

Arria V SX

活跃

BOTTOM

BALL

1 mm

compliant

5ASXMB5

S-PBGA-B896

540

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

31 mm

31 mm

N/A

-

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5ASXMB3E4F31I5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB3

S-PBGA-B896

250

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

250

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

31 mm

31 mm

N/A

-

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

-40 °C

1.1 V

未说明

1.07 V

125 °C

有

5CSEBA6U23A7N

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.57

672-FBGA

YES

672-UBGA (23x23)

672

MCU - 181, FPGA - 145

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

活跃

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSEBA6

S-PBGA-B672

145

不合格

1.1,1.2/3.3,2.5 V

AUTOMOTIVE

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

FPGA - 110K Logic Elements

110000

--

23 mm

23 mm

N/A

-

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXMB3E4F31C4N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB3

S-PBGA-B896

540

商业扩展

925MHz

跨压抑制二极管

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

31 mm

31 mm

N/A

-

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXMB3G4F40C5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

MCU - 208, FPGA - 540

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB3

S-PBGA-B1517

540

商业扩展

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

40 mm

40 mm

N/A

-

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

1.07 V

85 °C

5ASXBB3D6F31C6N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

0°C ~ 85°C (TJ)

Tray

Arria V SX

活跃

BOTTOM

BALL

1 mm

compliant

5ASXBB3

S-PBGA-B896

250

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

250

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

31 mm

31 mm

N/A

-

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.1 V

未说明

1.07 V

125 °C

有

5CSEMA5F31A7N

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.55

896-BGA

YES

896-FBGA (31x31)

896

MCU - 181, FPGA - 288

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

e1

活跃

锡银铜

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

5CSEMA5

S-PBGA-B896

288

不合格

1.1,1.2/3.3,2.5 V

AUTOMOTIVE

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

2 mm

现场可编程门阵列

FPGA - 85K Logic Elements

85000

--

31 mm

31 mm

N/A

-

-55

125

矩形包装

5CSEBA5U23I7LN

Intel Corporation

活跃

INTEL CORP

5.81

WRAPAROUND

SURFACE MOUNT

CERAMIC

2

SMT

Tray

*

e3

活跃

15%

镍镀锡

0.056uF

TR, PAPER, 7 INCH

compliant

陶瓷电容器

X7R

有

0603

10

10

现场可编程门阵列

0.8

1.6

0.8