类别是'嵌入式 - 片上系统（SoC）'
嵌入式 - 片上系统（SoC） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 插入材料 | 厂商 | 操作温度 | 系列 | 连接器类型 | 类型 | 定位的数量 | 紧固类型 | 触点类型 | 方向 | 屏蔽/屏蔽 | 入口保护 | 外壳完成 | 外壳尺寸-插入 | 房屋颜色 | 注意 | 速度 | 内存大小 | 外壳尺寸，MIL | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 包括 | 主要属性 | 闪光大小 | 特征 | 材料可燃性等级 | |||||
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.png) | XCVC1502-2MLIVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 面板安装 | CTVPS00RF | 22D (97), 8 Twinax (2) | 活跃 | 478 | 1596-BFBGA, FCBGA | Flange | Circular | Composite | - | Amphenol Aerospace Operations | Bulk | -65°C ~ 200°C | MIL-DTL-38999 Series III, Tri-Start™ TV | 插座外壳 | 用于公引脚 | 99 (97 + 2 Twinax) | Threaded | Crimp | D | Shielded | 抗环境干扰 | 化学镍 | 25-7 | Silver | 不包括触点 | 600MHz, 1.4GHz | 256KB | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | Versal™ AI Core FPGA, 800k Logic Cells | - | - | - | ||
| XCZU3CG-2UBVA530E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||
| XAZU1EG-L1SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 82K Logic Cells | - | ||||||||||||||||||||||||
| XCVM1802-1LSEVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||
| XCVM1802-2MLIVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||
| XCVM1402-1LSEVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||
| XCVM1302-2LLENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||
| XCZU65DR-L2FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||
| XCVC1802-2HSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||
| XCVE1752-2LLENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||
| XCZU2EG-L1UBVA530I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||
| XCVC1502-2LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 500 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||
| XCVC1502-1LLINSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 478 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | ||||||||||||||||||||||||
| XCVM1402-2LLEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||
| XCZU2EG-2UBVA530I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | -40°C ~ 100°C (TJ) | - | 533MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||
| XCVM1802-1LSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||
| XCVM1802-2MSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||
| XCZU3CG-1UBVA530I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | -40°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||
| XCVM1302-2MLINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 316 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||
| XAZU1EG-1SFVA625Q | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | Tray | - | ||||||||||||||||||||||||||||||||||
| XCVC1502-1LSENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 478 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | ||||||||||||||||||||||||
| XCVM1402-1LLIVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||
| XCVC1902-2MSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||
| XCVM1302-1MSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 402 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||
| XCVM1802-2MLEVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - |