N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

176

MSL 3 - 168 hours

180

Tray

M2S025

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S025T-FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

592Kbit

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

60

267

Tray

M2S050

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

N/A

-

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

676-BGA

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

60

1.2000 V

1.14 V

1.26 V

267

Tray

M2S025

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

267

Tray

M2S090

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S090TS-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

90

207

Tray

M2S025

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

无

M2S025-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

17 mm

17 mm

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

24

574

Tray

M2S150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

无

M2S150TS-1FC1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

FCBGA-1152

YES

1152-FCBGA (35x35)

1152

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B1152

574

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

119

138

Tray

M2S010

活跃

VFPBGA-256

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

138

Tray

M2S025

活跃

256-LFBGA

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

1.2000 V

1.14 V

1.26 V

200

Tray

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

有

M2S050-FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

119

161

Tray

M2S005

活跃

VFPBGA-256

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Details

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

176

1.2000 V

1.26 V

180

Tray

M2S025

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

有

M2S025-FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

N/A

-

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

MSL 3 - 168 hours

209

Tray

M2S005

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

191Kbit

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

60

1.2000 V

1.14 V

1.26 V

233

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S010-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

无

M2S060T-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

387

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

1.2000 V

138

Tray

M2S025

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

有

M2S025-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

STD

FPGA - 25K Logic Modules

27696

1 Core

256KB

14 mm

14 mm

N/A

-

SMD/SMT

80 MHz

-

-

64 kB

2000 LE

161 I/O

0 C

+ 85 C

有

-

60

SmartFusion

Tray

A2F200

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

1.5 V

30

1.425 V

85 °C

无

A2F200M3F-FG484

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

N

0°C ~ 85°C (TJ)

Tray

A2F200

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

94

不合格

1.5,1.8,2.5,3.3 V

OTHER

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

200000

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

23 mm

23 mm

N/A

-

N

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

204 I/O

0 C

+ 85 C

有

-

60

SmartFusion

1.5000 V

1.425 V

1.575 V

Tray

A2F500

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

A2F500

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

N/A

-

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

204 I/O

- 40 C

+ 100 C

有

-

60

SmartFusion

1.5000 V

1.425 V

500000

500000

1.575 V

Tray

A2F500

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

1.5 V

30

1.425 V

100 °C

有

A2F500M3G-1FGG484I

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

Details

-40 to 100 °C

Tray

A2F500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

不合格

1.5 V

1.5,1.8,2.5,3.3 V

INDUSTRIAL

16.5 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

23 mm

23 mm

N/A

-

SMD/SMT

100 MHz

-

-

64 kB

2000 LE

161 I/O

- 40 C

+ 100 C

有

-

60

SmartFusion

Tray

A2F200

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

1.5 V

30

1.425 V

100 °C

有

A2F200M3F-1FGG484I

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

Details

-40°C ~ 100°C (TJ)

Tray

A2F200

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

94

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

23 mm

23 mm

N/A

-

N

SMD/SMT

80 MHz

-

-

64 kB

6000 LE

204 I/O

- 40 C

+ 100 C

有

-

60

SmartFusion

Tray

A2F500

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

A2F500

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

N/A

-

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

N/A

-

N

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

204 I/O

- 40 C

+ 100 C

有

-

60

SmartFusion

1.5000 V

1.425 V

1.575 V

Tray

A2F500

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

1.5 V

20

1.425 V

100 °C

无

A2F500M3G-1FG484I

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

A2F500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

128

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

23 mm

23 mm

N/A

-

Details

100 MHz

-

-

64 kB

6000 LE

有

-

60

SmartFusion

MCU - 41, FPGA - 128

Tray

A2F500

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

A2F500

125 °C

-55 °C

100 MHz

EBI/EMI, Ethernet, I2C, SPI, UART, USART

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB